INHALTE
Service Overview:
Research co-operation
- common projects with industrial and research institutions state-, Germany- or European-wide
Contract Research
- customer specific research based on a research contract
Public Services
- Electrical characterisation of dielectrics (metrological characterisation of dielectric substrate materials up to about 1 GHz by means of S parameters and RF I-V method)
- Substrate technologies (prototype production of printed circuit boards (PCB), design and production of thick film and LTCC modules)
- Assembly technologies (placement of microelectronic modules in SMD-, chip-on-board- and FlipChip technologies)
- Failure analysis in microelectronic assemblies (X-ray- and ultrasound analysis to detect packaging defects in microelectronic circuits, such as, for example, opens and shorts or delaminated packages)
- Engineering and technology consulting (support in the selection of assembly- and packaging technologies, as well as in the development of microelectronic modules)