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Heiko O. Jacobs: Publikationen

Journal Papers

  • Shantonu Biswas, Johannes Reiprich, Joerg Pezoldt, Thomas Stauden, Heiko O. Jacobs, Metamorphic Stretchable Touchpad, in Advanced Matrials Technologies in 2019, 4, 1800446
  • Shantonu Biswas, Mahsa Mozafari, Johannes Reiprich, Leslie Schlag, Nishay A. Isaac, Thomas Stauden, Jörg Pezoldt, Heiko O. Jacobs, Metamorphic and stretchable electronic systems – A Materials Assembly, and Interconnection Challenge, pp. 64-65, In: Microsystems Technology in Germany 2018 (Mikrosystemtechnik in Deutschland 2018) (ISSN 2191-7183, trias CONSULT, Berlin, 2018).
  • Johannes Reiprich, Michael Gebinoga, L.-P. Traue, Leslie Schlag, Shantonu Biswas, Mahsa Kaltwasser, M.C. Honecker, Thomas Stauden, Jörg Pezoldt, Andreas Schober, Heiko O. Jacobs, Localized collection of airborne biological hazards for environmental monitoring, Sens. Actuators, B 273 (2018) 906-915.
  • Jörg Pezoldt, Leslie Schlag, Mahsa Kaltwasser, Shantonu Biswas, Thomas Stauden, Heiko O. Jacobs, Von Nanostrukturen zu metamorphen Systemen, journal 10-9, Ausgabe 2 (2018) 41-42.
  • Shantonu Biswas, Johannes Reiprich, Jörg Pezoldt, Matthias Hein, Thomas Stauden,  and Heiko O. Jacobs, Stress-adaptive meander track for stretchable electronics, Flex. Print. Electron. 3 (2018) 032001.
  • Mahsa Kaltwasser, U. Schmidt, Shantonu Biswas, Johannes Reiprich, Leslie Schlag, Nishay A. Isaac, Thomas Stauden, and Heiko O. Jacobs, Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects, ACS Appl. Mater. Interfaces, Article ASAP, DOI:10.1021/acsami.8b12390 Publication Date (Web): November 15, 2018
  • Wael Jatal, Uwe Baumann, Heiko O. Jacobs, Frank Schwierz, Jörg Pezoldt, "Enhancement- and depletion-mode AlGaN/GaN HEMTs on 3C-SiC(111)/Si(111) pseudosubstrates", Physica Status Solidi A214 (2017) 1600415-1 - 1600415-7.
  • Wael Jatal, Ingo Hörselmann, Heiko O. Jacobs, Frank Schwierz, Jörg Pezoldt, "AlGaN HEMT based digital circuits on 3C-SiC(111)/Si(111) pseudosubstrates", Physica Status Solidi A214 (2017) 1600416-1 - 1600416-6.
  • Johannes Reiprich, Thomas Stauden, Theresa Berthold,  Marcel Himmerlich, Jörg Pezoldt, and Heiko O. Jacobs, "Corona Assisted Ga Based Nanowire Growth on 3C-SiC (111)/Si (111) Pseudosubstrates" Materials Science Forum (Volume 897), DOI: 10.4028/www.scientific.net/MSF.897.642
  • Shantonu Biswas, Johannes Reiprich, Thaden Cohrs, David T. Arbolada, Andreas Schöberl, Mahsa Mozafari, Leslie Schlag, Thomas Stauden, Jörg Pezoldt, and Heiko O. Jacobs, "3D Metamorphic Stretchable Microphone Arrays" Advanced Material Technology 2017, 1700131   pdfDOI: 10.1002/admt.201700131
  • Shantonu Biswas, Johannes Reiprich, Thaden Cohrs, Thomas Stauden, Jörg Pezoldt, and Heiko O. Jacobs, "Metamorphic hemispherical microphone array three-dimensional acoustic" Applied Physics Letters 111, 043109(2017),  pdfDOI: 10.1063/1.4985710
  • Shantonu Biswas, Andreas Schöberl, Mahsa Mozafari, Jörg Pezoldt, Thomas Stauden and Heiko O. Jacobs, "Deformable printed circuit boards that enable metamorphic electronics" NPG Asia Materials 8 (2016) e336; doi:10.1038/am.2016.186
  • Jatal, W.; Baumann, U.; Jacobs, H.O.; Schwierz, F.; Pezoldt, J. ,”Tri-Gate Al0.2Ga0.8N/AlN/GaN HEMTs on SiC/Si-substrates”,Material Science Forum, 858 (2016) 1174-1177 (engl.). (2016)
  • Pezoldt, J.; Hähnlein, B.; Jacobs, H.O.; Schwierz, F.,“Amplification in Graphene Nanoribbon Junctions Materials Science Forum, 858, Seiten 1141-1144. Trans Tech Publications (2016)
  • Shantonu Biswas, Mahsa Mozafari, Thomas Stauden, and Heiko O. Jacobs, "Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries" Micromachines 7(4) 54 (2016) pdfLink
  • Bernd Hähnlein,  Mohamad Adnan Alsioufy, Michael Lootze, Heiko O. Jacobs, Frank Schwierz, Jörg Pezoldt, “ Planar nanowire transistors from two-dimensional materials,” Materials Science in Semiconductor Processing Band 42, 183-187. Pergamon (2016)
  • Se-Chul Park, Jun Fang, Shantonu Biswas, Mahsa Mozafari, Thomas Stauden, and Heiko O. Jacobs,  “Approaching Roll-to-Roll Fluidic Self-assembly: Relevant Parameters, Machine Design, and Applications”, IEEE Micro PP(99) (2015)
  • Jun Fang, Se-Chul Park, Leslie Schlag, and Heiko O. Jacobs, "Approching Gas Phase Electrodeposition: Process and Optimization to Enable the Self-Aligned Growth of 3D Nanobridge-Based Interconnects" Advanced Materials 28(9): (2015) pdfLink
  • Se-Chul Park, Shantonu Biswas, Jun Fang, Mahsa Mozafari,Thomas Stauden, and Heiko O. Jacobs, “ Millimeter Thin and Rubber-Like Solid-State Lighting Modules Fabricated Using Roll-to-Roll Fluidic Self-Assembly and Lamination,”Advanced Materials 27: 3661–3668. (2015) pdfLink
  • Jun Fang, Se-Chul Park, Leslie Schlag, Thomas Stauden, Jörg Pezoldt, and Heiko O.Jacobs, “Active Matrix-Based Collection of Airborne Analytes: An Analyte Recording Chip Providing Exposure History and Finger Print,” Advanced Materials 26: 7600–7607. (2014)Link
  • Se- Chul Park, Jun Fang, Shantonu Biswas,Mahsa Mozafari,Thomas Stauden, and Heiko O. Jacobs, “A First Implementation of an Automated Reel-to-Reel Fluidic Self-Assembly Machine,” Advanced Materials 26: 5942–5949. (2014) Link
  • Jun Fang, Se-Chul Park, Leslie Schlag, Thomas Stauden, Jörg Pezoldt, and Heiko O. Jacobs, “Localized Collection of Airborne Analytes: A Transport Driven Approach to Improve the Response Time of Existing Gas Sensor Designs,”Advanced Functional Materials 24: 3706–3714. (2014), Link
  • En-Chiang Lin, Jun Fang, Se-Chul Park,Thomas Stauden,Jörg Pezoldt, and Heiko O. Jacobs, “Effective Collection and Detection of Airborne Species Using SERS-Based Detection and Localized Electrodynamic Precipitation,” Advanced Materials 25: 3554–3559. (2013) Link
  • En-Chiang Lin, Jun Fang, Se-Chul Park, F. W. Johnson, Heiko O.Jacobs, “Effective localized collection and identification of airborne species through electrodynamic precipitation and SERS-based detection,” Nature Communications, 4: Article number: 1636, (2013) Link
  • Robert J. Knuesel, Sechul Park, Wei Zheng, and Heiko O. Jacobs,  "Self-assembly and Self-tiling: Integrating Active Dies Across Length Scales on Flexible Substrates," Journal of Microelectromechanical Systems 21(1), 58-99 (2011).  pdf
  • Jesse J. Cole, Chad R. Barry, Robert J. Knuesel, Xinyu Wang, and Heiko O. Jacobs,  "Nanocontact Electrification: Patterned Surface Charges Affecting Adhesion, Transfer, and Printing," Langmuir 27(11), 7321-7329 (2011).  pdf
  • Robert J. Knuesel and Heiko O. Jacobs,  "Self-Tiling Monocrystalline Silicon; A Process to Produce Electrically Connected Domains of Si and Microconcentrator Solar Cell Modules on Plastic Supports," Advanced Materials 23(24), 2727-2733 (2011). (Cover Picture) pdf
  • Jesse J. Cole, Chad R. Barry, Xinyu Wang and Heiko O. Jacobs,  "Nanocontact Electrification Through Forced Delamination of Dielectric Interfaces," ACS Nano 4(12), 7492-7498 (2010).  pdf
  • En-Chiang Lin, Jesse J. Cole and Heiko O. Jacobs,  "Gas Phase Electrodeposition: A Programmable Multimaterial Deposition Method for Combinatorial Nanostructured Device Discovery," Nano Letters 10(11), 4494-4500 (2010).  pdf
  • Jesse J. Cole, En-Chiang Lin, Chad R. Barry and Heiko O. Jacobs,  "Mimicking Electrodeposition in the Gas Phase: A Programmable Concept for Selected-Area Fabrication of Multimaterial Nanostructures," Small 6(10), 1117-1124 (2010).  pdf
  • Robert J. Knuesel and Heiko O. Jacobs,  "Self-Assembly of Microscopic Chiplets at a Liquid-Liquid-Solid Interface Forming a Flexible Segmented Monocrystalline Solar Cell," Proceedings of the National Academy of Sciences, USA 107(3), 993-998 (2010).  pdf
  • Jesse J. Cole, En-Chiang Lin, Chad R. Barry and Heiko O. Jacobs,  "Continuous Nanoparticle Generation and Assembly by Atmospheric Pressure Arc Discharge," Applied Physics Letters 95(11), 113101/1-113101/3 (2009). (Cover Picture) pdf
  • Jesse J. Cole, Xinyu Wang, Robert J. Knuesel and Heiko O. Jacobs,  "Integration of ZnO Microcrystals with Tailored Dimensions Forming Light Emitting Diodes and UV Photovoltaic Cells," Nano Letters 8(5), 1477-1481 (2008).  pdf
  • Jesse J. Cole, Xinyu Wang, Robert J. Knuesel and Heiko O. Jacobs,  "Patterned Growth and Transfer of ZnO Micro- and Nanocrystals with Size and Location Control," Advanced Materials 20(8), 1474-1478 (2008). (Cover Picture) pdf
  • Joysurya Basu, R Divarkar, Julia Deneen, Xinyu Wang, Heiko O Jacobs, C Barry Carter, "Interfaces of ZnO Nanowires Grown on Semiconducting Surfaces, "Microscopy and Microanalysis 12 (S02), 694-695 (2006) pdf
  • Chad R. Barry and Heiko O. Jacobs,  "Fringing Field Directed Assembly of Nanomaterials," Nano Letters 6(12), 2790-2796 (2006).  pdf
  • Wei Zheng, Jae-hoon Chung and Heiko O. Jacobs,  "Fluidic Heterogeneous Microsystems Assembly and Packaging," Journal of Microelectromechanical Systems 15(4), 864-870 (2006).  pdf
  • Jae-hoon Chung, Wei Zheng, Thomas J. Hatch and Heiko O. Jacobs,  "Programmable Reconfigurable Self-Assembly: Parallel Heterogeneous Integration of Chip-Scale Components on Planar and Nonplanar Surfaces," Journal of Microelectromechanical Systems 15(3), 457-464 (2006).  pdf
  • Wei Zheng and Heiko O. Jacobs,  "Self-Assembly Process To Assemble and Connect Semiconductor Dies On Surfaces with Single Angular Orientation and Contact Pad Registration," Advanced Materials 18(11), 1387-1392 (2006).  pdf
  • Chad R. Barry, Jie Gu and Heiko O. Jacobs,  "Charging Process and Coulomb-Force-Directed Printing of Nanoparticles with Sub-100 nm Lateral Resolution," Nano Letters 5(10), 2078-2084 (2005).  pdf
  • Aaron M. Welle and Heiko O. Jacobs,  "Printing of Organic and Inorganic Nanomaterials Using Electrospray Ionization and Coulomb-Force-Directed Assembly," Applied Physics Letters 87(26), 263119/1-263119/3 (2005).  pdf
  • Wei Zheng and Heiko O. Jacobs,  "Fabrication of Multicomponent Microsystems by Directed Three-Dimensional Self-Assembly," Advanced Functional Materials 15(5), 732-738 (2005). (Cover Picture) pdf
  • Wei Zheng, Philippe Buhlmann and Heiko O. Jacobs,  "Sequential Shape-and-Solder-Directed Self-Assembly of Functional Microsystems," Proceedings of the National Academy of Sciences, USA 101(35), 12814-12817 (2004).  pdf
  • Wei Zheng and Heiko O. Jacobs,  "Shape-and-Solder-Directed Self-Assembly to Package Semiconductor Device Segments," Applied Physics Letters 85(16), 3635-3637 (2004).  pdf
  • Chad R. Barry, Michael G. Steward, Nyein Z. Lwin and Heiko O. Jacobs,  "Printing Nanoparticles From the Liquid and Gas-Phase Using Nanoxerography," Nanotechnology 14(10), 1057-1063 (Invited Featured Article) (2003).  pdf
  • Chad R. Barry, Nyein Z. Lwin, Wei Zheng and Heiko O. Jacobs,  "Printing Nanoparticle Building Blocks From the Gas-Phase Using Nanoxerography," Applied Physics Letters 83(26), 5527-5529 (2003). (Cover Picture) pdf
  • M. Boncheva, D.H. Gracias, H.O. Jacobs and G.M. Whitesides,  "Biomimetic Self-Assembly of a Functional Asymmetrical Electronic Device," Proceedings of the National Academy of Sciences, USA 99(8), 4937-4940 (2002).  pdf
  • M. L. Chabinyc, X. Chen, R. E. Holmlin, H. O. Jacobs, H. Skulason, C. D. Frisbie, V. Mujica, M. A. Ratner, M. A. Rampi and G. M. Whitesides,  "Molecular Rectification in a Metal-Insulator-Metal Junction Based on Self-Assembled Monolayers," Journal of the American Chemical Society 124(39), 11730-11736 (2002).  pdf
  • H. O. Jacobs, S. A. Campbell and M. G. Steward,  "Approaching NanoXerography: The use of Electrostatic Forces to Position Nanoparticles with 100 Nanometer Scale Resolution," Advanced Materials 14(21), 1553-1557 (2002). (Cover Picture) pdf
  • H.O. Jacobs, A.R. Tao, A. Schwartz, D.H. Gracias and G.M. Whitesides,  "Fabrication of a Cylindrical Display by Patterned Assembly," Science 296(5566), 323-325 (2002).  pdf
  • J. Ch. Love, D. B. Wolfe, H. O. Jacobs and G. M. Whitesides,  "Microscope Projection Photolithography for Rapid Prototyping of Masters with Micron-Scale Features for Use in Soft Lithography," Langmuir 17(19), 6005-6012 (2001).  pdf
  • H. O. Jacobs and G. M. Whitesides,  "Submicrometer Patterning of Charge in Thin-Film Electrets," Science 291(5509), 1763-1766 (2001).  pdf
  • F. Robin, H. Jacobs, O. Homan, A. Stemmer and W. Bachtold,  "Investigation of the Cleaved Surface of a p-i-n Laser Using Kelvin Probe Force Microscopy and Two-Dimensional Physical Simulations," Applied Physics Letters 76(20), 2907-2909 (2000).
  • H. O. Jacobs and A. Stemmer,  "Measuring and Modifying the Electric Surface Potential Distribution on a Nanometre Scale: a Powerful Tool in Science and Technology," Surface and Interface Analysis 27(5-6), 361-367 (1999).  pdf
  • H. O. Jacobs, H. F. Knapp and A. Stemmer,  "Practical Aspects of Kevin Probe Force Microscopy," Review of Scientific Instruments 70(3), 1756-1760 (1999).  pdf
  • H. O. Jacobs, P. Leuchtmann, O. J. Homan and A. Stemmer,  "Resolution and Contrast in Kelvin Probe Force Microscopy," Journal of Applied Physics 84(3), 1168-1173 (1998).  pdf
  • H. O. Jacobs, H. F. Knapp, S. Müller and A. Stemmer,  "Surface Potential Mapping: A Qualitative Material Contrast in SPM," Ultramicroscopy 69(1), 39-49 (1997).  pdf
  • F. Mayer, A. Häberli, H. Jacobs, G. Ofner, O. Paul and H. Baltes,  "Single-Chip CMOS Anemometer," Proc. IEEE International Electron Device Meeting 895-898 (1997).  pdf
  • A. Stemmer, H. O. Jacobs and H. F. Knapp,  "Approaching the Nanoworld," Proc. SPIE Microrobotics: Components and Applications 2906, 80-85 (1996).  pdf
  • F. Mayer, M. Hintermann, H. Jacobs, O. Paul and H. Baltes,  "Thermoelectric CMOS Anemometers," Proc. SPIE Micromachined devices and Components II 2882, 236-246 (1996).  pdf

Conference Proceedings

  • Hannappel, T.; Hoffmann, M.; Jacobs, H.O.; Lei, Y.; Rangelow, I.;  Schaaf, P., "Application of nanostructuring, nanomaterials and micro-nano-integration for improved components and system's performance”Pan Pacific Microelectronics Symposium. Pan Pacific, Seiten 1-10. IEEE (2016)
  • Schlag, L.; Fang, J.; Park, S.C.; Stauden, T.; Pezoldt, J.;  Jacobs, H.O.,"Self-Aligned Growth of 3D Nanoparticle-Bridge-Based Interconnects by Gas Phase Electrodeposition” 2nd International Symposium on Nanoparticles/Nanomaterials and Applications, Lissabon, 2016
  • Jacobs, H.O., Effective Localized Collection and Identification of Airborne Species Through Electrodynamic Precipitation and SERS-Based Detection” 4th Annual Conference and EXPO of AnalytiX-2015, Nanjing, China, April 25 to 28, (2015)
  • Schlag, L.; Fang, J.; Park, S.C.; Stauden, T.; Pezoldt, J.;  Jacobs, H.O.,"Self-Aligned Growth of 3D Nano-Bridge-Based Interconnects by Gas Phase Electrodeposition” 2nd CPFN, Ilmenau, 2015
  • Schlag, L.; Fang, J.; Park, S.C.; Stauden, T.; Pezoldt, J.;  Jacobs, H.O., Self-Aligned Growth of 3D Nano-Bridge-Based Interconnects by Gas Phase Electrodeposition” 3rd CPFN, Ilmenau, 2016
  • Robert J. Knuesel, Wei Zheng, Jaehoon Chung, Se-Chul Park, Michael J. Motala, and Heiko O. Jacobs,  "Directed Assembly: Integration of Heterogeneous Systems Across Length Scales and Material Boundaries," Proc. NSF ECCS Grantees Conference, Honolulu, HI (2010).
  • Robert J. Knuesel, Se-Chul Park, Michael J. Motala, and Heiko O. Jacobs,  "Scaling Limits of Programmable Fluidic Self-Assembly Forming Electrical Interconnects," Proc. NSF ECCS Grantees Conference, Honolulu, HI (2010). 
  • Chris Smith, Jesse Cole, En-Chiang Lin and Heiko O. Jacobs,  "ZnO Nanorod LEDs and Silicon Nanowire Integration," Proc. NSF CMMI Grantees Conference, Honolulu, HI (2009). 
  • Jesse J. Cole, En-Chiang Lin, Chad Barry and Heiko O. Jacobs,  "Gas Phase Nanomaterial Integration," Proc. NSF CMMI Grantees Conference, Honolulu, HI (2009). 
  • Jesse J. Cole and Heiko O. Jacobs,  "ZnO Patterned Growth and Transfer Gaining Control over Location, Dimension, and Orientation forming UV LEDs and Photovoltaic Cells," Proc. NSF CMMI Grantees Conference, Honolulu, HI (2009). 
  • Jesse J. Cole and Heiko O. Jacobs,  "ZnO Microcrystals for Light Emitting Diode and Photovoltaic Applications with Integration on Flexible Substrates," Proc. Materials Research Society Symp. PP Materials and Devices for Flexible and Stretchable Electronics, San Francisco, CA (2009). 
  • Robert J. Knuesel and Heiko O. Jacobs,  "Fluidic Surface-Tension-Directed Self-Assembly of Miniaturized Semiconductor Dies Across Length Scales and 3D Topologies," Proc. Materials Research Society Symp. BB Material Systems and Processes for Three-Dimensional Micro- and Nanoscale Fabrication and Lithography, San Francisco, CA (2009). 
  • Chad Barry, Xinyu Wang, Uwe Kortshagen and Heiko O. Jacobs,  "Gas Phase Nanoparticle Integration," Proc. Materials Research Society Symp. N Printing Methods for Electronics, Photonics and Biomaterials, San Francisco, CA (2007). 
  • Robert Knuesel, Shameek Bose, Wei Zheng and Heiko O. Jacobs,  "Angular Orientation-Specific Directed Self-assembly and Integration of Ultra Small Dies," Proc. NSTI-Nanotech Conference, Santa Clara, CA (2007). 
  • Chad R. Barry and Heiko O. Jacobs,  "Gas Phase Nanoparticle Integration," Proc. NSTI-Nanotech Conference, Santa Clara, CA (2007). 
  • Xinyu Wang, Jesse Cole, Amir M. Dabiran and Heiko O Jacobs,  "Electroluminescence of ZnO Nanowire/p-GaN Heterojunction Light Emitting Diodes," Proc. NSTI-Nanotech Conference, Santa Clara, CA (2007). 
  • Robert Knuesel, Shameek Bose, Wei Zheng and Heiko O. Jacobs,  "Engineered Solder-Directed Self-Assembly Across Length Scales, in Materials, Processes, Integration, and Reliability in Advanced Interconnects for Micro- and Nano-Electronics," Proc. Materials Research Society 990 edited by Robert Miller and Dorel Toma (2007). 
  • Xinyu Wang, Jesse Cole, Amir Dabiran and Heiko O. Jacobs,  "ZnO Nanowire/p-GaN Heterojunction LEDs, in Applications of Nanotubes and Nanowires," Proc. Materials Research Society 1018E edited by Phaedon Avouris (2007). 
  • Chad R. Barry, Aaron M. Welle, Jie Gu, Stephen A. Campbell and Heiko O. Jacobs,  "Printing of Nanoparticles with Sub-100nm Resolution," Proc. NSF CMMI Grantees Conference, Scottsdale, AZ (2005). 
  • Yongping Ding, Ying Dong, Stephen A. Campbell and Heiko O. Jacobs,  "Field-Effect Transistor Built with a Single Crystal Si Nanoparticle," Proc. NSF CMMI Grantees Conference, Scottsdale, AZ (2005). 
  • Chad R. Barry, Aaron M. Welle, Uwe Kortshagen, Stephen A. Campbell and Heiko O. Jacobs,  "From Electric Nanocontact Lithography to the Directed Self-Assembly of Nanoparticle Based Devices," Proc. Nanoarchitectonics, Tsukuba, Japan (2005). 
  • W. Zheng, J.H. Chung and H. O. Jacobs,  "Non-Robotic Fabrication of Packaged Microsystems By Shape-And-Solder directed Self-Assembly," Proc. 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami Beach, FL (2005). 
  • J.H. Chung, W. Zheng and H. O. Jacobs,  "Programmable Reconfigurable Self-Assembly: Approaching The Parallel Heterogeneous Integration on Flexible Substrates," Proc. 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005), Miami Beach, FL (2005). 
  • C. R. Barry, N. Z. Lwin, M.G. Steward and H. O. Jacobs,  "Nanoparticle Assembly by Nanoxerography," Proc. NSF CMMI Grantees Conference, Dallas, TX (2004). 
  • C. R. Barry, C. J. Hoon and H. O. Jacobs,  "Approaching Programmable Self-Assembly from Nanoparticle-Based Devices to Integrated Circuits," Proc. Foundations of Nanoscience: Self-Assembled Architectures and Devices (FNANO), Snowbird, UT (Invited) (2004). 
  • J. Gu, C. R. Barry and H. O. Jacobs,  "NanoXerography: The Directed Self-Assembly of Nanoparticle Building Blocks onto Charged Based Receptors," Proc. 7th International Conference on Nanostructured Materials, Wiesbaden, Germany (2004). 
  • Michael G. Steward, Chad R. Barry, Stephen A. Campbell and Heiko O. Jacobs,  "NanoXerography: The Use of Electrostatic Forces to Pattern Nanoparticles," Proc. NSF CMMI Grantees Conference, Birmingham, AL (2003). 
  • H. O. Jacobs,  "Patterning of Electrons and Holes for Data Storage and High Resolution Charge Based Printing," Proc. 7th International Conference on Nanometer-scale Science and Technology, NANO-7/ECOSS-21 A2183, Malmo, Sweden (2002). 

Patents

  1. H. O. Jacobs, “Method of self-assembly of components on a substrate”, EU Patent EP 2790212 B1, 09/16/2015. Issued
  2. H. O. Jacobs, “Method of and apparatus for self-assembly of components on a substrate”, EU Patent EP 2688093 A1, 01/22/2014. Issued
  3. H. O. Jacobs and G. M. Whitesides, "Electric Microcontact Printing Method and Apparatus," U.S. Patent: 7771647, 08/10/2010. Issued
  4. H. O. Jacobs, "Method of Self-Assembly on a Surface," U.S. Patent: 7774929, 08/07/2010. Issued
  5. H. O. Jacobs and W. Zheng, "Fluidic Heterogeneous Microsystems Assembly and Packaging," U.S. Patent: 7625780, 12/01/2009. Issued
  6. H. O. Jacobs, "Method and Apparatus for Depositing Charge and/or Nanoparticles," U.S. Patent: 7592269, 09/22/2009. Issued
  7. H. O. Jacobs and C. Barry, "Method and Apparatus for Depositing Charge and/or Nanoparticles," U.S. Patent: 7232771, 06/19/2007. Issued
  8. H. O. Jacobs, A. Tao, A. Schwartz, D. H. Gracias, and G. M. Whitesides, "Method of Self-Assembly and Self-Assembled Structures," PCT/US2003/011078, 10/04/2003. Issued



Presentations and Posters (since 2004)

106. 12/02/10: Proc. NSF CMMI Grantees Conference, Honolulu, HI
  "Scaling Limits of Programmable Fluidic Self-Assembly Forming Electrical Interconnects," Talk
 105. 12/02/10: Proc. NSF CMMI Grantees Conference, Honolulu, HI
 Robert J. Knuesel, Michael Motala and Heiko O. Jacobs, 
  "Scaling Limits of Programmable Fluidic Self-Assembly Forming Electrical Interconnects," Poster. 
 104. 12/01/10: Proc. NSF CMMI Grantees Conference, Honolulu, HIRobert J. Knuesel, Se-Chul Park, Wei Zheng, Michael Motala and Heiko O. Jacobs, 
  "Directed Assembly: Integration of Heterogeneous Systems Across Length Scales and Material Boundaries," Poster
 103. 10/7/10: University of Minnesota Center for Nanostructure Applications, Nanotechnology Conference
 Jesse J. Cole, En-Chiang Lin, Jun Fang and Heiko O. Jacobs, 
  "Mimicking Electrodeposition in the Gas Phase: A Programmable Concept for Selected-Area Fabrication of Multimaterial Nanostructures," Poster
 102. 10/7/10: University of Minnesota Center for Nanostructure Applications, Nanotechnology Conference
 Robert J. Knuesel, Se-Chul Park, Michael Motala and Heiko O. Jacobs, 
  "Self-Assembly of Microscopic Chiplets at a Liquid-Liquid-Solid Interface Forming a Flexible Segmented Monocrystalline Solar Cell," Poster
 101.  9/14/10: Seminar, Department of Chemical Engineering and Material Science, University of Minnesota, Minneapolis, MN
  "Nanomanufacturing: Integration Technologies Across Lengths Scales and Material Boundaries," Invited Talk
 100.  4/27/10: Proc. Foundations of Nanoscience: Self-Assembled Architectures and Devices (FNANO10), Snowbird, Utah
 Robert J. Knuesel, Se-Chul Park, and Heiko O. Jacobs, 
  "Self-Packaging and Self-Mounting of Miniaturized Semiconductor Dies Across Length Scales and 3D Topologies," Invited Talk
 99.  4/06/10: MRS Spring Meeting, San Francisco, CA
  "Fluidic Self-Assembly of Semiconductor Dies For Macroelectronics Applications," Invited Talk
 98.  4/5/10: University of Minnesota Center for Nanostructure Applications Seminar 
 "Heterogeneous Nanomanufacturing: Integration Technologies Across Lengths Scales and Material Boundaries Incorporating Synthesis, Integration, and Applications of Nanomaterials," 
Invited Talk
 97.  12/01/09: MRS Fall Meeting, Boston MA
  "Fluidic Surface-Tension-Directed Self-Assembly of Miniaturized Semiconductor Dies Across Length Scales and 3D Topologies," Invited Talk
 96.  11/18/09: University of Minnesota Center for Nanostructure Applications, Nanotechnology Conference
  "Directed Heterogeneous Self-Assembly and Formation of Interconnects - Closing the Gaps from Nano to Macro and Devices to Systems," Poster
 95.  11/18/09: University of Minnesota Center for Nanostructure Applications, Nanotechnology Conference
  "Heterogeneous Integration and Packaging Using Fluidic Self-Assembly," Poster
 94.  11/18/09: University of Minnesota Center for Nanostructure Applications, Nanotechnology Conference
  "Gas Phase Nanoxerographic Nanomaterial Integration," Poster
 93.  11/18/09: University of Minnesota Center for Nanostructure Applications, Nanotechnology Conference
  "Nanowire Integration Process to Gain Control over Location, Dimension, and Orientation,"Poster
 92.  10/09/09: University of Michigan, ME Department, Ann Arbor, MI
  "Heterogeneous Nanomanufacturing:Integration Technologies Across Lengths Scales and Material Boundaries Incorporating Synthesis, Integration, and Applications of Nanomaterials," Invited Sponsored Talk
 91.  05/24/09: Proc. NSF CMMI Grantees Conference, Honolulu, HI
  "Gas Phase NanoWire Integration Process," Poster
 90.  05/23/09: Proc. NSF CMMI Grantees Conference, Honolulu, HI
  "GOALI: Nanowire Integration Process to Gain Control over Location, Dimension, and Orientation," Poster
 89.  05/22/09: Proc. NSF CMMI Grantees Conference, Honolulu, HI
  "Gas Phase Nanoxerographic Nanomaterial Integration," Poster
 88.  05/06/09: ROLEX R&D, Biel, Switzerland
  "Fluidic Self-Assembly Platform Progress Report," Invited Talk
 87.  04/15/09: MRS Spring Meeting, San Francisco, CA
  "Fluidic Surface-Tension-Directed Self-Assembly of Miniaturized Semiconductor Dies Across Length Scales and 3D Topologies," Invited Talk
 86.  04/15/09: MRS Spring Meeting, San Francisco, CA
  "ZnO Microcrystals for Light Emitting Diode and Photovoltaic Applications with Integration on Flexible Substrates," Poster
 85.  03/16/09: ETH Zurich, Nanomanufacturing Colloquium, Department of Mechanical and Process Engineering
  "Heterogeneous Nanomanufacturing: Integration Technologies Across Length Scales and Material Boundaries Incorporating Synthesis, Integration, and Applications of Nanomaterials," International Invited Sponsored Talk.
 84.  11/11/08: Minnesota Nanotechnology Conference, Minneapolis, MN
 Wei Zheng, JaeHoon Chung, Robert J. Knuesel, and Heiko O. Jacobs, 
  "Heterogeneous Integration and Packaging using Fluidic Self-Assembly," Poster
 83.  11/11/08: Minnesota Nanotechnology Conference, Minneapolis, MN
 Jesse J. Cole, Xinyu Wang, and Heiko O. Jacobs, 
  "Nanowire Integration Process to Gain Control over Location, Dimension, and Orientation," Poster
 82.  11/11/08: Minnesota Nanotechnology Conference, Minneapolis, MN
 Jesse J. Cole, Xinyu Wang, Chad R. Barry, Stephen Campbell, and Heiko O. Jacobs, 
  "Nanoparticle and Nanowire Integration," Poster
 81.  06/24/08: KIST Europe Headquartered in Saarbrucken, Germany
  "Heterogeneous Integration Technologies Supporting Transdisciplinary Applications," Invited Sponsored Talk
 80.  06/19/08: Eastman Kodak Company, Rochester, NY
  "Integration of Nanoparticles, Nanowires, and Micrometer Sized Chips by Novel Printing and Directed Self-Assembly Methods," Invited Sponsored Talk
 79.  05/12/08: NSF Center for High-rate Nanomanufacturing, NEU, Boston, MA
  "Heterogeneous Integration Across Scales and Materials Boundaries," Invited Sponsored Talk
 78.  02/27/08: TU Wien, Austria
  "Heterogeneous Microsystems," Invited Sponsored Talk
 77.  01/09/08: DMII Grantees Conference, Knoxville, TN
  "Nanowire Integration and UV LEDs," Poster
 76.  01/08/08: DMII Grantees Conference, Knoxville, TN
  "Gas Phase Insitu Nanoparticle/Nanowire Integration," Poster
 75.  11/28/07: MRS Fall Meeting, Boston, MA
  "Electrostatic Force Directed Integration of Nanomaterials," Poster
 74.  11/26/07: MRS Fall Meeting, Boston, MA
  "Integration of Nanoparticles, Nanowires, and Micrometer Sized Chips by Novel Printing and Directed Self-Assembly Methods," Invited Talk
 73.  11/13/07: Minnesota Nanotechnology Conference, Minneapolis, MN
  "Nanowire Integration Process to Gain Control Over Location, Dimension, and Orientation," Poster
 72.  11/13/07: Minnesota Nanotechnology Conference, Minneapolis, MN
  "Focused Nanoparticle Deposition Leading to Nanowire Integration," Poster
 71.  08/18/07: Particles 2007 - Particle-based Device Technology, Toronto, Ontario, Canada
  "Nanoxerographic Printing and Fringing Field Directed Integration of Nanomaterial Building Blocks," Invited Sponsored Talk
 70.  07/09/07: ETH Zurich Host Prof. Andreas Stemmer, Switzerland
  "Integration of Nanomaterials," Invited Talk
 69.  07/06/07: CSEM - Centre Suisse d'Electronique et de Microtechnique, Alpnach, Host Dr. Helmut Knapp, Switzerland
  "Self-Assembly Based Manufacturing," Talk
 68.  07/04/07: Paul Scherrer Institute in Villigen, Argau, Host Prof. Jens Gobrecht, Switzerland
  "Integration of Nanoparticles, Nanowires, and Micrometer Sized Chips by Novel Printing and Directed Self-Assembly Methods," Invited Sponsored International Talk
 67.  06/27/07: NSF Workshop on Nanomanufacturing in KoreaInvited Sponsored International Talk
 66.  05/31/07: IPRIME 2007 Industrial Partnership for Research in Interfacial and Materials Engineering, Minneapolis, MN
  "Integration of Micro and Nanometer sized Components and Devices Through Printing and Fluidic Self-Assembly," Invited Sponsored Talk
 65.  05/22/07: NSTI Nanotech 2007, Santa Clara Convention Center, CA
  "Angular Orientation-Specific Directed Self-assembly Enabling the Integration of Small Dies,"    Poster
 64.  05/22/07: NSTI Nanotech 2007, Santa Clara Convention Center, CA
  "Gas Phase Nanoparticle Integration," Talk
 63.  05/24/07: NSTI Nanotech 2007, Santa Clara Convention Center, CA
  "Electroluminescence of ZnO Nanowire/p-GaN Heterojunction Light Emitting Diodes," 
Talk
 62.  04/12/07: MRS Spring Meeting, San Francisco, CA
  "Electroluminescence of ZnO Nanowire/p-GaN Heterojunction Light Emitting Diodes," Talk
 61.  04/12/07: MRS Spring Meeting, San Francisco, CA
  "Nanoparticle Assembly and Charge Patterning by Contact Electrification," Talk
 60.  04/11/07: MRS Spring Meeting, San Francisco, CA
  "Angular Orientation-Specific Directed Self-assembly Enabling the Integration of Ultra Small Dies," Talk
 59.  04/10/07: MRS Spring Meeting, San Francisco, CA
  "In situ Gas Phase Nanoparticle Seed - Nanowire Integration," Poster
 58.  04/10/07: MRS Spring Meeting, San Francisco, CA
  "Focused Assembly of Nanoparticles Using Localized Fringing Fields," Poster
 57.  04/05/07: International Microelectronics Advanced Packaging Society (Viking Chapter) "Engineered Self-Assembly: Non-Robotic Heterogeneous Integration, Assembly, and Packaging of Semiconductor Dies," Invited Talk
 56.  03/08/07: CHN distinguished lecture series at Northeastern University, Boston, MA
  "Integration of Nanoparticles, Nanowires, and Micrometer Sized Chips by Novel Printing and Directed Self-Assembly Methods," Invited Sponsored Talk
 55.  01/11/07: NMAC Seminar, University of Minnesota, Minneapolis, MN
  "Integration of Nanoparticles, Nanowires, and Micrometer Sized Chips by Novel Printing, Packaging, and Directed Self-Assembly Methods," Talk
 54.  11/10/06: Bio/Nano Workshop, University of Minnesota, Minneapolis, MN
 Robert J. Knuesel, Babak Ziaie, David Redish and Heiko O. Jacobs, 
  "Wireless Neurological Recording System: Self-assembly Tools and Test," Poster
 53.  11/09/06: Northern Nano Workshop, University of Minnesota, Minneapolis, MN
 Chad R. Barry and Heiko O. Jacobs, 
 "Coulomb Force Directed Assembly of Nanomaterials with Sub-100nm Resolution," Poster
 52.  11/09/06: Northern Nano Workshop, University of Minnesota, Minneapolis, MN
 Xinyu Wang, Jesse Cole, and Heiko O. Jacobs, 
  "Heterojunction Nanowire Device Fabrication," Poster
 51.  11/09/06: Northern Nano Workshop, University of Minnesota, Minneapolis, MN
 Wei Zheng, Robert J. Knuesel, Shameek Bose, and Heiko O. Jacobs, 
  "Directed Assembly: Integration of Heterogeneous Systems Across Length Scales and Material Boundaries," 
 Poster
 50.  07/10/06: ASME's 4th Nano Training Bootcamp - University of Minnesota Continuing's Education Conference Center, Minneapolis, MN
  "Principles of Self-Assembly," Sponsored Invited Talk
 49.  6/21/06: Industry Outreach: Minnesota Technology Inc. - Technology Awareness Forum, Host MTS, Eden Prairie, MN
  "Self-Assembly Based Manufacturing - Processes to Integrate Nanomaterials and Devices Across Length Scales and Material Boundaries," Invited Talk
 48.  06/01/06: DARPA/MTO 2006 MONTAGE PI Review Meeting, Long Beach, CA
  "Self-Assembly Based Manufacturing Enabling Ultra Small Situation Awareness Systems," Talk
 47.  05/03/06: M-nano Investment Community Workshop‚ Nanotech 2006
  "Directed Self-Assembly Across Lengths Scales: From Nano to Macro," Invited Talk
 46.  05/02/06: Argonne National Laboratory, 2006 Users Meeting for DOE/BES User Facilities APS Conference Center, Argonne, IL
  "Nanoparticle Nanoxerography," Invited Sponsored Talk
 45.  04/26/06: Industry Outreach SVTA Associates, Eden Prairie, MN
  "Integration of Nanomaterials and Devices Across Length Scales and Material Boundaries," Invited Talk
 44.  03/30/06: Honeywell Industry Outreach, MN
  "Overview of Research Activities: Chip Scale Self-Assembly and Nano-Component Integration," Talk
 43.  03/15/06: 3M Industry Outreach, MN
  "Overview of Research Activities: Module Directed Self-Assembly," Talk.
 42.  03/03/06: DARPA MTO Nanowire workshop, Napa, CA
  "Directed Integration of Functional NanoMaterials and Devices Across Length Scales and Material Boundaries," Invited Talk.
 41.  02/07/06: Department of Chemical Engineering, University of Minnesota, Minneapolis, MN
  "Directed Self-Assembly," Invited Talk
 40.  02/02/06: Nanotechnology Outreach, Minnesota Science Museum, St. Paul, MN "Directed Self-Assembly & Nanotechnology Related Experiments," Talk and Lab Tour
 39.  02/02/06: DARPA MTO Electronics Symposium, San Francisco, CA Participant
 38.  12/13/05: University of Duisburg, Germany ECE Departmental Colloquium
  "Directed Assembly: Integration of Functional Materials and Devices Across Length Scales and Material Boundaries," Sponsored Invited International Talk
 37.  12/01/05: MRS 2005 Fall Meeting, Boston, MA
 Wei Zheng and Heiko O. Jacobs (Talk by Wei Zheng), 
  "Assembly and Packaging of Wireless Sensor Systems by Directed Three-Dimensional Self-Assembly," Talk
 36.  11/29/05: MRS 2005 Fall Meeting, Boston, MA
 Chad R. Barry, Aaron M. Welle, Thomas J. Hatch, Uwe Kortshagen, Stephen A. Campbell, and Heiko O. Jacobs, 
  "Coulomb-Force Directed Assembly and Transfer of Nanomaterials," Invited Talk
 35.  11/29/05: MRS 2005 Fall Meeting, Boston, MA
 Chad R. Barry and Heiko O. Jacobs, 
  "Directed Assembly of Nanomaterials on Topographically Patterned Substrates Using Inbuilt Fringing Fields," Poster.
 34.  11/28/05: MRS 2005 Fall Meeting, Boston, MA
 Chad R. Barry and Heiko O. Jacobs, 
  "Directed Assembly of Nanomaterials on Topographically Patterned Substrates Using Inbuilt Fringing Fields," Talk by Chad Barry (Graduate Student Award Talk)
 33.  10/20/05: HP Corvallis, Oregon, Hosts: Herman Gregory and James Stasiak
  "Directed Assembly: Integration of Functional Materials and Devices Across Length Scales and Material Boundaries," Sponsered Invited Talk
 32.  10/09/05: Berkeley ECS Departmental Colloquium, Host: Ronald S. Fearing Distinguished Lecture Series
  "Directed Assembly: Integration of Functional Materials and Devices Across Length Scales and Material Boundaries," Sponsered Invited Talk.
 31.  09/20/05: Digifab 2005 - The International Conference on Digital Fabrication in Baltimore, MD
  "From Electric Nanocontact Lithography to the Directed Self-Assembly of Nanoparticle Based Devices," Invited Talk
 30.  09/20/05: AVS 52nd International Symposium, Boston, MA
  "From Electric Nanocontact Lithography to the Directed Self-Assembly of Nanoparticle Based Devices," Invited Talk
 29.  09/15/05: DARPA/MTO Workshop, Compound Semiconductor Materials on Silicon, Lake Tahoe, NV Host: Dr. M Rosker
  "COSMOS: Heterogeneous Integration Concepts that use Programmable Self-Assembly," Short Talk to Pitch Idea
 28.  06/01/05: IPRIME 2005 Meeting, Minneapolis, MN
 Aaron M. Welle, Heiko O. Jacobs, 
  "Patterning of Inorganic and Organic Materials by Electrospraying," Poster
 27.  06/01/05: IPRIME 2005 Meeting, Minneapolis, MN
 Chad R. Barry, Heiko O. Jacobs, 
  "NanoXerography: The Use of Electrostatic Forces to Pattern Nanoparticles," Poster
 26.  05/18/05: DARPA/MTO Workshop MEMS/NEMS Basic Science
  "New Concepts for Heterogeneous Integration," Invited Talk
 25.  03/24/05: ECE UMN Colloquium Seminar, Minneapolis, MN
  "Patterning and Self-Assembly Across Length Scales and Material Boundaries," Colloquium
 24.  03/04/05: Nanoarchitectonics Workshop 2005, Tsukuba, Japan
  "From Electric Nanocontact Lithography to the Directed Self-Assembly of Nanoparticle Based Devices," Sponsored Invited International Talk
 23.  02/02/05: MEMS 2005 Conference, Miami Beach, FL
  "Non-Robotic Fabrication of Packaged Microsystems By Shape-And-Solder directed Self-Assembly," Invited Talk
 22.  02/01/05: MEMS 2005 Conference, Miami Beach, FL
  "Programmable Reconfigurable Self-Assembly: Approaching The Parallel Heterogeneous Integration on Flexible Substrates," Poster
 21.  01/03/05: NSF conference, CMMI Grantees conference, AZ Two posters were presented
 20.  11/30/04: 3M Non-Tenured Faculty Award, Seminar on Directed Self-Assembly, MN Talk
 19.  11/09/04: Workshop at DARPA, Nanomaterials for Electronics Workshop, Arlington, VA
  "Self-assembly Based Manufacturing: From Nanoelectronics to Integrated Systems," Invited Talk
 18.  08/23/04: Condensed Matter Seminar, Physics department, UMN, Minneapolis, MN "Self-Assembly on Across Lengths Scales," Talk
 17.  07/28/04: DARPA/SRC Interconnect and Packaging Science Area Review at the Navel Postgraduate School in Monterey, CA "Directed Self-Assembly of Nanoparticles and Nanowires on Silicon Substrates," Talk. 16.  06/30/04: DARPA/SRC Nanolithography Review at the University of Wisconsin, Madison
  "Directed Self-Assembly of Nanoparticles and Nanowires on Silicon Substrates," Talk
 15.  06/25/04: Nano 2004, Satellite Workshop, Nanoparticle-Synthesis, Characterization and Properties, Duisburg, Germany
  "Electrostatically Directed Site Specific Nanoparticle Deposition," Talk
 14.  06/25/04: Nano 2004, Satellite Workshop, Nanoparticle-Synthesis, Characterization and Properties, Duisburg, Germany
  "The Use of Electric Nanocontact Lithography to Fabricate Patterns of Charge, Oxide, and E-Beam Sensitive Resists," Poster
 13.  06/22/04: 7th International Conference on Nanostructured Materials, Wiesbaden, Germany
  "NanoXerography: The Directed Self-Assembly of Nanoparticle Building Blocks onto Charged Based Receptors," Poster
 12.  06/22/04: 7th International Conference on Nanostructured Materials, Wiesbaden, Germany
  "Approaching Programmable Reconfigurable Electric Nanocontact Lithography," Poster
 11.  06/17/04: IBM Research Laboratory Zurich, Switzerland
  "Directed Self-Assembly from Nanoparticles based Devices to Three Dimensional Microsystems," Invited Talk
 10.  06/14/04: Nanotechnology Day, Minneapolis, MN
  "Electric Nanocontact Lithography," Poster
 9.    06/14/04: Nanotechnology Day, Minneapolis, MN
  "Nanoxerographic Printers," Poster
 8.    06/03/04: IPRIME meeting, Nanoprobe Master Class, MN
  "Patterning and Characterization of Electrons and Holes using Kelvin Probe Force Microscopy," Poster.
 7.    06/03/04: DARPA Workshop / FNANO 2004, Snowbird, UT
 C. R. Barry, C. J. Hoon, and H. O. Jacobs, 
  "Approaching Programmable Self-Assembly from Nanoparticle-Based Devices to Integrated Circuits," Invited Talk
 6.    06/02/04: IPRIME meeting, Minneapolis, MN
  "Directed Self-Assembly from Nanoparticles to Integrated Systems," Talk
 5.    06/02/04: IPRIME meeting, Minneapolis, MN
 A. Welle and H. O. Jacobs, 
  "Patterning of Organic and Inorganic Nanoparticles by Electrospraying," Poster
 4.    06/02/04: IPRIME meeting, Minneapolis, MN
 T. Hatch and H. O. Jacobs, 
  "Computer Modeling of Electrostatically Directed Self-Assembly of Silicon Nanoparticles," Poster
 3.    04/14/04: MRS Spring Meeting, San Francisco, CA
 H. O. Jacobs, Jie Gu, and Chad R. Barry, 
  "Programmable Electric Nanocontact Lithography to Pattern Charge and Topography in E-beam Sensitive Resists,"Poster
 2.    04/14/04: MRS Spring Meeting, San Francisco, CA
  "Directed Self-Assembly of Nanoparticle Building Blocks onto Charged Based Receptors," Invited Talk
 1.    03/07/04: Particles 2004, Orlando, FL
  "Directed Self-Assembly of Nanoparticle Building Blocks onto Charged Based Receptors,"  Invited Talk