Technische Universität Ilmenau

Advanced Packaging and Assembly Technology - Modultafeln of TU Ilmenau

The Modultafeln have a pure informational character. The legally binding information can be found in the corresponding Studienplan and Modulhandbuch, which are served on the pages of the course offers. Please also pay attention to this legal advice (german only). Information on place and time of the actual lectures is served in the Vorlesungsverzeichnis.

subject properties subject number 5620 - common information
subject number5620
departmentDepartment of Electrical Engineering and Information Technology
ID of group2146 (Electronics Technology Group)
subject leaderProf. Dr. Jens Müller
languageDeutsch/Englisch
term Sommersemester
previous knowledge and experience

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

learning outcome

Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications.

Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.

Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking

Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness

content

Repetition of the basics of microelectronic packaging

  • Circuit board technologies
  • Assembly technologies

Packaging of components and modules

  • Packaging Roadmap
  • Interconnection types (FlipChip, BGA, CGA, LGA u.a.)
  • Multichipmodules
  • System-in-Packages (SiP)
  • System-on-Chip concept
  • Stacked IC-technology, stacked Packages (PoP)
  • Chip embedding
  • 3D-Chip-Packaging (TSV-processes)

Power-Packaging

Moulded Interconnect Device Technology

RF- and microwave packaging

MEMS-Packaging

Test and Inspection (Board, Module, AOI, X-Ray, US, ICT )

Methods of failure analysis

media of instruction
  • Powerpoint slides (also available online)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)
literature / references

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York


Rao R. Tummala, Madhavan Swaminathan: Introduction to System-on-Package (SOP), McGrawHill, ISBN 978-0-07-145906-8


3D-MID Technologie Räumliche elektronische Baugruppen, Hanser-Verlag, ISBN 3-446-22720-2.


Joseph Fjeldstad et al.: Chip Scale Packaging for modern electronics, Electrochemical Publications Ltd, ISBN 0 901150 43 6.

evaluation of teaching

Pflichtevaluation:

SS 2010 (Fach)


Freiwillige Evaluation:

Hospitation:

 

Details in major Master Micro- and Nanotechnologies 2016
subject nameAdvanced Packaging and Assembly Technology
examination number2100563
credit points5
on-campus program (h)45
self-study (h)105
Obligationobligatory elective
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants
Details in major Master Elektrotechnik und Informationstechnik 2014 (MNE)
subject nameAdvanced Packaging and Assembly Technology
examination number2100452
credit points5
on-campus program (h)45
self-study (h)105
Obligationobligatory
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants