Technische Universität Ilmenau

3D Material Analysis - Modultafeln of TU Ilmenau

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module properties module number 200603 - common information
module number200603
departmentDepartment of Electrical Engineering and Information Technology
ID of group2172 (Materials for Electrical Engineering and Electronics)
module leaderProf. Dr. Peter Schaaf
languageEnglisch
term Sommersemester
previous knowledge and experience

Basic knowledge of materials science, physics and chemistry. Basic knowledge in material analysis methods.

learning outcome

Students can repeat the basic properties of material analysis.

Students can describe the basic differences between different analytical techniques.

Students can explain and compare the basic analytical methods for thin film, bulk and surface investigations.

Students can interpret various results (images and/or diagrams) of thin film, bulk and surface investigations.

Students can analyze materials properties in surfaces and thin films or even bulk materials.

Students can propose different methods for the 2D and 3D-characterization of materials

Students can interpret and judge results of surface and thin film measurements.

Students can judge about the use of analytica techniques and select and apply the right methods for specific problems

They know the prerequisites and conditions for such methods methods

They can apply their knowledge and competences to new material systems. They can present and scientifically discuss a given topic in the exercises.

After intensive discussions and group work during the exercises, the students can correctly assess and appreciate the achievements of their fellow students. They take criticism, heed remarks and accept suggestions.

content

Teacher: Dr. Thomas Kups

Factual Competencies:

  1. Introduction
  2. Definitions: Analytics, Methods
  3. Scanning probe microscopy
    RTM, AFM, LFM, SNOM
    Mode of operation, parameters, possible applications
  4. electron microscopy
    TEM imaging and analysis modes: SAED, CBED, HRTEM, EDX, EELS; Crystallographic Analysis
    REM SE, BSE, EDX, EBSD
  5. ion microscopy
    Focussed Ion Beam (for EBSD), 3D-FIB
    Field emission / atomic probe microscopy
  6. 3D computer tomography
    Working methods, image reconstruction, artefacts

Methodological Competences

Students can propose and plan materials analyses for 3D material analsis. They are able to convert measurements to material representations and correlation with the properties of materials.

Self-reflecting competences

Students know how to deal with material analysis methods and can judge about deficiencies and limitations. They know how to extend the problem and find a solution.

Social Competences

After the seminar, the students have gain ed deeper knowledge for selected examples, and they have learned how to search information and how to present this in a talk and to discuss the problems. After intensive discussions and group work during the exercises, the students can correctly assess and appreciate the achievements of their fellow students. They take criticism, heed remarks and accept suggestions.

The lecture is supplemented by exercises and seminar talks accompanying the lecture.

media of instruction and technical requirements for education and examination in case of online participation

PowerPoint and blackboard, excercises, talks, animations, examples, videos, scriptum

literature / references

A list of relevant literature will be provided at the course beginning via moodle. A possible selection is given here:

  • O'Connor, Sexton, Smart, "Surface Analysis Methods in Material Science", Springer Verlag Berlin 2008, ISBN 3-540-41330-8
  • van Tendeloo, van Dyck, Pennycook (Hrsg.), Handbook of Nanoscopy, Wiley-VCH Verlag Weinheim, 2012, ISBN 978-3-527-31706-6
  • Bruce, O'Hare, Walton, Inorganic Materials Series - Multi Length-Scale Characterisation, Wiley-VCH Verlag Weinheim 2014, ISBN 978-1-118-94102-7
  • Bruce, O'Hare, Walton, Inorganic Materials Series - Local Structural Characterisaion, Wiley-VCH Verlag Weinheim 2014, ISBN 978-1-118-94102-7
  • Zhou, Wang (Eds.), "Scanning Microscopy for Nanotechnology - Techniques and Applications", Springer-Verlag Berlin 2006, ISBN 978-0-387-33325-0
  • Morita, Wiesendanger, Meyer, "Noncontact Atomic Force Microscopy", Springer Verlag Berlin 2002, ISBN 3-540-43117-9
  • Reimer,L. "Scanning Electron Microscopy: Physics of Image Formation and Microanalysis", Springer Verlag Berlin 1986, ISBN 0-387-13530-8
  • Goldstein, "Scanning Electron Microscopy and X-Ray Microanalysis", Plenum Press New York 1992, ISBN 978-1-4612-7653-1
  • Bethge, Heidenreich, "Elektronenmikroskopie in der Festkörperphysik" Springer Verlag Berlin, 1982 ISBN 3-540-11361-4
  • Williams, Carter, "Transmission Electron Microscopy", Plenum Press New York 2009, ISBN 978-0-387-76500-6
  • Buzug, Th. M, Einführung in die Computertomographie - Mathematisch-physikalische Grundlagen der Bildrekonstruktion, Springer-Verlag Berlin 2004, ISBN 978-3-540-20808-2

evaluation of teaching
Details reference subject
module name3D Material Analysis
examination number2100953
credit points5
SWS4 (2 V, 2 Ü, 0 P)
on-campus program (h)45
self-study (h)105
obligationobligatory module
examwritten examination performance, 90 minutes
details of the certificate
alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants
Details in degree program Master Werkstoffwissenschaft 2013, Master Elektrotechnik und Informationstechnik 2014 (MNE), Master Micro- and Nanotechnologies 2016, Master Werkstoffwissenschaft 2021, Master Elektrotechnik und Informationstechnik 2021, Master Micro- and Nanotechnologies 2021
module name3D Material Analysis
examination number2100953
credit points5
on-campus program (h)45
self-study (h)105
obligationelective module
examwritten examination performance, 90 minutes
details of the certificate
alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants