Technische Universität Ilmenau

3D Material Analysis - Modultafeln of TU Ilmenau

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Please refer to the respective study and examination rules and regulations for the legally binding curricula (Annex Curriculum).

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module properties module number 101365 - common information
module number101365
departmentDepartment of Electrical Engineering and Information Technology
ID of group2172 (Materials for Electrical Engineering and Electronics)
module leaderProf. Dr. Peter Schaaf
languageEnglisch
term Wintersemester
previous knowledge and experience<p><span id="part1"><span dir="none">Basic knowledge of materials science, physics and chemistry. Basic knowledge in material analysis.</span></span></p>
learning outcome<p><span id="part1"><span dir="none">The students get to know methods for 3D material analysis. They can assess the prerequisites and conditions for such methods and select and apply the right methods for specific problems.</span></span></p>
content

Dozent: Dr. Thomas Kups

Content:

- Introduction: Definitions: Analytics, Methods, 3D

- scanning probe microscopy RTM, AFM, LFM, SNOM Mode of operation, parameters, possible applications

- electron microscopy TEM imaging and analysis modes: SAED, CBED, HRTEM, EDX, EELS; Crystallographic Analysis REM SE, BSE, EDX, EBSD

- ion microscopy Focussed Ion Beam (for EBSD), 3D-FIB

- Field emission / atomic probe microscopy

- 3D computer tomography Working methods, image reconstruction, artefacts

The lecture is supplemented by exercises and seminar talks accompanying the lecture.

 

media of instruction and technical requirements for education and examination in case of online participation

PowerPoint, script, exercises, seminar talks, Animations, Videos

literature / references

a selection of literature:

  • O‘Connor, Sexton, Smart, „Surface Analysis Methods in Material Science”, Springer Verlag Berlin 2008, ISBN 3-540-41330-8
  • van Tendeloo, van Dyck, Pennycook (Hrsg.), Handbook of Nanoscopy, Wiley-VCH Verlag Weinheim, 2012, ISBN 978-3-527-31706-6
  • Bruce, O'Hare, Walton, Inorganic Materials Series – Multi Length-Scale Characterisation, Wiley-VCH Verlag Weinheim 2014, ISBN 978-1-118-94102-7
  • Bruce, O'Hare, Walton, Inorganic Materials Series – Local Structural Characterisaion, Wiley-VCH Verlag Weinheim 2014, ISBN 978-1-118-94102-7
  • Zhou, Wang (Eds.), „Scanning Microscopy for Nanotechnology - Techniques and Applications”, Springer-Verlag Berlin 2006, ISBN 978-0-387-33325-0
  • Morita, Wiesendanger, Meyer, „Noncontact Atomic Force Microscopy”, Springer Verlag Berlin 2002, ISBN 3-540-43117-9
  • Reimer,L. „Scanning Electron Microscopy: Physics of Image Formation and Microanalysis”, Springer Verlag Berlin 1986, ISBN 0-387-13530-8
  • Goldstein, „Scanning Electron Microscopy and X-Ray Microanalysis”, Plenum Press New York 1992, ISBN 978-1-4612-7653-1
  • Bethge, Heidenreich, „Elektronenmikroskopie in der Festkörperphysik” Springer Verlag Berlin, 1982 ISBN 3-540-11361-4
  • Williams, Carter, „Transmission Electron Microscopy”, Plenum Press New York 2009, ISBN 978-0-387-76500-6
  • Buzug, Th. M, Einführung in die Computertomographie - Mathematisch-physikalische Grundlagen der Bildrekonstruktion, Springer-Verlag Berlin 2004, ISBN 978-3-540-20808-2
evaluation of teaching
Details reference subject
module name3D Material Analysis
examination number2100543
credit points5
SWS4
on-campus program (h)45
self-study (h)105
obligationobligatory module
examwritten examination performance, 90 minutes
details of the certificate

mündliche Prüfung 30 min

alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants
Details in degree program Master Werkstoffwissenschaft 2013
module name3D Material Analysis
examination number2100543
credit points5
on-campus program (h)45
self-study (h)105
obligationelective module
examwritten examination performance, 90 minutes
details of the certificate

mündliche Prüfung 30 min

alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants