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Conference articles

2020

Bartsch, H.;  Müller, J.; Schober, A.; Witte, H:
Thick film technology for impedance characterization
10th Workshop of Chemical and Biological Micro Laboratory Technology February 26th - 28th, 2020, Ilmenau, Elgersburg


Brauer, D.;  Xu, Y.; Klett, M.; Hampl, J.; Bartsch, H.; Schober, A.;  Zhang, Y.:
Stem cell differentiation through electrically stimulated cryogels
10th Workshop of Chemical and Biological Micro Laboratory Technology February 26th - 28th, 2020, Ilmenau, Elgersburg


Jaekel, K.; Sauni, Y.; Bartsch, H.; Riegler, S.S.; Gallino, I.; Schaaf, P.:
Reactive Ni/Al multilayers with 3D Morphologies
Materials Science and Engineering Congress (MSE) 2020, Online-Konferenz, 22. - 25.09.2020


Riegler, S.S.; Gallino, I.;  Stüber, M.;  Ivanisenko, K.; Bartsch, H.; Schaaf, P.; Busch, R.:
Thermodynamics and kinetics of phase formation in magnetron-sputtered Ni/Al multilayer thin films with nanoscale morphology
Materials Science and Engineering Congress (MSE) 2020, Online-Konferenz, 22. - 25.09.20203. 


Sauni, Y.; Wang, A.;  Ramirez, M.O.; Matthes, S.; Bartsch, H.; Schaaf, P.:
Self-propagating reaction of structured reactive Al/Ni multilayers
Materials Science and Engineering Congress (MSE) 2020, Online-Konferenz, 22. - 25.09.2020


2019

Töpfer, J.; Schulz, Th.; Capraro, B.; Bartsch, H.:
Relaxor Dielectrics for Multilayer Capacitors with Temperature-stable Permittivity Up to 250°C
MS&T19 (Material Science and Technology), September 29 to October 3, Portland, Oregon, USA,  


Schur, J.; Müller, J.:
Zirkulatoren für Ka- und Q-Band-Anwendungen mit eingebetteten Sc-substituierten Bariumhexaferriten in LTCC
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 534-536


Fischer, M; Werthes, T.; Kleinholz, C.; Müller, J.:
Aktive Kühlung unter Verwendung von Fluidkanälen in einem Silizium-Keramik-Verbundsubstrat
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin: VDE Verlag (2019), ISBN: 978-3-8007-5090-0


Bartsch, H.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
Keramische Multilagenspulen zur Anwendung in der Hochtemperaturelektronik
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 565-568


Gutzeit, N.; Schulz, A.; Fischer, M.; Thelemann, T.; Müller, J.:
Picosecond laser structuring technology for LTCC - the improvement of fine line structuring
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy; DOI: 10.23919/EMPC44848.2019.8951813


Schulz, A.; Gutzeit, N.; Müller, J.:
Laser sturctured passive components and RF filter in LTCC technology with operating frequencies up to 40 GHz focusing on 5G mobile applications
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy; doi: 10.23919/EMPC44848.2019.8951846


Fischer, M.; Werthes, T.; Kleinholz, C.; Müller, J.:
Active cooling using fluid channels in a silicon-ceramic composite substrate
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy;
DOI: 10.23919/EMPC44848.2019.8951844


Petrich, R.; Bartsch, H.; Tonisch, K.; Jaekel, K.; Barth, S.; Bartzsch, H.; Glöß, D.; Delan, A.; Krischok, St.; Strehle, S.; Hoffmann M.; Müller, J.:
Investigation of ScAlN for piezoelectric and ferroelectric applications

22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy,
DOI: 10.23919/EMPC44848.2019.8951824


Bartsch, H.; Pezoldt, J.;  Morales Sanchez, F. M.; Jimenez Rios, J.J.; Mánuel Delgado, J.M.; Breiling, J.; Müller, J.:
LTCC as substrate - enabling semiconductor and packaging integration

22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy,
DOI: 10.23919/EMPC44848.2019.8951794


Bartsch, H.; Thiele, S.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
Multilayer coils for the Use at High Temperatures

43rd IMAPS Poland Conference 2019, September 4-6, 2019, Wroclaw, Poland


Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M. A.:
Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
International Microwave Symposium (IMS), Boston, MA, USA, Jun. 2-7, 2019


Müller, J.; Kloska, M.; Schulz, A.; Gutzeit, N.; Haas, T-; Zeilmann, C.:
HDI-Technology for Harsh Environment Electronics based on LTCC Substrates
Electronics in Harsh Environments Conference, 2-4 April 2019, Park Plaza Amsterdam Airport, Netherlands


Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
Joint Conference of the IEEE International Frequency Control Symposium & European Frequency and Time Forum, Orlando, FL, USA, Apr. 14-18, 2019


Müller, J.; Pezoldt; J. Morales Sanchez, F.M.; Mánuel Delgado, J.M.; Jimenez Rios, J.J:; BartschH.:
Enabling Semiconductor and Packaging Integration
IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2019), Shanghai, China, April 16-19, 2019



2018

Chauhan, V.; Wandji, L. W.; Peng, X.; Silva Cortes, V.; Stehr, U.; Frank, A.; Fischer, M.; Weigel, R.; Hagelauer, A.:
Design and Performance of Power Amplifier Integration with BAW Filter on a Silicon-Ceramic Composite and Standard Epoxy/Glass Substrate
IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes, Ann Arbor, MI, USA, Jul. 16-18, 2018


Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
A Multi-Frequency MEMS-Based RF Oscillator Covering the Range from 11.7MHz to 1.9GHz
International Microwave Symposium (IMS), Philadelphia, Pennsylvania, USA, Jun. 10-15, 2018.


Stehr, U.; Stegner, J.; Fischer, M.; Gropp, S.; Müller, J.; Hoffmann, M.; Hein, M.A.:
Multiphysical Design of Compact RF Modules on a Silicon-Ceramics Substrate
German Microwave Conference (GeMiC), Freiburg, Germany, 12.-14. März 2018, https://doi.org/10.23919/GEMIC.2018.833503


Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
Design and Implementation of a MEMS-Based RF Oscillator on a Unique Silicon-Ceramic Composite Substrate
German Microwave Conference (GeMiC), Freiburg, Germany, 12.-14. März 2018, https://doi.org/10.23919/GEMIC.2018.8335031


Jiménez, J.J.; Mánuel, J.M.; Lacroix, B.; Santos, A.J.; Bartsch, H.; Pezoldt, J.; Breiling, J.; Müller, J.; Blanco, E.; Domínguez, M.; Alexandrov, D.; Tot, J.; Dubreuil, R.; Videkov, V.; Andreev, S.; Tzaneva, B.; García, R.; Morales, F.M.:
Progress in the optimization of low-temperature growth of III-N/LTCC heterostructures: towards multilayered ceramic-based nitrides power electronics
In: XIV Congreso Nacional de Materiales and I Iberian Meeting on Materials Science (CNMAT 2018), July 4-6 2018, Salamanca, Spain


Müller, J.; Hülsmann, M.; Gutzeit, N.; Fischer, M.:
Wafer-level re-packaging of commercial components for miniaturization and embedding
IMAPS Nordic Conference 2018, Seite 81–85, https://doi.org/10.23919/NORDPAC.2018.8423859


Uhlig, P.; Serwa, A.; Müller, J.; Gutzeit, N.; Schwanke, D.; Pohlner, J.:
LTCC resistors - the influence of production conditions on the absolute value and its reproducibility
IMAPS Nordic Conference 2018, Seite 61–66, https://doi.org/10.23919/NORDPAC.2018.8423847


Rothe, H.; Straube, A.; Fischer, R.; Stubenrauch, M.; Bartsch, H.; Witte, H.; Liefeith, K:
SACCA – Systemlösungen zur teilautomatisierten 3D-Zellkultur
19. Heiligenstädter Kolloquium, 24.9.-26.9. 2018, Heiligenstadt


2017

Fischer, M; Naber, A.; Stubenrauch, M.; Gutzeit, N.; Klett, M.; Schober, A.; Witte, H.; Müller, J.:
Keramische Mikro-Plasmaquelle für die selektive Behandlung von Zellkulturen
Proceedings MikroSystemTechnik Kongress 2017, 23.-25. Oktober 2017, München: VDE Verlag (2017), ISBN: 978-3-8007-4491-6


Fischer, R.; Stubenrauch, M.; Straube, A.; Wedrich, K.; Goj, B.; Bartsch, H.; Bichra, M.; Rothe, H.; Witte, H.:
System for automated cell cultivation and analysis
In: Engineering for a changing world/Ilmenau Scientific Colloquium, Technische Universität Ilmenau, 9.-15.11.2017, http://nbn-resolving.de/urn:nbn:de:gbv:ilm1-2017iwk-109:7


Kloska, M.; Bartsch, H.; Müller, J.; Haas, T.; Zeilmann, C.:
3-dimensionale Mehrlagenkeramik-Module
7. MikroSystemTechnik Kongress "MEMS, Mikroelektronik, Systeme", München, 24.- 25. Oktober 2017,


Bartsch, H.; Baca, M.; Fernekorn, U.; Himmerlich, M.; Müller, J.; Schober, A.; Witte, H.:
Multilayer ceramics as integration platform for sensors in vitro cell culture reactors
Biosensors and Bioelectronics Symposium, Stockholm, Schweden, 9.-12. Oktober 2017


Bartsch, H.; Stöpel, D.; Rydozs, A.; Müller, J.:
Printed heater elements for smart sensor packages in LTCC
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017, https://ieeexplore.ieee.org/document/8346841/


Stubenrauch, M.; Fischer, M.; Naber, A.; Wiegand, C.; Hipler, U.-C.; Witte, H.; Müller, J.:
Micro plasma source for the selective treatment of cell cultures
Jahrestagung der Biomedizinischen Technik und Dreiländertagung der Medizinischen Physik, Dresden, 10.-13. September 2017, doi.org/10.1515/bmt-2017-5082


Fischer, M.; Stubenrauch, M.; Naber, A.; Gutzeit, N.; Klett, M.; Singh, S.; Schober, A.; Witte, H.; Müller, J.:
LTCC-Based Micro Plasma Source for the Selective Treatment of Cell Cultures
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13.
September 2017


Fischer, M.; Wiegand, C.; Stubenrauch, M.; Naber, A.; Fink, S.; Hipler, U.-C.; Witte, H.; Müller, J.:
Keramische Mikro-Plasmaquelle für die antimikrobielle Behandlung von Oberflächen und Geweben in der Dermatologie
5. Workshop Plasmamedizin, Rostock, September 13 - 14, 2017


Schulz, A.; Goudouri, Q.M.; Kollenberg, W.; Welker, T.; Gutzeit, N.; Nikolay, D.; Kemmling, N.; Müller, J.:
3D printed ceramic structures based on LTCC: Materials, Processes and Characterizations
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017


Welker, T.; Gutzeit, N.; Müller, J.:
Enhanced Heat Spreading in LTCC Packages utilizing Thick Silver Tape in the Co-fire Process
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017


Gierasek, T.; Pietrikova, A.; Welker, T.; Müller, J.:
Influence of various micro channels integrated in LTCC multilayer module on the thermal restistance
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017


Gutzeit, N.; Schulz, A.; Welker, T.; Wagner, C.; Schäfer, E.; Müller, J.:
High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017


Uhlig, P.; Serwa, A.; Altmann, U.; Welker, T.; Müller, J.; Schwanke, D.; Pohlner, J.; Rittweg, T.:
Liquid Cooling in an LTCC-Module for a Switched Mode Amplifier
2017, IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 18.-20.06.2017, Göteborg, Schweden, doi.org/10.1109/NORDPAC.2017.7993171


Gropp, S.; Stegner, J.; Stehr, U.; Fischer, M.; Müller, J.; Hein, M.; Hoffmann, M.:
Silicium-Keramik-Verbundsubstrat für einen HF-MEMS Oszillator
MikroSystemTechnik Kongress, Munich, Germany, Oct. 23-25, 2017.

 

2016

J. Müller, N. Gutzeit, T. Welker:
Laser-Processing an grünen und gesinterten Folien
DKG-Herbstsymposium 2016 Keramische Mehrlagentechnik – Herstellverfahren und Anwendungen, 30.11.-01.12.2016, Heinrich-Lades-Halle, Erlangen


A. Pietrikova, T. Girasek, P. Lukacs, T. Welker, J.Müller:
Simulation of Cooling Methods Via Channels in LTCC Substrates for Power Electronic Devices
2nd IMAPS flash Conference, IMAPS CZ & SK (Ed.),  Brno,Czech Republic, 3. - 4. Nov., pp. 1–8, 2016


J. Müller, D. Stöpel, S. Spira, N. Gutzeit, T. Welker, S. Mathew, A. Ebert, M. Hein:
Technologies to implement complex microwave functions in LTCC for the use in communication satellites
IMAPS Poland Conference 2016, Walbzych, 25.-28.09.2016.


J. Müller, T. Hannappel, M. Hoffmann, H. O. Jacobs, Y. Lei, I. W. Rangelow, P. Schaaf:
Application of nanostructuring nanomaterials and micro-nano-integration for improved components and system's performance
Pan Pacific Microelectronics Symposium (Pan Pacific) 2016, pp. 1-10, 2016. DOI: 10.1109/PanPacific.2016.7428387


Ph. Stadie, H. Bartsch, R. Peipmann, A. Ispas, M. Baca, J. Müller, A. Bund, A. Schober, H. Witte:
Surface refinement of thick film gold electrodes for 3D MEAs using electro polymerization of PEDOT
10th International Meeting on Substrate-Integrated Microelectrode Arrays, June 28-July1, 2016, Reutlingen, Germany, Link: Abstract


J. Stegner, M. Fischer, S. Gropp, D. Podoskin, U. Stehr, J. Müller, M. Hoffmann, M. A. Hein:
Compact Low Phase-Noise MEMS-based RF Oscillator on a dedicated Silicon-Ceramic Composite Substrate
European Microwave Conference 2016 (EuMC), London, England, Oct. 3-6, 2016.


M. Fischer, S. Gropp, B. Capraro, M. Hoffmann,  J. Müller:
Silicon Ceramic Composite Substrate - an Advanced Substrate for Integrated Nano and Micro Systems
3rd International Conference & 5th International MacroNano-Colloquium on the Challenges and Perspectives of Functional Nanostructures (CPFN), Ilmenau, Deutschland, 20.-22.
Juni 2016


S. Gropp, M. Fischer, L. Dittrich, B. Capraro, J. Müller, M. Hoffmann:
Wetting behaviour of LTCC and glasses on nanostructured silicon surfaces during sintering
3rd International Conference & 5th International MacroNano-Colloquium on the Challenges and Perspectives of Functional Nanostructures (CPFN), Ilmenau, Deutschland, 20.-22. Juni 2016


T. Welker, J. Müller:
Design, Simulation and Fabrication of Liquid Cooled LTCC Devices Utilizing Integrated Channels
15th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm, Las Vegas, NV, USA, May 31 – Jun 3, pp. 830–835, 2016.
DOI:10.1109/ITHERM.2016.7517632


S. Spira, M. Schneider, T. Welker, J. Müller, M.A. Hein:
Compact Three-Dimensional Four-Way Vectorial Steering Module for Ka-Band Multiple Feeds-per-Beam Satellite Payload Applications
IEEE MTT International Microwave Symposium 2016, IMS, San Fransisco, CA, USA, May 22-27, 2016.
DOI:10.1109/MWSYM.2016.7540005


B. Müller, J. Müller:
Technological Study to Obtain Thick Conductors for Power Electronics by Screen and Stencil Printing
39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016
DOI:10.1109/ISSE.2016.7563182


V. Silva Cortes, D. Podoskin, J. Stegner, M. Fischer, S. Gropp, M. Hein, J. Mueller, M. Hoffmann, R. Weigel, G. Fischer, A. Hagelauer:
Evaluation of a Multiphysical RF MEMS Oscillator Based on LTE Receiver Performance Requirements
International Conference on Microwave, Radar and Wireless Communications (MIKON), Krakow, Poland, May 9-11, 2016.
http://dx.doi.org/10.1109/MIKON.2016.7492025


J. Stegner, U. Stehr, D. Podoskin, S.Gropp, M. Fischer, M. Hoffmann, J. Müller, M. A. Hein:
Hybrid-Integrated RF MEMS-based Reference Oscillator Using a Silicon-Ceramic Composite Substrate
German Microwave Conference 2016 (GeMiC), Bochum, Germany, Mar. 14-16, 2016.
http://dx.doi.org/10.1109/GEMIC.2016.7461629


M. Fischer, T. Welker, B. Leistritz. S. Gropp, Chr. Schäffel, M. Hoffmann, J. Müller: Investigations of Metal Systems in a Silicon Ceramic Composite Substrate for Electrical and Thermal Contacts as well as Associated Mounting Aspects
In: Proceedings IMAPS/ACerS 12th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2016), Denver, USA, April 19 - 21, 2016


S. Gropp, M. Fischer, A. Frank, Chr. Schäffel, J. Müller, M. Hoffmann:
Fabrication of an RF-MEMS-Switch on a hybrid Si-Ceramic substrate
In: Proceedings IMAPS/ACerS 12th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2016), Denver, USA, April 19 - 21, 2016


N. Gutzeit, T. Welker, K.-H. Drüe, J. Müller:
High resolution LTCC laser processing in the green and fired state for future technologies
12th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Denver, CO, USA, Apr 19-21, 2016
http://dx.doi.org/10.1109/GEMIC.2016.7461545


T. Welker, J. Müller:
Evaluierung von drucklos gesinterten Silberschichten für die Chipmontage
IMAPS Frühjahrsseminar 2016, Nürnberg, Germany, April 14, 2016.


S. Spira, M. Schneider, T. Welker, J. Müller, M. A. Hein:
Compact Three-Dimensional Four-Way Vectorial Steering Module for Satellite-Based Ka-Band Array Antenna Applications in LTCC Technology
3rd ESA Workshop on Advanced Flexible Telecom Payloads, Noordwijk, Netherlands, March 22-25, 2016
http://dx.doi.org/10.1109/MWSYM.2016.7540005


A. Schulz, N. Gutzeit, D. Stöpel, T. Welker, M. Hein, J. Müller:
High resolution patterning of LTCC based microwave structures for Q/V-band satellite applications

2016 German Microwave Conference (GeMiC ), Bochum, Germany, March 14 - 16, pp. 19–22, 2016.
http://dx.doi.org/10.1109/GEMIC.2016.7461545


S. Mathew, T. Welker, N. Gutzeit, S. Spira, R. Stephan, J. Müller, M. A. Hein:
Passive alignment of an optical fiber on a multi-layer ceramic module for radio-over-fiber applications
10th German Microwave Conference 2016, GEMIC, Bochum, Germany, March 14 - 16, pp. 1–4, 2016.
http://dx.doi.org/10.1109/GEMIC.2016.7461554

 

2015

A. Ebert, S. Kaleem, J. Müller, R. Stephan, D. Stöpel, T. Kässer, W. Konrath, M.A. Hein:
An industry-level implementation of a compact microwave diode switch matrix for flexible input multiplexing if a geo-stationary satellite payload
Microwaves Communications Antennas and Electronic Systems (COMCAS) 2015 IEEE International Conference on, pp. 1-4, 2015


R. Zeiser, S. Ayub S, P. Wagner, J. Müller, S. Henneck, J. Wilde:
Low Stress Flip-Chip Package for Pressure Sensors Operating at 500 °C
18th Conference on Solid-State Sensors, Actuators and Microsystems - Transducers, ISBN 978-1-4799-8955-3, Seiten: 1271 - 1274


S. Gropp, M. Fischer, J. Müller, M. Hoffmann:
A hybrid SiCer substrate based on direct glass-based bonding of LTCC and silicon
WaferBond´15, Braunschweig, Germany, 7.-12. Dezember 2015


H. Bartsch, K. Welker, H. Witte, J. Müller:
Integrierte NTC-Dickschichtsensoren in LTCC Fluidmodule zur Temperaturregelung in bio-zentrierten Zellhandlingsystemen
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7


H. Bartsch, K. Welker, H. Witte, J. Müller:
Integrierte NTC-Dickschichtsensoren in LTCC Fluidmodule zur Temperaturregelung in bio-zentrierten Zellhandlingsystemen
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7


J. Müller:
Status and Trends of Microelectronics and Packaging in Europe
Invited presentation, 2015 International Conference on Electronics Packaging and iMAPS  All Asia Conference (ICEP-IACC 2015), Kyoto, Japan, 14-17 April 2015.


M. Fischer, S. Gropp, J. Nowak, R. Sommer, M. Hoffmann, and J. Müller:
RF-MEMS Platform based on Silicon-Ceramic-Composite-Substrates
9th German Microwave Conference, (GeMiC), Nürnberg, Germany, 16.-18. March 2015.


S. Gropp, M. Fischer, M. Hoffmann, J. Müller, A. Frank, C. Schäffel:
Electrostatic parallel-plate MEMS Switch on Silicon-Ceramic-Composite-Substrates
9th German Microwave Conference, (GeMiC), Nürnberg, Germany, 16.-18. March 2015.


D. Podoskin, K. Brückner, M. Fischer, S. Gropp, D. Krauße, J. Nowak, M. Hoffmann, J. Müller, R. Sommer, and M. A. Hein:
Multi-Technology Design of an Integrated MEMS-based RF Oscillator Using a Novel Silicon-Ceramic Compound Substrate
9th German Microwave, Conference (GeMiC), Nürnberg, Germany, 16.-18.
March 2015.


Tilo Welker, Sabine Günschmann, Nam Gutzeit, Jens Müller:
Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process1th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Dresden, Germany, April 20-23, pp. 62–66, 2015.


Tilo Welker, Sumy Mathew, Steffen Spira, Stephan Ralf, Nam Gutzeit, Jens Müller, Matthias A. Hein:
An analog optical transmitter module with a passive aligned fiber based on a flip chip mounted VCSEL
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015.


Tilo Welker, Jens Müller, Frank Krämer, Steffen Wiese:
Electrical, Thermal and Mechanical Characterization of Low Temperature, Pressure-less Sintered Silver Bond Interfaces
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015.


Sumy Mathew, Steffen Spira, Ralf Stephan, Tilo Welker, Nam Gutzeit, Jens Müller, Matthias A. Hein:
Geometrical tolerance of optical fiber and laser diode for the passive alignment using LTCC technology
9th German Microwave Conference, GeMiC, Nürnberg, Germany, March 16-18, pp. 363–366, 2015.


Jens Müller, Tilo Welker, Alexander Schulz:
Advanced LTCC Processes for Microwave Structures and Components in LTCC
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015.


Nam Gutzeit, Tilo Welker, Michael Fischer, Jens Müller:
Thin film strain gauges on LTCC membranes for surface monitoring of high power lasers mirrors
11th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Dresden, Germany, April 20-23, 2015.


Heike Bartsch, Dirk Stöpel, Marcel Himmerlich, Martin Baca, Philipp Stadie, Jari Hyttinen, Jens Müller and Andreas Schober:
LTCC Based Multi-Electrode Arrays for In-Vitro Cell Culture
In: Proceedings of International Conference on Ceramic Interconnect & Ceramic Microsystems Technologies CICMT
April 20–23, 2015, Dresden, Germany


Heike Bartsch, Ulrike Brokmann, Boris Goj, Robert Weiss, Edda Rädlein, Jens Müller:
Sol gel thin films on LTCC ceramic multilayers enable their use as thin film substrates

In: Proceedings of 20th European Microelectronics and Packaging Conference (EMPC), September 14-16, Friedrichshafen, Germany


Nam Gutzeit, Michael Fischer, Heike Bartsch, Jens Müller:
Lapping and Polishing of Different LTCC Substrates for Thin Film Applications
In: Proceedings of 20th European Microelectronics and Packaging Conference (EMPC), September 14-16, Friedrichshafen, Germany


Heike Bartsch, Tilo Welker, Hartmut Witte, Jens Müller:
LTCC based bioreactors for cell cultivation
Invited lecture of the 39th International Microelectronic and Packaging Conference, September 20-23, Gda
ńsk, Poland


M. Fischer, D. Karolewski, T. Welker, K. Schelestow, S. Gropp, M. Hoffmann, J. Müller:
Thermisches Verhalten von SiCer – ein innovatives Verbundsubstrat für MEMS
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7


S. Gropp, M. Fischer, M. Hoffmann:
Aufbau eines HF-MEMS-Schalters in einem Silicium-Keramik-Verbundsubstrat
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7

2014

Baca, Martin; Bartsch, Heike; Porzig, Tom; Williamson, Adam; Schober, Andreas:
3D Multi Electrode Arrays
In: Proceedings of 9th International Meeting on Substrate-Integrated Microelectrode Arrays (MEA 2014), Reutlingen, Germany, July 1 - 4, 2014
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Fischer, Michael; Gropp, Sebastian; Nowak, Jacek; Capraro, Beate; Hoffmann, Martin; Müller, Jens:
RF-MEMS-Platform based on Silicon-Ceramic-Composite-Substrates

In: Proceedings IMAPS/ACerS 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014), Osaka, Japan, April 14-16, 2014


Goj, Boris; Brokmann, Ulrike; Bartsch, Heike; Rädlein, Edda; Müller, Jens:
Thin-film Capable Ceramics For Humidity and Temperature Sensing Applications
In: Proceedings 58th International Scientific Colloquium, Ilmenau, Germany, September 8-9, 2014
URN (NBN): urn:nbn:de:gbv:ilm1-2014iwk-047:3
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Goj, Boris; Bartsch, Heike; Hanitsch, Stefan; Hoffmann, Martin; Müller, Jens:
Temperatur- und Feuchtsensor basierend auf planarisierten LTCC-Oberflächen
In: GMM-Fachbericht Band 81, 5. GMM-Workshop Mikro-Nano-Integration, Ilmenau, Germany, Oktober 8-9, 2014
ISBN 978-3-8007-3632-4
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Gropp, Sebastian; Fischer, Michael; Dittrich, Lars; Capraro, Beate; Müller, Jens; Hoffmann, Martin:
Wetting behaviour of LTCC and glasses on nanostructured silicon surfaces during sintering
In: Proceedings IMAPS/ACerS 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014), Osaka, Japan, April 14-16, 2014


Günschmann, Sabine; Fischer, Michael; Müller, Jens:
Selektive Erzeugung von Nanostrukturen auf einer Waferoberfläche zur Realisierung von optischen und mechanischen Funktionen beim Aufbau eines Echtzeitölsensors

In: GMM-Fachbericht Band 81, 5. GMM-Workshop Mikro-Nano-Integration, Ilmenau, Germany, Oktober 8-9, 2014
ISBN 978-3-8007-3632-4
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Kaleem, Saqib; Rentsch, Sven; Humbla, Stefan; Stöpel, Dirk; Müller, Jens; Hein, Matthias:
Hybrid integrated ceramic microwave modules for geo-stationary communication satellites

In: Proceedings German Microwave Conference (GeMiC), Aachen, Germany, March 10-12, 2014


Kaleem, Saqib; Rentsch, Sven; Humbla, Stefan; Stöpel, Dirk; Stephan, Ralf; Müller, Jens; Hein, Matthias:
Highly integrated reconfigurable switch matrix module for geostationary satellites
In: Proceedings European Microwave conference (EuMC), Rom, Italy, October 6-9, 2014


Leopold, Steffen; Pätz, Daniel; Sinzinger, Stefan; Müller, Jens; Hoffmann, Martin:
Hybride Integration von Silicium- und LTCC Technologie zur Herstellung verstimmbarer Zylinderlinsen
In: GMM-Fachbericht Band 81, 5. GMM-Workshop Mikro-Nano-Integration, Ilmenau, Germany, Oktober 8-9, 2014
ISBN 978-3-8007-3632-4
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Müller, Jens:
Manufacturing of precise embedded resistors by a tape-on-LTCC process
In: Proceedings IMAPS/ACerS 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014), Osaka, Japan, April 14-16, 2014


Müller, Lutz; Günschmann, Sabine; Fischer, Michael; Müller, Jens; Käpplinger, Indira; Biermann, Steffen; Brode, Wolfgang; Hoffmann, Martin:
Nanostrukturen als Problemlöser – Emissionserhöhung und Interferenzvermeidung am Beispiel eines IR-basierten Fluidsensors
In: GMM-Fachbericht Band 81, 5. GMM-Workshop Mikro-Nano-Integration, Ilmenau, Germany, Oktober 8-9, 2014
ISBN 978-3-8007-3632-4
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Töpfer, J.; Löhnert, R.; Barth, S.; Capraro, B.; Bartsch, H.; Müller, J.; Schmidt, R.:
Low temperature co-fired Ca-Cu titanate multilayers for integration into LTCC modules
In: Proceedings IMAPS/ACerS 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014), Osaka, Japan, April 14-16, 2014


Welker, Tilo; Müller, Jens:
Design and fabrication of integrated fluidic channels for liquid cooling of a LTCC device
In: Proceedings IMAPS/ACerS 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2014), Osaka, Japan, April 14-16, 2014


Zeiser, Roderich; Ayub, Suleman; Berndt, Michael; Müller, Jens; Wilde, Jürgen:
Failure mode analysis and optimization of assembled high temperature pressure sensors

In: Proceedings 15th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2014), Ghent, Belgium, April 7-9 , 2014

2013

Bartsch, H.; Töpfer, J.; Löhnert, R.; Bierlich, S.; Barth, S.; Capraro, B.; Müller, J.:
Integrierte LC-Glieder in keramischen LTCC-Schaltungsträgern
In: Proceedings MikroSystemTechnik Kongress 2013, 14.-16. Oktober 2013, Aachen: VDE Verlag (2013)
ISBN 978-3-8007-3555-6
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Bieske, Björn; Schulz, Alexander:
Einfluss der Messumgebung auf die Performance des HF-Tests; Influence of the measurement settings on the performance of RF tests
In:Workshop Tests und Zuverlässigkeit (TuZ), Dresden, Germany, 24.-26. Februar 2013


Fischer, M.; Kloß, D.; Jahnke, H. G.; Müller, J.; Robitzki, A. A.:
Entwurf und Herstellung einer Mikrokavitäten-Elektroden-Matrix für das Wirkstoff-Screening an 3D-Zellkulturen
In: Proceedings IMAPS-Frühjahrsseminar: „Medizintechnik- Herausforderungen an das Packaging“, Magdeburg, Germany, März 2013


Geiling, Thomas; Dressler, Lothar; Welker, Tilo; Hoffmann, Martin:
Fine Dust Measurement with Electrical Fields - Concept of a Hybrid Particle Detector
In: Proceedings 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Orlando, FL-USA, April 23-25, 2013, 6pp


Goj, Boris; Dressler, Lothar; Hoffmann, Martin:
Non-contact biaxial nanoprobe utilized for surface measurements of MEMS
In: Proceedings TechConnect World 2013, Washington D.C.: CRC-Press, United States of America (2013)
ISBN: 978-1-4822-0579-4


Goj, Boris; Dressler, Lothar; Hoffmann, Martin:
Resonanter berührungsloser Mikrotastkopf in Silicium-Mikromechanik
In: Proceedings MikroSystemTechnik Kongress 2013, 14.-16. Oktober 2013, Aachen: VDE Verlag (2013)
ISBN 978-3-8007-3555-6
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Goj, Boris; Dressler, Lothar; Hoffmann, Martin:
Non-contact measurements of three-dimensional surfaces utilizing a miniaturized uniaxial nanoprobe
In: Proceedings 11th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII), Aachen: Apprimus Verlag, Germany (2013)
ISBN: 978-3-86359-138-0


Gutzeit, Nam; Appelfelder, Michael; Reinlein, Claudia; Fischer, Michael; Müller, Jens:
LTCC Membranen mit integrierten Heizern, Temperatur- und Dehnungssensorik
In: Proceedings MikroSystemTechnik Kongress 2013, 14.-16. Oktober 2013, Aachen: VDE Verlag (2013)
ISBN 978-3-8007-3555-6
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Günschmann, S.; Mannebach, H.; Steffensky; J.; Fischer, M.; Müller, J.
Herstellung einer mikrofluidischen Messküvette für hohe Drücke
Thüringer Werkstofftag 2013; Ilmenau, March 21, 2012


Günschmann, Sabine; Müller, Jens:
Herstellung einer Messküvette als Teil eines Messsensors für Echtzeit-Ölqualitätsmessungen
In: Proceedings MikroSystemTechnik Kongress 2013, 14.-16. Oktober 2013, Aachen: VDE Verlag (2013)
ISBN 978-3-8007-3555-6
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Günschmann, Sabine; Fischer, Michael; Müller, Jens:
Silicon-Ceramic-Silicon-Wafercompound fabricated by using nanostructured Siliconsurfaces and a ceramic with adapted thermal expansion coefficient
In: Proceedings WaferBond ’13, Conference on Waferbonding for Microsystems 3D- and Wafer Level Integration, Stockholm, Sweden, December 5-6, 2013


Leopold, Steffen; Geiling, Thomas; Fliegner, Caroline; Pätz, Daniel; Sinzinger, Stefan; Müller, Jens; Hoffmann, Martin:
Multifunctional LTCC Substrates for Thermal Actuation of Tunable Micro-Lenses Made of Aluminum Nitride Membranes
In: Proceedings 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Orlando, FL-USA, April 23-25, 2013, 7pp


Müller, Jens:
Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside a LTCC Fluidic Structure
In: Proceedings 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Orlando, FL-USA, April 23-25, 2013, 6pp


Müller, Robert; Herrmann, Ralf; Wollenschläger, Frank; Schulz, Alexander; Hein, Matthias; Thomä, Reiner S.:
A compact ECC-band horn antenna for remote monitoring of vital signs at home environments
In: Proceedings 7th European Conference on Antennas and Propagation (EUCAP), Gothenburg, Sweden, April 8-12, 2013


Schulz, Alexander; Stöpel, Dirk; Welker, Tilo; Müller, Robert; Wollenschläger, Frank; Müller, Jens:
Optimized wire-bond transitions for microwave applications up to 67 GHz using the low loss LTCC material DuPont 9k7
In: Proceedings European Microelectronics Packaging Conference (EMPC), Grenoble, France, September 9-12, 2013

2012

Bartsch, Heike; Barth, Stefan; Müller, Jens:
Embedded Ceramic Capacitors in LTCC
In: Proceedings 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Erfurt, Germany, April 16-19, 2012, 5 pp.


T. Bley, E. Pignanelli, M. Fischer, S. Günschmann, J. Müller, A. Schütze:
IR-Optical Oil Quality Sensor System for High Pressure Applications,
Proc.
Mechatronics 2012, Vol. 2, ISBN 978-3-99033-046-5, 351-358


 

Garcia-Ariza, Alexis-Paolo; Müller, Robert; Stephan, Ralf; Wollenschläger, Frank; Schulz, Alexander; Elkhouly, Mohamed; Scheytt, Christoph; Trautwein, Uwe; Müller, Jens; Thomä, Reiner S.; Hein, Matthias:
60 GHz Polarimetric MIMO Sensing
In: Training Schools 3rd MCM, EURO-COST,
IC 1004 TD(12) 03028, Barcelona, Spain, February, 8-10, 2012


Garcia-Ariza, Alexis-Paolo; Müller, Robert; Stephan, Ralf; Wollenschläger, Frank; Schulz, Alexander; Elkhouly, Mohamed; Scheytt, Christoph; Trautwein, Uwe; Müller, Jens; Thomä, Reiner S.; Hein, Matthias:
60 GHz Polarimetric MIMO Sensing: Architectures and Technology
In: Proceedings 6th Europeen Conference on Antennas and Propagation (EUCAP), Prague, Czechia, March 26-30, 2012


Fischer, Michael; Mache, Thomas; Pawlowski, B.; Schabbel, Dirk; Müller, Jens:
SiCer - A substrate to combine ceramic and silicon based micro systems
In: Proceedings 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Erfurt, Germany, April 16-19, 2012, 5 pp.


Günschmann, Sabine; Fischer, Michael; Bley, T.; Käpplinger, Indira; Brode, Wolfgang; Mannebach, H.; Müller, Jens:
Bonding of 2mm thick silicon wafers using LTCC as an intermediate layer

In: Proceedings 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Erfurt, Germany, April 16-19, 2012


Günschmann, Sabine; Fischer, Michael; Bley, T.; Käpplinger, Indira; Brode, Wolfgang; Mannebach, H.; Steffensky, J.; Müller, Jens:
Fabrication of a Si-measurement cuvette using a new multifunctional bonding method
In: Proceedings 23rd Micromechanics and Microsystems Europe Workshop, Ilmenau, Germany, September 9-12, 2012


Humbla, Stefan; Kaleem, Saqib; Müller, Jens; Rentsch, Sven; Stephan, Ralf; Stöpel, Dirk; Trabert, Johannes; Vogt, Gabor; Hein, Matthias:
On-Orbit Verification of a 4×4 Switch Matrix for Space Applications based on the Low Temperature Co-fired Ceramics Technology
In: Proceedings IEEE German Microwave Conference (GeMiC), Ilmenau, Germany, 2012


Kaleem, Saqib; Humbla, Stefan; Müller, Jens; Rentsch, Sven; Stöpel, Dirk; Hein, Matthias: Reconfigurable 4×4 Switch Matrix for Ka-band Geo-stationary satellite missions
In: Proceedings IEEE International Conference on Wireless Information Technology and Systems (ICWITS), Hawaii, USA 2012


Müller, Robert; Wollenschläger, Frank; Schulz, Alexander; Elkhouly, Mohamed; Trautwein, Uwe; Hein, Matthias; Müller, Jens; Garcia-Ariza, Alexis-Paolo; Thomä, Reiner S.:
60 GHz Ultrawideband Front-Ends with Gain Control, Phase Shifter, and Wave Guide Transition in LTCC Technology
In: Proceedings 6th Europeen Conference on Antennas and Propagation (EUCAP), Prague, Czechia, March 26-30, 2012


Schulz, Alexander; Welker, Tilo; Gutzeit, Nam; Stöpel, Dirk; Wollenschläger, Frank; Müller, Jens:
Optimized cavities for microwave applications using the new low loss LTCC material Du Pont 9k7
In: Proceedings 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Erfurt, Germany, April 16-19, 2012


Stöpel, Dirk; Drüe, Karl-Heinz; Humbla, Stefan; Mache, Thomas; Rebs, Angela; Reppe, Günter; Schulz, Alexander; Vogt, Gabor; Hein, Matthias; Müller, Jens:
Fine-Line Structuring of Microwave Components on LTCC Substrates

In: Proceedings 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Erfurt, Germany, April 16-19, 2012


Welker, Tilo; Geiling, Thomas; Bartsch, Heike; Müller, Jens
Design and fabrication of gas tight optical windows in LTCC
In: Proceedings 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Erfurt, Germany, April 16-19, 2012, 5pp.


Wollenschläger, Frank; Müller, Robert; Stephan, R.;; Garcia-Ariza, Alexis-Paolo; Schulz, Alexander; Thomä, Reiner S.:
A Wideband 60 GHz Differential Stripline-to- Waveguide Transition for Antenna Measurements in Low-temperature Co-fired Ceramics Technology
In: Proceedings 6th europeen conference on antennas and propagation, Prague, Czechia, March 26-30, 2012, 5 pp.

2011

A.P.G. Ariza, R. Müller, F. Wollenschläger, L. Xia, M. Elkhouly, S. Yaoming, U. Trautwein, R.S. Thomä
Dual-polarized architecture for channel sounding at 60 GHz with digital/analog phase control based on 0.25 µm SiGe BiCMOS and LTCC technology
Proceedings of the 5th European Conference on Antennas and Propagation (EuCAP), Rom, Italy, April 11-15, 2011, p. 1454–1458


H. Bartsch, F. Walther, R. Krümmer, T. Reimann, S. Barth, J. Müller
Characteristics of buried capacitors in LTCC multilayer packages
Smart systems integration 2011, Dresden, Germany, March 22-23, 2011, 4 pp.


M. Fischer, T. Mache, H. Bartsch, J. Müller
SiCer – An advanced substrate for 3D integrated nano and micro systems
Smart systems integration 2011, Dresden, Germany, March 22-23, 2011, 4 pp.


T. Geiling, T. Welker, H. Bartsch, J. Müller
Measurement of nitrogen monoxide levels in gas flows with a micro total analytical system based on
Proceedings of the 7th International Conference and Exhibition on Ceramic Microsystems Technologies, San Diego, California, USA, April 5-7, 2011


M. Hoffmann, H. Bartsch, M. Fischer, S. Hampl, C. Kremin, S. Leopold, J. Müller, T. Polster, M. Stubenrauch
Mikro-Nano-Integration in der Sensorik - Nanostrukturen als neue Option
10. Dresdner Sensor-Symposium, Dresden, December 5-7, 2011


M. Hoffmann, C. Kremin, M. Stubenrauch, U. Fröber, T. Polster, M. Fischer, H. Bartsch, J. Müller, S. Sinzinger, H. Witte
Integration von nanostrukturierten Materialien in mikrofluidische Systeme
7. Deutsches BioSensor Symposium, Heilbad Heiligenstadt, April 3-6, 2011, p. 25–26


J. Müller, D. Stöpel, T. Mache, A. Schulz, K.H. Drüe, S. Humbla, M. Hein
Fineline structuring on LTCC-substrates for 60 GHz line coupled filters

18th European Microelectronics and Packaging Conference, Brighton, UK, September 12-15, 2011, p. 1–5


R. Müller, A.P.G. Ariza, L. Xia, F. Wollenschläger, A. Schulz, D. Lopez-Diaz, M. Elkhouly, R.S. Thomä, M. Hein, J. Müller
60 GHz ultrawideband hybrid-integrated dual-polarized front-end in LTCC technology
Proceedings of the 5th European Conference on Antennas and Propagation (EuCAP),, Rom, Italy, April 11-15, 2011, p. 1449–1453


D. Stöpel, K.H. Drüe, S. Humbla, M. Mach, G. Reppe, A. Rebs, M. Hein, T. Mache, G. Vogt, J. Müller
Fineline Strukturierung auf LTCC-Substraten für HF-Komponenten
Deutsche IMAPS Konferenz, München, October 13-15, 2011


T. Welker
3D Integration in LTCC am Beispiel einer Mikroreaktionskammer
Deutsche IMAPS Konferenz, München, October 13-15, 2011


F. Wollenschläger, R. Stephan, L. Xia, J. Müller, A.P.G. Ariza, R.S. Thomä, M. Hein
A compact dual-polarized wideband patch antenna array for the unlicensed 60 GHz band
Proceedings of the 5th European Conference on Antennas and Propagation (EuCAP), Rom, Italy, April 11-15, 2011, p. 1873–1877


T. Welker, T. Geiling, J. Müller
3D Integration in LTCC am Beispiel einer Mikroreaktionskammer
IMAPS Konferenz München, 2011


 

 

2010

H. Bartsch, R. Grieseler, J. Müller, S. Barth, B. Pawlowski
Properties of high-k materials embedded in low temperature cofired ceramics
3rd Electronics System Integration Technologies Conference, Berlin, September 13-16, 2010, p. 1–5


H. Bartsch, J. Müller
Mechanische Eigenschaften von LTCC-Grünfolien und ihre Strukturierung durch Prägen
Thüringer Werkstofftag 2010 Proceedings des 8. Thüringer Werkstofftages, Ilmenau, Deutschland, March 24, 2010, 3 pp.


M. Fischer, H. Bartsch, B. Pawlowski, S. Barth, M. Hoffmann, J. Müller
SiCer - ein innovativer Substratwerkstoff für MEMS
Thüringer Werkstofftag 2010 Proceedings des 8. Thüringer Werkstofftages, Ilmenau, Deutschland, March 24, 2010


K. Lilienthal, M. Stubenrauch, M. Fischer, A. Schober
"Glas Gras" in Kieselglas für neue Integrationsmöglichkeiten in MEMS, MOEMS und BIOMEMS // Mikro-Nano-Integration
Mikro-Nano-Integration: Beiträge des 2. GMM-Workshops, Erfurt, 2010


J. Müller, M. Fischer, H. Bartsch
Advantages of a new Wafer Level Integration Concept Based on Direct Bonded Silicon on LTCC
Pan Pacific Microelectronics Symposium, Kuaii, Hawaii, January 26-28, 2010


D. Stöpel, K.H. Drüe, S. Humbla, M. Mach, T. Mache, A. Rebs, G. Reppe, G. Vogt, M. Hein, J. Müller
Fine-line structuring of microwave components on LTCC substrates
3rd Electronics System Integration Technologies Conference, Berlin, September 13-16, 2010, p. 1–6

2009

M. Fischer, H. Bartsch, M. Hoffmann, J. Müller, B. Pawlowski, S. Barth
Silizium-Keramik-Verbundsubstrat eine neue Plattform für die Mikro-Nano-Integration
Beiträge des 1. GMM-Workshops Mikro-Nano-Integration // Mikro-Nano-Integration, Seeheim, Germany, March 12-13, 2009


S. Humbla, J. Müller, R. Stephan, D. Stöpel, J.F. Trabert, G. Vogt, M. Hein
LTCC Ka-Band Switch Matrix Experiment for On-Orbit Verification
Proceedings of the 42nd International Symposium on Microelectronics, San Jose, California, USA, November 1 - 5, 2009


S. Humbla, R. Stephan, D. Stöpel, J.F. Trabert, G. Vogt, M. Hein
Reconfigurable Ka-Band Switch Matrix for On-Orbit Verification
Proceedings of the 39th European Microwave Conference, Rome, Italy, Sept. 29 - Oct. 1, 2009


R. Perrone, P. Kapitanova, D. Kholodnyak, I. Vendik, M. Hein, J. Müller
Miniaturisation of a LTCC high-frequency rat-race-ring by using 3-dimensional integrated passives and embedded high-k capacitors
17 th European Microelectronics and Packaging Conference, Rimini, Italy, June 15-18, 2009, p. 1–6


A. Schulz, S. Rentsch, J. Müller
Breitbandige LGA-Übergänge von Leiterplatte zu LTCC für Frequenzen bis 67 GHz
Proceedings / Mikrosystemtechnik-Kongress 2009, Berlin, October 12-16, 2009


M. Stubenrauch, U. Fröber, M. Fischer, C. Kremin, H. Witte, M. Hoffmann
Klebe- und klemmfreies Anschlusskonzept für mikrofluidische Systeme mittels nanostrukturierter Oberflächen
Beiträge des 1. GMM-Workshops Mikro-Nano-Integration // Mikro-Nano-Integration, Seeheim, Germany, March 12-13, 2009


M. Stubenrauch, M. Schwandt, S. Hecht, C. Kremin, M. Fischer, M. Hoffmann
Zuverlässigkeitsaspekte bei Nanoklettverschlüssen
Beiträge des 1. GMM-Workshops Mikro-Nano-Integration // Mikro-Nano-Integration, Seeheim, Germany, March 12-13, 2009


G. Vogt, K.H. Drüe, S. Humbla, J. Müller, R. Stephan, D. Stöpel, J.F. Trabert, M. Hein
Efficient Design of Multilayer Microwave Modules using an Element-Wise Simulation Technique
German Microwave Conference, 2009 // GeMiC 2009, München, March 16-18, 2009, p. 1–4

2008

H. Bartsch, R. Gade, A. Albrecht, M. Hoffmann
Systematic characterisation of embossing processes for LTCC-tapes
IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Munich, Germany, April 21-24, 2008


H. Bartsch, C. Rensch, T. Thelemann, J. Müller, M. Hoffmann
Fully Integrated Bridge-type Anemometer in LTCC-based Microfluidic Systems
3rd international Conference "Smart Materials Structures Systems", Acireale,Italy, June 8-13, 2008


M. Fischer, H. Bartsch, B. Pawlowski, R. Gade, S. Barth, M. Mach, M. Stubenrauch, M. Hoffmann, J. Müller
Silicon on ceramics - a new integration concept for silicon devices to LTCC
IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Munich, Germany, April 21-24, 2008


M. Fischer, H. Bartsch, B. Pawlowski, M. Mach, R. Gade, S. Barth, M. Hoffmann, J. Müller
Silicon on ceramics - a new concept for micro-nano-integration on wafer level
NSTI Bio Nano Conference and Trade Show, Boston, June 1 - 5, 2008


M. Fischer, M. Klett, U. Fernekorn, C. Augspurger, A. Schober
MEMS based examination platform for a neuro-muscular communication in a co-culture system coupled to a multi-electrode-array
NSTI Bio Nano Conference and Trade Show, Boston, June 1 - 5, 2008


T. Geiling, H. Bartsch, R. Perrone, J. Müller, M. Hoffmann
Coil Design for a Low-loss Inductive Proximity Sensor in LTCC
6th Ibero-American Congress on Sensors, Sao Paolo, Brasilien, November 24-26, 2008


G.A. Groß, L. Abahmane, T. Thelemann, M. Fischer, M. Köhler
Macrocycle synthesis at short residence times resorcinarene synthesis in a ceramic micro reactor
1st Syntop smart Synthesis and technolgies for organic processes, Potsdam, June 11-13, 2008


S. Humbla, K.H. Drüe, R. Stephan, D. Stöpel, J.F. Trabert, G. Vogt, M. Hein
Qualification of a compact Ka-Band Switch Matrix for On-Orbit-Verification
Proceedings of the German Microwave Conference 2008, Hamburg 2008, p. 1–4


R. Perrone, H. Bartsch, M. Hoffmann, M. Mach, J. Müller
Filling methods for embossed low resistance fine line coils in LTCC
Proceedings of the 41st Annual International Symposium on Microelectronics, Providence, Rhode Island, USA, November 2 - 6, 2008

2007

H. Bartsch, M. Fischer, M. Klett, C. Augspurger, A. Schober, M. Hoffmann
Funktionskeramiken für biotechnologische Anwendungen
Thüringer Grenz- und Oberflächentage und 6. Thüringer Biomaterial-Kolloquium, Erfurt, September 12-13, 2007, p. 333–334


M. Fischer, H. Bartsch, M. Stubenrauch, J. Müller, M. Hoffmann
Bonding of LTCC and silicon substrates using adapted Black Silicon
Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration // Halle/Saale, Halle/Saale, December 9-11, 2007, p. 62–64


M. Fischer, M. Stubenrauch, M. Hintz, M. Hoffmann, J. Müller
Bonding of ceramic and silicon new options and applications
Smart system integration 2007, Paris, France, March 27-28, 2007, S. 477-480


G.A. Groß, L. Abahmane, T. Thelemann, M. Fischer, M. Hintz, D. Bošković, M. Günther, M. Köhler
Optical and electrochemical residence time-characterization of LTCC flow-through microreactors
Conference proceedings of American Institute of Chemical Engineers, Houston,Texas, April 22-27, 2007


M. Stubenrauch, M. Fischer, C. Kremin, A. Albrecht, M. Hoffmann
Black silicon as a smart structure for the bonding of polymers with silicon
Smart system integration 2007, Paris, France, March 27-28, 2007, p. 161-166


M. Stubenrauch, M. Fischer, C. Kremin, K. Lilienthal, U. Fröber, D. Voges, H. Witte, M. Hoffmann
´Black Silicon´ - einstellbare Nanostrukturen mit neuen Applikationsfeldern
Thüringer Grenz- und Oberflächentage und 6. Thüringer Biomaterial-Kolloquium, Erfurt, September 12- 13, 2007, p. 220–221

2006

J. Burgold, F. Weise, A. Schober, G. Kittler, B. Lübbers, V. Cimalla, M. Fischer, A. Spitznas, M. Gebinoga, I. Cimalla, V. Yanev
Eine neue Klasse von Sensoren für mikro- und nanofluidische Systeme für biotechnologische Anwendungen
3. Workshop Chemische und Biologische Mikrolabortechnik// Abstracts, Ilmenau, February, 21-23, 2006 


G.A. Groß, M. Günther, M. Hintz, T. Thelemann, M. Fischer, H. Bartsch
LTCC technology for microreaction devices
9th International Conference on Microreactor Technology IMRET 9, Potsdam, Potsdam, September 6-8, 2006 


G.A. Groß, T. Thelemann, M. Fischer, M. Köhler
Modular microreactor system based on low temperature cofired ceramic (LTCC) devices
6th Anque International congress of chemistry// Chemistry and sustainable development (Puerto del la Cruz, Tenerife (Spain), 5-7th December 2006,, Puerto del la Cruz,Tenerife, Spain, December 5-7, 2006 


M. Stubenrauch, M. Fischer, M. Bernasch, J. Bagdahn
Room temperature bonding of nanostructured silicon wafers and mechanical characterization
2nd International Workshop on Wafer Bonding for MEMS Technologies, Halle/Saale,Germany, April, 9-11, 2006, p. 37–38 


A. Albrecht, M. Fischer, C. Kremin, O.J.O. Nagel, M. Stubenrauch, H. Wurmus
Room temperature bonding for MEMS using black silicon
Micro-system technologies 2005, München, October 5-6, 2005, p. 111–117 


M. Fischer, M. Stubenrauch, Th. Kups, H. Romanus, F.M. Morales, G. Ecke, M. Hoffmann, C. Knedlik, O. Ambacher and J. Pezoldt
Self organization and properties of Black Silicon
51st IWK -- Internat. Wissenschaftliches Kolloquium, September 11 - 15, 2006, TU Ilmenau


M. Fischer, T. Thelemann, M. Stubenrauch
LTCC Interconnects In Different Scales
1st MacroNano® Kolloquium, November 29 - 30, 2006, TU Ilmenau