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INHALTE

KERBESEN - Keramische Mehrlagenbauelemente für die Hochtemperatursensorik und -elektronik

Cross-section through a NTC thermistor sensor, integrated into a LTCC multilayer module

Projects aim is the development of LTCC-multilayer technology for operating temperatures between 100-250°C for high-temperature sensor and electronics applications. The investigation of the scientific base for inductive, capacitive and semiconducting sensor materials usable at these high temperatures is underpinned with the study of material interactions giving thus a guideline for the cofiring of such multi-material systems. The focus of the research at IMN MacroNano® is the development of multilayer technologies including design, simulation and manufacturing of multilayer components for high-temperature use and their integration in LTCC multilayer modules.

Sub project leader: Univ.-Prof. Dr.-Ing. Jens Müller
Research associate:  Dr.-Ing. Heike Bartsch
Project term: 01/2016 - 12/2018

Founding: Thüringer Aufbaubank

Projekt partners: Ernst-Abbe-Fachhochschule Jena, Fraunhofer IKTS Hermsdorf, LUST Hybrid-Technik, UST Sensortechnik Geschwenda, Micro-Hybrid, VIA Electronic, Tridelta Weichferrite GmbH

SACCA - System for automated cell cultivation and analysis

Subproject leader: Univ.-Prof. Dr.-Ing. Jens Müller
Research associate:  Dr.-Ing. Heike Bartsch
Project term: 01/2014 - 12/2017
Funding: Carl-Zeiss-Stiftung
Project leader:
Univ.-Prof. Dipl.-Ing. Dr. med. (habil.) Hartmut Witte, Biomechatronics Group
Project partners:
Biomechatronics Group,Technical Optics Group, Micromechanical Systems Group,
Institut für Bioprozess- und Analysemesstechnik e.V. (Heilbad Heiligenstadt)

more information

Further finished projects

KERFUNMAT (10/2009 - 09/2012)

Sencera (01/2009 - 06/2012)

SiCeram (09/2009 - 05/2012)

CorDew (09/2008 - 02/2011)

Keramis II (10/2006 - 03/2011)

N-SENS (05/2010 - 10/2011)

Optimi (10/2008 - 03/2011)

Class-S (Mobile GaN)

EASY-A

Pronano

MultiSysTeM

NanoSilKe

MUSIK - Multiphysical Synthesis and Integration of Complex RF Circuits

SiCer substrate with integrated silicon chips on the ceramic side
Development steps for the technological realization of the MUSIK demonstrator

The Research Group FOR 1522 "MUSIC" (Multi Physical synthesis and integration of complex high-frequency circuits) is funded by the DFG (first phase: 2012-2015). The Research Unit aims at including the basic functions of MEMS at high frequencies, such as amplifying, controlling, oscillating, and switching, into the design of complex radio frequency (RF) circuits. Resulting from the co-operation of researchers from different scientific disciplines, a core approach of MUSIK is the multi-physical modelling and simulation. This fundamental approach is accompanied by a substrate technology tailored to the simultaneous implementation of micro-electronic and micro-mechanic devices. As base material a novel silicon ceramic composite substrate (SiCer) is used, whose beneficial properties are studied and further developed by combining both material and technology classes.

MUSIK Phase 2

The main target in the second phase of work is the implementation of the music demonstrator on a SiCer platform with a continuous technology flow.
Similarly to the semiconductor processing of electronic components, the technology steps for the individual functional elements (switches, resonator, etc.) on SiCer are matched up so that they can be parallelly manufactured. All wiring layers for connecting the individual functional elements and the hybrid integrated CMOS modules are realized in the ceramic layer by pre- and post-processing of the SiCer substrate.

The implementation of the main target is achieved by three steps:

  1. Implementation of all RF-MEMS components on one substrate as independent RF function elements
  2. Realization of interconnected RF functional groups on one SiCer substrate
  3. Implementation of the demonstrator platform with interconnected functional groups and hybrid integrated CMOS modules

Sub project leader: Prof. Dr.-Ing. Jens Müller
Research associate: Dipl.-Ing. Michael Fischer
Project term: 01/2016 - 12/2018
Funding: DFG - German Research Foundation
Grant no.: Research group 1522
Project partners: Micromechanical Systems Group, Electronic Circuits and Systems Group, RF and Microwaves Research Group, Institute of Microelectronic and Mechatronic-Systems gGmbH, Institute of Electronics Engineering (FAU Erlangen Nürnberg)

more information

BiSWind - Bauteilintegrierte Sensorik für Kraftübertragungselemente in Windenergieanlagen

The project investigates an energy self-sufficient sensor platform. This platform is integrated on a rotating shaft and measures temperature, torque and vibrations. The measured values are wireless transmitted to a receiver module, where the data are processed. One unique feature of the platform is the integration of micro sensors and microelectronics including data transmission in a single autarchic system. The miniaturized system can operate under harsh conditions, e.g. on wind turbines. Sensor components are mounted directly on the shaft and on round-shaped circuit boards as well. For the realization it is planned to use curved multilayer modules made of Low Temperature Cofired Ceramics. The technology for such formed circuit carriers is developed during the project. It enables for the first time complex sensor integration in confined spaces under rough operation conditions. This functional expansion will open new markets for the involved partners in the future.

Sub project leader: Univ.-Prof. Dr.-Ing. Jens Müller

Research associate:  Dr.-Ing. Heike Bartsch, Dipl.-Ing. Manja Kloska

Project term: 01/2016 - 11/2018
Funding: BMWi - Bundesministerium für Wirtschaft und Energie
Project Partners: FG Mikromechanische Systeme, Schaeffler Technologie AG & Co. KG, SCHAEFFLER Engineering GmbH, Universität Bremen BIMAQ, Fraunhofer-Institut IKTS, Fraunhofer-Institut FEP, TU Dresden IFE, Micro Systems Engineering GmbH, Siegert Thinfilm Technology GmbH

KERBESEN - Keramische Mehrlagenbauelemente für die Hochtemperatursensorik und -elektronik

Cross-section through a NTC thermistor sensor, integrated into a LTCC multilayer module

Projects aim is the development of LTCC-multilayer technology for operating temperatures between 100-250°C for high-temperature sensor and electronics applications. The investigation of the scientific base for inductive, capacitive and semiconducting sensor materials usable at these high temperatures is underpinned with the study of material interactions giving thus a guideline for the cofiring of such multi-material systems. The focus of the research at IMN MacroNano® is the development of multilayer technologies including design, simulation and manufacturing of multilayer components for high-temperature use and their integration in LTCC multilayer modules.

Sub project leader: Univ.-Prof. Dr.-Ing. Jens Müller
Research associate:  Dr.-Ing. Heike Bartsch
Project term: 01/2016 - 12/2018

Founding: Thüringer Aufbaubank

Projekt partners: Ernst-Abbe-Fachhochschule Jena, Fraunhofer IKTS Hermsdorf, LUST Hybrid-Technik, UST Sensortechnik Geschwenda, Micro-Hybrid, VIA Electronic, Tridelta Weichferrite GmbH