3D-Materialanalytik - Modultafeln of TU Ilmenau

The Modultafeln have a pure informational character. The legally binding information can be found in the corresponding Studienplan and Modulhandbuch, which are served on the pages of the course offers. Please also pay attention to this legal advice (german only). Information on place and time of the actual lectures is served in the Vorlesungsverzeichnis.

subject properties subject number 101365 - common information
subject number	101365
department	Department of Electrical Engineering and Information Technology
ID of group	2172 (Group of Materials for Electrical Engineering and Electronics)
subject leader	Prof. Dr. Peter Schaaf
language	Englisch
term	Wintersemester
previous knowledge and experience	<p><span id="part1"><span dir="none">Basic knowledge of materials science, physics and chemistry. Basic knowledge in material analysis.</span></span></p>
learning outcome	<p><span id="part1"><span dir="none">The students get to know methods for 3D material analysis. They can assess the prerequisites and conditions for such methods and select and apply the right methods for specific problems.</span></span></p>
content	Dozent: Dr. Thomas Kups Content: - Introduction: Definitions: Analytics, Methods, 3D - scanning probe microscopy RTM, AFM, LFM, SNOM Mode of operation, parameters, possible applications - electron microscopy TEM imaging and analysis modes: SAED, CBED, HRTEM, EDX, EELS; Crystallographic Analysis REM SE, BSE, EDX, EBSD - ion microscopy Focussed Ion Beam (for EBSD), 3D-FIB - Field emission / atomic probe microscopy - 3D computer tomography Working methods, image reconstruction, artefacts The lecture is supplemented by exercises and seminar talks accompanying the lecture.
media of instruction	PowerPoint, script, exercises, seminar talks, Animations, Videos
literature / references	a selection of literature: O‘Connor, Sexton, Smart, „Surface Analysis Methods in Material Science“, Springer Verlag Berlin 2008, ISBN 3-540-41330-8 van Tendeloo, van Dyck, Pennycook (Hrsg.), Handbook of Nanoscopy, Wiley-VCH Verlag Weinheim, 2012, ISBN 978-3-527-31706-6 Bruce, O'Hare, Walton, Inorganic Materials Series – Multi Length-Scale Characterisation, Wiley-VCH Verlag Weinheim 2014, ISBN 978-1-118-94102-7 Bruce, O'Hare, Walton, Inorganic Materials Series – Local Structural Characterisaion, Wiley-VCH Verlag Weinheim 2014, ISBN 978-1-118-94102-7 Zhou, Wang (Eds.), „Scanning Microscopy for Nanotechnology - Techniques and Applications”, Springer-Verlag Berlin 2006, ISBN 978-0-387-33325-0 Morita, Wiesendanger, Meyer, „Noncontact Atomic Force Microscopy“, Springer Verlag Berlin 2002, ISBN 3-540-43117-9 Reimer,L. „Scanning Electron Microscopy: Physics of Image Formation and Microanalysis”, Springer Verlag Berlin 1986, ISBN 0-387-13530-8 Goldstein, „Scanning Electron Microscopy and X-Ray Microanalysis”, Plenum Press New York 1992, ISBN 978-1-4612-7653-1 Bethge, Heidenreich, „Elektronenmikroskopie in der Festkörperphysik“ Springer Verlag Berlin, 1982 ISBN 3-540-11361-4 Williams, Carter, „Transmission Electron Microscopy“, Plenum Press New York 2009, ISBN 978-0-387-76500-6 Buzug, Th. M, Einführung in die Computertomographie - Mathematisch-physikalische Grundlagen der Bildrekonstruktion, Springer-Verlag Berlin 2004, ISBN 978-3-540-20808-2
evaluation of teaching

Details in major Master Micro- and Nanotechnologies 2016
subject name	3D-Materialanalytik
examination number	2100568
credit points	5
on-campus program (h)	45
self-study (h)	105
Obligation	obligatory elective
exam	written examination performance, 90 minutes
details of the certificate	oral examination 30 min
Signup details for alternative examinations
maximum number of participants

Details in major Master Werkstoffwissenschaft 2013, Master Elektrotechnik und Informationstechnik 2014 (MNE)
subject name	3D Material Analysis
examination number	2100543
credit points	5
on-campus program (h)	45
self-study (h)	105
Obligation	obligatory elective
exam	written examination performance, 90 minutes
details of the certificate	mündliche Prüfung 30 min
Signup details for alternative examinations
maximum number of participants