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Johannes Reiprich: Publikationen

Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects
M. Kaltwasser, U. Schmidt, S. Biswas, J. Reiprich, L. Schlag, N. A. Isaac, Th. Stauden, and H.O. Jacobs
ACS Appl. Mater. Interfaces, Article ASAP, DOI:10.1021/acsami.8b12390 Publication Date (Web): November 15, 2018

Stress-adaptive meander track for stretchable electronics

S. Biswas, J. Reiprich, J. Pezoldt, M. Hein, Th. Stauden,  and H.O. Jacobs
Flex. Print. Electron. 3 (2018) 032001

Metamorphic hemispherical microphone array for three-dimensional acoustics

S. Biswas, J. Reiprich, Th. Cohrs, Th. Stauden, J. Pezoldt, and H.O. Jacobs
Appl. Phys. Lett. 111, 043109 (2017)  pdfDOI: 10.1063/1.4985710

3D Metamorphic Stretchable Microphone Arrays
S. Biswas, J. Reiprich, Th. Cohrs, D.T. Arboleda, A. Schöberl, M. Mozafari, L. Schlag, Th. Stauden, J. Pezoldt, and H.O. Jacobs
Adv. Mater. Technol. 2017, 1700131   pdfDOI: 10.1002/admt.201700131

Corona Assisted Ga Based Nanowire Growth on 3C-SiC (111)/Si (111) Pseudosubstrates
J. Reiprich, Th. Stauden, T. Berthold, M. Himmerlich, J. Pezoldt, H.O. Jacobs
Materials Science Forum (Volume 897), DOI: 10.4028/