Laser lithography for direct exposure of photoresists

Contact person

Prof. Heiko O. Jacobs
Nanotechnology Group

Phone: +49 3677 69-3724

Funding information

Project leader: Thüringer Aufbaubank

Förderkennzeichen: 2018 FGI 014

Participating groups: Nanotechnology Group

Period of funding: 01.01.2019 - 30.06.2021

Project information

The photolithographic structuring of micro- and nanotechnical functional groups is one of the basic technologies of semiconductor and microsystem technology. This technology is an integral part of the technology chain for integrated components of all kinds in the fields of integrated circuits, microsystem technology, integrated optics/microoptics, solar cells, energy efficiency, sensor technology, etc.

The standard equipment for photolithography only allows high-precision exposure of planar substrates. Exposures across cans and large steps are only possible with the conventional projection exposure methods by multiple exposures with different masks adapted to the corresponding focal planes. A direct writing method with focus tracking allows maximum focusing accuracy at each writing position. The depth and shape of structures thus no longer limit the structuring quality (minimum structure size). This provides a flexible, consistent 3D photolithography technology with outstanding imaging quality for the realization of 3D-MEMS (Micro-Electro-Mechanical Systems), MOEMS (Micro-Opto-Electro-Mechanical Systems) and innovative (micro-)optical components.

The acquisition of a laser lithography system for direct exposure of photoresists (Laser Direct Exposure System) represents an essential extension of the research infrastructure of IMN MacroNano and its technological center, the Center for Micro- and Nanotechnologies (ZMN). It extends the conventional mask-based UV lithography established at the ZMN to planar structures. The maskless lithography system applied for opens up new technological approaches for the realization of 3D structures, especially in the fields of life science, packaging and interconnection technology, microsystems technology/microoptics and stretchable electronics.