Advanced Packaging and Assembly Technology - Modultafeln of TU Ilmenau
The Modultafeln have a pure informational character. The legally binding information can be found in the corresponding Studienplan and Modulhandbuch, which are served on the pages of the course offers. Please also pay attention to this legal advice (german only). Information on place and time of the actual lectures is served in the Vorlesungsverzeichnis.
|module properties 100713 - common information|
|department||Department of Electrical Engineering and Information Technology|
|ID of group||2146 (Electronics Technology Group)|
|module leader||Prof. Dr. Jens Müller|
Bachelor in engineering or natural sciences
Foundations of Material science
Electronics Technology or Basics of Microelectronic Packaging
Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications.
Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.
Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking
Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness
|Details in major Master Elektrotechnik und Informationstechnik 2014 (MNE)|
|module name||Advanced Packaging and Assembly Technology|
|certificate of the module||Individual achievements or exams|
|details of the certificate|