Technische Universität Ilmenau

Electronics Technology 1 - Modultafeln of TU Ilmenau

The Modultafeln have a pure informational character. The legally binding information can be found in the corresponding Studienplan and Modulhandbuch, which are served on the pages of the course offers. Please also pay attention to this legal advice (german only). Information on place and time of the actual lectures is served in the Vorlesungsverzeichnis.

module properties 66 - common information
module number66
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology Group)
module leaderProf. Dr. Jens Müller
requirements
learning outcome

Students are able to evaluate and to differentiate requirements on microelectronic circuit boards. They learn to apply their knowledge in the electronic design process (from circuit schematic to a circuit board).
Special skills: basic knowledge of manufacturing technologies for electronic systems, knowledge of typically used materials and their properties, early identification of development trends, new technologies and techniques.
Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results.
Systems competences: understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking
Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness


 


Die Studierenden sind in der Lage Anforderungen an mikroelektronische Verbindungsträger zu beurteilen und zu differenzieren. Sie erlernen die Fähigkeit, diese Kenntnisse zur Umsetzung von Schaltungsanforderungen anzuwenden.


Fachkompetenzen: Werkstoffwissenschaftliche und ingenieurtechnische Grundlagen, frühzeitiges Erkennen von Entwicklungstrends, neuen Technologien und Techniken.
Methodenkompetenz: Systematisches Erfassen von Problemstellungen, Anwendung des Fachwissens, Umgang mit CAD-Tools, Dokumentation von Ergebnissen.
Systemkompetenzen: Verstehen der Einflüsse der technologischen Schaltungsumsetzung auf deren Funktion und Zuverlässigkeit, Entwicklung interdisziplinären Denkens.
Sozialkompetenzen: Kommunikation, Teamfähigkeit, selbstbewusstes Präsentieren; Beachtung ökologischer Aspekte in der Elektronikfertigung.

Details in major Master Micro- and Nanotechnologies 2016
module nameElectronics Technology 1
credit points6
Obligationobligatory
certificate of the module Individual achievements or exams
details of the certificate
Details in major Bachelor Elektrotechnik und Informationstechnik 2013
module nameElectronics Technology 1
credit points6
Obligationunknown
certificate of the module Individual achievements or exams
details of the certificate
subject properties subject number 66 - common information
subject number66
departmentDepartment of Electrical Engineering and Information Technology
ID of group2146 (Electronics Technology Group)
subject leaderProf. Dr. Jens Müller
languageDeutsch/Englisch
term Wintersemester
previous knowledge and experience

Basics of electrical engineering and material science

learning outcome

Students are able to design and analyze printed circuit boards, hybrid circuits and electronic assemblies and can evaluate these regarding their applicability and performance.

They are able to apply their systematic knowledge in electronics technology (e.g. in complex student projects or lab work)

content

The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.

  1. Design process and product cycle (from idea to the product)
  2. Thermal management in microelectronics
  3. Board technologies
    • Overview of available technologies
    • Materials and their properties
    • Additive and subtractive structuring processes
    • Practical work: design of a PCB
  4. Microelectronic components
  5. Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)
  6. Design and layout aspects of PCBs (electrical and thermal design)
  7. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)
  8. Basics of RF design
  9. Hybrid circuit technologies
    • Thick- and Thinfilm technology
    • LTCC technology
  10. Basics of component packaging
media of instruction
  • Powerpoint slides (also available as script)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)
literature / references

Scripts,

Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5

Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9

evaluation of teaching

Pflichtevaluation:

WS 2011/12 (Fach)

WS 2017/18 (Fach)

Freiwillige Evaluation:

Hospitation:

WS 2011/12

Details in major Master Wirtschaftsingenieurwesen 2013 (ET), Master Wirtschaftsingenieurwesen 2014 (ET), Master Wirtschaftsingenieurwesen 2015 (ET), Master Wirtschaftsingenieurwesen 2018 (ET)
subject nameElectronics Technology 1
examination number2100048
credit points6
on-campus program (h)56
self-study (h)124
Obligationobligatory elective
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants
Details in major Master Micro- and Nanotechnologies 2016
subject nameElectronics Technology 1
examination number2100553
credit points6
on-campus program (h)56
self-study (h)124
Obligationobligatory
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants
Details in major Bachelor Elektrotechnik und Informationstechnik 2013
subject nameElectronics Technology 1
examination number2100048
credit points6
on-campus program (h)56
self-study (h)124
Obligationobligatory
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants
Details in major Master Wirtschaftsingenieurwesen 2009 (ET), Master Wirtschaftsingenieurwesen 2010 (ET), Master Wirtschaftsingenieurwesen 2011 (ET)
subject nameElectronics Technology 1
examination number2100048
credit points3
on-campus program (h)34
self-study (h)56
Obligationobligatory
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants
Details in major Master Wirtschaftsingenieurwesen 2009, Master Wirtschaftsingenieurwesen 2010
subject nameElectronics Technology 1
examination number2100048
credit points3
on-campus program (h)34
self-study (h)56
Obligationobligatory elective
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants
Details in major Bachelor Elektrotechnik und Informationstechnik 2008
subject nameElectronics Technology 1
examination number2100048
credit points4
on-campus program (h)34
self-study (h)86
Obligationobligatory
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants