Jaziri, N.; Boughamoura, A.; Müller, J.; Mezghani, B.; Tounsi, F.;  Ismail, M:
A compreshensive review of Thermoelectric Generators: Technologies and common applications
in Elsevier Energy Reports; 24. Dezember 2019, https://doi.org/10.1016/j.egyr.2019.12.011

Jaziri, N.; Boughamoura, A.; Müller, J.; Tounsi, F.; Mezghani, B.; Kouki, A.:
TCs Connectivities Effect Investigation in the LTCC-based Thermoelectric Generator for Automotive Waste Heat Recovery
IEEE Xplore digital library, 28. November 2019, doi: 10.1109/DTSS.2019.8914830

Bartsch, H.; Peipmann, R.; Himmerlich, M.; Müller, J.; Bund, A.; Witte, H.:
PEDOT coating applied on thick film gold electrodes for increased miniaturization capability
Progress in Organic Coatings, 10.1016/j.porgcoat.2019.06.023

Bartsch, H.; Peipmann, R.; Himmerlich, M.; Frant, M.; Rothe, H.; Liefeith, K.; Witte, H.:
Surface properties and biocompatibility of thick film materials used in ceramic bioreactors
in Elsevier Materialia, 16. Januar 2019, https://doi.org/10.1016/j.mtla.2019.100213

Jimenez, J.J.; Manuel, J.M.; Bartsch, H.; Breiling, J.; Garcia, R.; Jacobs, H.O.; Müller, J.; Pezoldt, J.; Morales F.M.:
Comprehensive (S)TEM characterization of polycrystalline GaN/AlN layers grown on LTCC substrates
in Elsevier Ceramics International, 2. Februar 2019, https://doi.org/10.1016/j.ceramint.2019.01.250

Fischer, M.; Gropp, S.; Stegner, J.; Frank, A.; Hoffmann, H.; Mueller, J.:
Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration
In: IEEE Microwave Magazine 20 (2019), S. 28-43,  ISSN: 1527-3342, DOI: 0.1109/MMM.2019.2928675

Stegner, J.; Fischer, M.; Gropp,  S.; Stehr, U.; Hein, M.A.:
MEMS-Based RF Oscillators Using SiCer Technology: New Integration, Packaging, and Assembly Concepts
In: IEEE Microwave Magazine 20 (2019), S. 71-85, ISSN: 1527-3342, DOI:10.1109/MMM.2019.2928678

Welker, T.:
Methoden und Technologien zur Optimierung der Entwärmung aktiver und passiver Komponenten auf keramischen Mehrlagensubstraten
Dissertation, Technische Universität Ilmenau, 2018, ISBN 9-78-3-86360-182-9

Bartsch, H.; Peipmann, R.; Klett, M; Brauer, D.; Schober, A.; Müller, J.:
PEDOT Coated Thick Film Electrodes for In Situ Detection of Cell Adhesion in Cell Cultures
Biosensors 2018, 8(4), 105; doi: 10.3390/bios8040105

Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.:
A multi-frequency MEMS-based RF oscillator covering the range from 11.7 MHz to 1.9 GHz
Proceedings of the 2018 IEEE 2018, Seite 575–578, https://doi.org/10.1109/MWSYM.2018.8439449

Yuan, Q.; Döll, J.; Romanus, H.; Wang, H.; Bartsch, H.; Albrecht, A.; Hoffmann, M.; Schaaf, P.; Wang, D.:
Surface-nanostructured Al-AlN composite thin films with excellent broad-band antireflection properties fabricated by limited reactive sputtering
in ACS applied nano materials, Jg. 1, 2018, Heft 3, Seite 1124–1130, https://doi.org/10.1021/acsanm.7b00302

Bartsch, H.; Baca, M.; Fernekorn, U.; Müller, J.; Schober, A.; Witte, H.:
Functionalized Thick Film Impedance Sensors for Use in In Vitro Cell Culture
Biosensors 2018, 8(2), 37; doi: 10.3390/bios8020037

Manuel, J.M.; Jimenez, J.J.; Morales, F.M.; Lacroix, B.; Santos, A.J.; Garcia, R., Blanco, E.; Dominquez, M.; Ramirez, M.; Beltran, A.M.; Alexandov, D.; Tot, J.; Dubreuil, R.; Videkov, V.; Andreev, S.; Tzaneva, B.; Bartsch, H., Breiling, J.; Pezoldt, J.; Fischer, M.; Müller, J.:
Engineering of III-Nitride Semiconductors on Low Temperature Co-fired Ceramics
Nature Scientific Reports, volume 8, Article number: 6879(2018),  doi:10.1038/s41598-018-25416-6

Bartsch, H.; Baca, M.; Fernekorn, U.; Himmerlich, M.; Müller, J.; Schober, A.; Witte H.:
Multilayer ceramics as integration platform for sensors in in-vitro cell culture reactors
Advanced Materials Letters 2018, 9(11), 748-752, doi:10.5185/amlett.2018.2090

Bartsch, H.; Grieseler, R.; Mánuel, J.; Pezoldt, J.; Müller; J.:
Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates
Coatings 2018, 8(8), 289; https://doi.org/10.3390/coatings8080289
http://www.mdpi.com/2079-6412/8/8/289

Stöpel, D.:
Integration metallorganischer Resinatpasten in niedrigsinternde Mehrlagenkeramiksysteme

Dissertation, TU Ilmenau, Signatur ELT ZN 4152 S872

Alexandrov, D.; Tot, J.; Dubreuil, R.; Morales, F.; Manuel, J.; Jimenez, J.; Lacroix, B; Garcia, R.; Videkov, V.; Andreev, S.; Tzaneva, B.; Bartsch, H.; Pezoldt, J.; Fischer, M.; Müller, J.:
Low temperature epitaxial deposition of GaN on LTCC substrates
2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), pages 48 - 54.

Bartsch, H.; Mánuel, J.M.; Grieseler, R.:
Influence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers
Technologies 2017, 5, 79.
http://www.mdpi.com/2227-7080/5/4/79

Girasek, T.; Pietrikova, A.; Welker, T.; Müller, J.:
Simulation of Heat Transfer by Cooling Channels in LTCC Substrate
Acta Electrotechnica et Informationca, Vol. 17, No.2, pp. 11-15, 2017

Pietrikova, A.; Girasek, T.; Lukacs, P.; Welker, T.; Müller, J.:
Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
Journal of electrical engineering, Band 68, Heft 2, S. 132–137, https://doi.org/10.1515/jee-2017-0018

Jahnke, H.G.; Krinke, D.; Seidel, D.; Lilienthal, K.; Schmidt, S.; Azendorf, R.; Fischer, M.; Mack, T.; Striggow, F.; Althaus, H.; Schober, A.; Robitzki,  A.A:
A novel 384-multiwell microelectrode array for the impedimetric monitoring of Tau protein induced neurodegenerative processes  
Biosens Bioelectron 88:78-84, DOI:10.1016/j.bios.2016.07.074

Bartsch, H.; Schulz, A.; Müller, J.; Ebert, A.; Spira, St.; Wollenschläger, F.; Hein, M.:
Applications of microwave dielectrics
Microwave materials and applications; Volume 2; Hoboken, NJ: Wiley, 2017, Seite 653-682,
ISBN 978-1-119-20852-5

Silva Cortes, V.; Podoskin, D.; Stegner, J.; Fischer, M.; Gropp, S.; Hein, M. et al.:
Evaluation of a multiphysical RF MEMS oscillator based on LTE receiver performance requirements
MIKON2016, IEEE Xplore digital library
http://dx.doi.org/10.1109/MIKON.2016.7492025

Rydosz, A.; Maziarz, W.; Pisarkiewicz, T.; Bartsch, H.; Müller, J.:
Thermal and Electrical Investigation on LTCC Gas Sensor Substrates
International Journal of Information and Electronics Engineering, Vol. 6, No. 3, May 2016, pp. 143-146
DOI: 10.18178/ijiee.2016.6.3.612

Bartsch, H.; Welker, T.; Welker, K.; Witte, H.; Müller, J.:
LTCC based bioreactors for cell cultivation
IOP Conf. Ser.: Mater. Sci. Eng. 104 012001
Open access:http://iopscience.iop.org/article/10.1088/1757-899X/104/1/012001/pdf

Bierlich, S.; Reimann, T.; Barth, St.; Capraro, B.; Bartsch, H.; Müller, J.; Töpfer, J.:
Integration of High-Frequency M-Type Hexagonal Ferrite Inductors in LTCC Multilayer Modules
Int. J. Appl. Ceram. Technol. 13 [3] 540-548 (2016)
DOI:10.1111/ijac.12512

Turgaliev, V.M; Kholodnyak, D.; Müller, J.; Hein, M.A.:
Small-Size Low-Loss Bandpass Filters on Substrate-Integrated Waveguide Capacitively Loaded Cavities Embedded in Low Temperature Co-Fired Ceramics
Journal of Ceramic Sciens and Technology, vol. 06, no.4, pp. 305-314, 2015.
DOI: 10.4416/JCST2015-0053

Welker, Tilo; Günschmann, Sabine; Gutzeit, Nam; Müller, Jens:
Design, Fabrication and Characterization of Heat Spreaders in Low-Temperature Co-Fired Ceramic (LTCC) utilizing Thick Silver Tape in the Co-Fire Process
Journal of Ceramic Science and Technology, vol. 6, no. 4, pp. 301–304, 2015.
DOI: 10.4416/JCST2015-00042

Bierlich, Silvia; Reimann, Timmy; Barth, Stefan; Capraro, Beate; Bartsch, Heike; Müller, Jens; Töpfer, Jörg:
Integration of High-Frequency M-Type Hexagonal Ferrite Inductors in LTCC Multilayer Modules
Int. J. Appl. Ceram. Technol. 1–9 (2015)
DOI:10.1111/ijac.12512

Löhnert, Romy; Capraro, Beate; Barth, Stefan; Bartsch, Heike; Müller, Jens; Töpfer, Jörg:
Integration of CaCu₃Ti₄O₁₂ capacitors into LTCC multilayer modules
Journal of the European Ceramic Society 35 (2015) 3043–3049

Bartsch, Heike; Himmerlich, Marcel; Fischer, Michael; Demkó, Laszlo;  Hyttinen, Jari; Schober, Andreas:
LTCC-Based Multi-Electrode Arrays for 3D in Vitro Cell Cultures
J. Ceram. Sci. Tech., 06 [04] 315-324 (2015) DOI: 10.4416/JCST2015-00056
available online at: http://www.ceramic-science.com/articles/all-articles.html?article_id=100416

Jurków, D.;  Maeder, Th.; Dąbrowski, A.; Zarnik, M.; Belavič, D.; Bartsch, H.; Müller, J.:
Overview on low temperature co-fired ceramic sensors
Sensors and Actuators A 233 (2015) 125–146, http://doi.org/10.1016/j.sna.2015.05.023 

Bierlich, Silvia; Reimann, Timmy; Bartsch, Heike; Töpfer, Jörg:
Co/Ti-substituted M-type hexagonal ferrites for high-frequency multilayer inductors
In: Journal of the Magnetism and Magnetic Materials 384 (Elsevier), issue 15, p. 1-5, 2015
DOI: 10.1016/j.jmmm.2015.02.009

Fischer, Michael; Gropp, Sebastian; Nowak, J.; Capraro, B.; Sommer, R.; Hoffmann, Martin; Müller, Jens:
Radio Frequency Microelectromechanical System-Platform Based on Silicon-Ceramic Composite Substrates
In: IMAPS - Journal of Microelectronics and Electronic Packaging, Vol.12, pp. 37-42, 2015
DOI: 10.4071/imaps.442

Günschmann, Sabine; Fischer, Michael; Mannebach,·H.; Steffensky, J.; Müller, Jens:
Silicon–ceramic–silicon‑wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficient
In: Microsystem Technologies, Springer-Verlag Berlin Heidelberg, 2015
DOI: 10.1007/s00542-015-2434-6 

Löhnert, Romy; Bartsch, Heike; Schmidt, Rainer; Capraro, Beate; Töpfer, Jörg:
Microstructure and Electric Properties of CaCu3Ti4O12 Multilayer Capacitors
In: Journal of the American Ceramic Society 98, issue 1, p. 141–147, 2015
DOI: 10.1111/jace.13260

Gropp, Sebastian; Fischer, Michael; Dittrich, Lars; Capraro, Beate; Müller, Jens; Hoffmann, Martin:
Wetting behaviour of glasses on nanostructured silicon surfaces
In: Journal of Electrical Engineering Volume 3, Number 1, January 2015 (Serial Number 7)
DOI:10.17265/2328-2223/2015.01.002 http://www.davidpublisher.org/Home/Journal/JEE

Goj, Boris; Dressler, Lothar; Hoffmann, Martin:
Semi-contact measurements of three-dimensional surfaces utilizing a resonant uniaxial microprobe
In: Journal of Measurement Science and Technology 25, 064012, 2014
DOI: 10.1088/0957-0233/25/6/064012

Müller, Jens:
Wide Band Measurement of Dielectric Properties of Electronic Assembly Materials Inside an LTCC Fluidic Structure
In: Journal of Microelectronics and Electronic Packaging 11, p. 64-69, 2014
DOI: 10.4071/imaps40

Töpfer, J.; Hesse, J.; Bierlich, S.; Barth, S.; Capraro, B.; Rabe, T.; Nagib-Zadeh, H.; Bartsch, H.:
Integration of Ni-Cu-Zn and hexagonal ferrites into LTCC modules: cofiring strategies and magnetic properties
In: Journal of the Japan Society Powder of Powder Metallurgy 61, No. S1, p. 214-217, 2014
DOI: 10.2497/jjspm.61.S214

Garcia-Ariza, Alexis-Paolo; Müller, Robert; Wollenschläger, Frank; Schulz, Alexander; Elkhouly, Mohamed; Sun, Yaoming; Glisic, Srdjan; Trautwein, Uwe; Stephan, Ralf; Müller, Jens; Thomä, Reiner S.; Hein, Matthias:
60 GHz Ultrawideband Polarimetric MIMO Sensing for Wireless Multi-gigabit and Radar
In: IEEE Transactions on Antennas & Propagation 61 (2013), no. 4, p. 1631-1641
DOI: 10.1109/TAP.2013.2243398

Goj, Boris; Dressler, Lothar; Hoffmann, Martin:
Resonant probing system comprising a high accurate uniaxial nanoprobe and a new evaluation unit
In: Journal of Micromechanics and Microengineering 23 (2013) 095012
DOI: 0960-1317/23/095012

Goj, Boris; Dressler, Lothar; Hoffmann, Martin:
Resonant Biaxial Nanoprobe Utilized for Non-Contact Surface Measurements
In: Sensors & Transducers Journal 157 (2013), no. 10, p. 392-399
ISSN 1726- 5479
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Gutzeit, Nam; Müller, Jens; Reinlein, Claudia; Gebhardt, Sylvia
Manufacturing and Characterization of a Deformable Membrane with Integrated Temperature Sensors and Heating Structures in Low Temperature Co-fired Ceramics
In: International Journal of Applied Ceramic Technology 10 (2013), no. 3, p.435-442
DOI: 10.1111/ijac.12037

Piekarz, Ilona; Sorocki, Jakub; Wincza, Krzysztof; Gruszczynski, Slawomir; Müller, Jens; Welker, Tilo:
Miniaturized quasi-lumped coupled-line single-section directional coupler designed in multilayer LTCC technology
In: Microwave and Optical Technology Letters 55 (2013), no. 6, p. 1401-1405
DOI: 10.1002/mop.27582

Reimann, Timmy; Töpfer, Jörg; Barth, Stefan; Bartsch, Heike; Müller, Jens:
Low-Temperature Sintered NTC Thermistor Ceramics for Thick-Film Temperature Sensors
In: International Journal of Applied Ceramic Technology 10 (2013), no. 3, p. 428-434
DOI: 10.1111/ijac.12045

Rydosz, A.; Maziarz, W.; Pisarkiewicz, T.; Bartsch, H.; Mueller, J.:
A Micropreconcentrator Design Using Low Temperature Cofired Ceramics Technology for Acetone Detection Applications
In: IEEE - Sensors Journal13 (2013), no. 5, p. 1889-1896
DOI: 10.1109/JSEN.2013.2245888

Welker, Tilo; Geiling, Thomas; Bartsch, Heike; Müller, Jens:
Design and Fabrication of Transparent and Gas-Tight Optical Windows in Low-Temperature Co-Fired Ceramics
In: International Journal of Applied Ceramic Technology 10 (2013), no. 3, p. 405-412
DOI: 10.1111/ijac.12034

Bartsch, Heike; Albrecht, Arne; Hoffmann, Martin; Müller, Jens:
Microforming process for embossing of LTCC tapes
In: Journal of Micromechanics and Microengineering 22, 015004, 2012
DOI: 10.1088/0960-1317/22/1/015004

Bartsch, Heike; Geiling, Thomas; Müller, Jens:
A LTCC low-loss inductive proximity sensor for harsh environments
In: Sensors and Actuators A: Physical 175, p. 28–34, 2012
DOI: 10.1016/j.sna.2011.12.015

Geiling, Thomas; Welker, Tilo; Bartsch, Heike; Müller; Jens:
Design and Fabrication of a Nitrogen Monoxide Measurement Device Based on Low Temperature Co-Fired Ceramics
In: International Journal of Applied Ceramic Technology 9, p. 37‐44, 2012
DOI: 10.1111/j.1744-7402.2011.00694.x

Grieseler, Rolf; Welker, Tilo; Müller, Jens; Schaaf, Peter:
Bonding of low temperature co-fired ceramics to copper and to ceramic blocks by reactive aluminum/nickel multilayers
In: Physica status solidi (a) 209, p. 512‐518, 2012
DOI: 10.1002/pssa.201127470

Humbla, Stefan; Kaleem, Saqib; Müller, Jens; Rentsch, Sven; Stephan, Ralf; Stöpel, Dirk; Vogt, Gabor; Hein, Matthias:
On-Orbit Verification of a 4×4 Switch Matrix for Space Applications based on the Low Temperature Co-fired Ceramics Technology
In: Journal of RF Engineering and Telecommunications 66, issue 11-12, pp. 355–362, 2012
DOI: 10.1515/freq-2012-0106

Kaleem, Saqib; Humbla, Stefan; Rentsch, Sven; Stöpel, Dirk; Hein, Matthias:
Reconfigurable 4×4 switch matrix for Ka-Band Geostationary satellite mission
In: Journal of RF Engineering and Telecommunications 66, issue 11-12, pp. 347–354, 2012
DOI: 10.1515/freq-2012-0105

Schulz, Alexander; Rentsch, Sven; Xia, L.; Müller, Robert; Müller, Jens:
A Low-Loss Fully Embedded Stripline Parallel Coupled BPF for Applications using the 60 GHz Band
In: International Journal of Applied Ceramic Technology 9, p. 1–6, 2012
DOI: 10.1111/j.1744-7402.2011.02738.x

Pezoldt, Jörg; Kups, Thomas; Stubenrauch, Mike; Fischer, Michael:
Black luminescent silicon
In: Physica status solidi (c) 8, p. 1021‐1026, 2011
DOI: 10.1002/pssc.201000388

H. Bartsch, C. Rensch, M. Fischer, A. Schober, M. Hoffmann, J. Müller
Thick film flow sensor for biological microsystems
Sensors and Actuators A: Physical 160 (2010), p. 109–115 

H. Hoppe, J. Bachmann, B. Muhsin, K.H. Drüe, I. Riedel, G. Gobsch, C. Buerhop-Lutz, C.J. Brabec, V. Dyakonov
Quality control of polymer solar modules by lock-in thermography
J. Appl. Phys 107 (2010), 14505

K. Lilienthal, M. Fischer, M. Stubenrauch, A. Schober
Self-organized nanostructures in silicon and glass for MEMS, MOEMS and BioMEMS
Materials Science and Engineering: B 169 (2010), p. 78–84

K. Lilienthal, M. Stubenrauch, M. Fischer, A. Schober
Fused silica ‘glass grass’: fabrication and utilization
J. Micromech. Microeng.20 (2010), 25017

M. Fischer, H. Bartsch, B. Pawlowski, R. Gade, S. Barth, M. Mach, M. Stubenrauch, M. Hoffmann, J. Müller
Silicon on Ceramics - A New Integration Concept for Silicon Devices to LTCC
Journal of microelectronics and electronic packaging (2009), p. 1–5

R. Kulke, G. Möllenbeck, C. Günner, P. Uhlig, K.H. Drüe, S. Humbla, J. Müller, R. Stephan, D. Stöpel, J.F. Trabert, G. Vogt, M. Hein, A. Molke, T. Baras, A.F. Jacob, D. Schwanke, J. Pohlner, A. Schwarz, G. Reppe
Ceramic Microwave Circuits for Satellite Communication
Journal of microelectronics and electronic packaging 6 (2009), p. 27–31

B. Muhsin, J. Renz, K.H. Drüe, G. Gobsch, H. Hoppe
Influence of polymer solar cell geometry on series resistance and device efficiency
Phys. Status Solidi (a) 206 (2009), p. 2771–2774

R. Perrone, H. Bartsch, M. Hoffmann, M. Mach, J. Müller
Miniaturized Embossed Low Resistance Fine Line Coils in LTCC
Journal of Microelectronis and Electronic Packaging 6 (2009), p. 42–48

H. Bartsch, M. Fischer, R. Gade, M. Mach, J. Müller, M. Hoffmann, B. Pawlowski, S. Barth
A new method for wafer level integration of silicon components on LTCC
Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components (SSI), 2008 2nd European Conference Exhibition on (2008), p. 1–3

H. Bartsch, R. Gade, A. Albrecht, M. Hoffmann
Systematic Characterization of Embossing Processes for LTCC Tapes
Journal of microelectronics and electronic packaging 5 (2008), p. 142–149 

H. Bartsch, C. Rensch, T. Thelemann, J. Müller, M. Hoffmann
Fully Integrated Bridge-Type Anemometer in LTCC-Based Microfluidic Systems
AST 54 (2008), p. 401–404 

G.A. Groß, T. Thelemann, S. Schneider, Boskovic D, Körner J M
Fabrication and fluidic characterization of static micromixers made of low temperature cofired ceramic (LTCC)
Chemical Engineering Science 63 (2008), p. 2773–2784

D. Kloß, M. Fischer, A. Rothermel, J.C. Simon, A.A. Robitzki
Drug testing on 3D in vitro tissues trapped on a microcavity chip
Lab Chip 8 (2008), pp. 879 

D. Kloß, R. Kurz, H.-G. Jahnke, M. Fischer, A. Rothermel, U. Anderegg, J.C. Simon, A.A. Robitzki
Microcavity array (MCA)-based biosensor chip for functional drug screening of 3D tissue models
Biosensors and Bioelectronics 23 (2008), p. 1473–1480

V. Cimalla, M. Stubenrauch, F. Weise, M. Fischer, K. Tonisch, M. Hoffmann, O. Ambacher
Suspended nanowire web
Applied Physics Letters 13 (2007)

V. Lebedev, D. Cengher, M. Fischer, K. Tonisch, V. Cimalla, M. Niebelschütz, O. Ambacher
Fabrication of one-dimensional “trenched” GaN nanowires and their interconnections
physica status solidi (a) 204 (2007), p. 3387‐3391

M. Stubenrauch, M. Fischer, C. Kremin, M. Hoffmann, J. Müller
Bonding Technology for Silicon with Polymers and Ceramics Based on Black Silicon
mstnews- international magazine on smart systems technologies (2007), p. 40–41

M. Stubenrauch, Michael Fischer, C. Kremin, M. Hoffmann, J. Müller
Bonding of silicon with filled and unfilled polymers based on black silicon
Micro Nano Letters 2 (2007), no. 6

T. Thelemann, M. Fischer, G.A. Groß, J. Müller
LTCC-based fluidic components for chemical applications
Journal of microelectronics and electronic packaging 4 (2007), p. 167–172

C. Buchheim, G. Kittler, V. Cimalla, V. Lebedev, M. Fischer, S. Krischok, V. Yanev, M. Himmerlich, G. Ecke, J.A. Schäfer, O. Ambacher
Tuning of Surface Properties of AlGaN/GaN Sensors for Nanodroplets and Picodroplets
IEEE - Sensors Journal 6 (2006), p. 881–886

D. Kloß, M. Schmidt, M. Fischer, A. Rothermel, A.A. Robitzki
Functional biomonitoring via tissue based impedance spectrometry
Schweizerische Gesellschaft für Biomedizinische Technik Programmheft // Gemeinsame Jahrestagung der Schweizerischen, Deutschen und Österreichischen Gesellschaft für Biomedizinische Technik 44 (2006)

V. Lebedev, F.M. Morales, M. Fischer, M. Himmerlich, S. Krischok, J.A. Schäfer, O. Ambacher
Nanocrystalline AlN:Si field emission arrays for vacuum electronics
physica status solidi (a) 203 (2006), p. 1839‐1844

M. Stubenrauch, Michael Fischer, C. Kremin, S. Stoebenau, A. Albrecht, O.J.O. Nagel
Black silicon—new functionalities in microsystems
Journal of Micromechanics and Microengineering 16 (2006), p. 82–87

A. Schober, G. Kittler, B. Lübbers, C. Buchheim, A. Majdeddin, V. Cimalla, M. Fischer, A. Spitznas, M. Gebinoga, V. Yanev, M. Himmerlich, T. Kerekes, M. Kittler, K.H. Drüe, M. Hintz, S. Krischok, J. Burgold, F. Weise, O. Ambacher, E. Gottwald
A novel class of sensors for micro- and nanofluidic systems in biotechnological applications
7. Dresdner Sensor-Symposium - neue Herausforderungen und Anwendungen in der Sensortechnik (2005) 143–146