Technische Universität Ilmenau

Advanced Packaging and Assembly Technology - Modultafeln of TU Ilmenau

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module properties 100713 - common information
module number100713
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology Group)
module leaderProf. Dr. Jens Müller

Bachelor in engineering or natural sciences

Foundations of Material science

Electronics Technology or Basics of Microelectronic Packaging

learning outcome

Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications.

Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.

Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking

Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness

Details in major Master Elektrotechnik und Informationstechnik 2014 (MNE)
module nameAdvanced Packaging and Assembly Technology
credit points5
certificate of the module Individual achievements or exams
details of the certificate