SPIRIT

Thin-film capable glass LTCC interposer for industrial sensor technology

Contact person

Prof. Jens Müller
ElectronicS Technology Group

Phone: +49 3677 69-2606
e-mail: jens.mueller@tu-ilmenau.de

Funding information

Project leader: Thüringer Aufbaubank

Project number: 2017 FE 9055

Participatinggroups: Electronics Technology Group

Period of funding: 01.04.2018 - 31.03.2021

Project information

Mahsa Kaltwasser
Functionalities of the glass LTCC interposer

In the SPIRIT project, an innovative and robust interposer platform based on an LTCC composite substrate is to be developed, which will lead to a significant increase in the integration density of electronic systems in the sense of "More than Moore". The heterogeneous integration of different semiconductor technologies and MEMS/NEMS in combination with concepts of hybrid passive integration will advance the miniaturization of system-in-packages for demanding sensor applications with high reliability requirements. The interposer substrate is based on low-temperature ceramics (LTCC) and a thin-film layer that is bonded to the LTCC in a manner suitable for high temperatures. The latter enables metallizations with line resolutions in the micrometer range and vias with 20 µm diameter. By appropriate contact metallizations, the classical connection techniques for unpackaged semiconductors down to the smallest contact geometries (e.g. FlipChip grid < 20µm) are ensured. The interposers are to be manufactured in panel or wafer-level format in a cost-optimized way. The mechanically supporting and thermal functions are mainly ensured by the LTCC substrate. Passive components and structures such as interdigital structures (gas or humidity sensors) or antennas (radar sensors) are planar and designed in thin film technology.