Technische Universität Ilmenau

Funktionalisierte Peripherik - Modultafeln of TU Ilmenau

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module properties Funktionalisierte Peripherik in degree program Master Micro- and Nanotechnologies 2008
ATTENTION: not offered anymore
module number5625
examination number2000009
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology)
module leaderProf. Dr. Jens Müller
term winter term only
credit points4
on-campus program (h)34
self-study (h)86
obligationobligatory module
examoral examination performance, 30 minutes
details of the certificate
alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants
previous knowledge and experience

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

learning outcome

Modern microelectronic components, packages and devices require different interfaces to connect the periphery electrically, thermally, mechanically, optically and fluidly in order to meet the requirements on power management, data transmission band width, signal frequency etc. These specific functions are covered in the lecture Functionalized Peripherics.

Students are able to identify and differentiate the requirements on the interface between nano structures (semiconductor) and the circuit board technology. They develop the ability to apply this knowledge for the conversion of electronic circuit requirements to the products and processes.

Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.

Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking

Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness


1) In-depth module circuit board technology

  • Thick- and thinfilm processes
  • LTCC-technology
  • Flexible printed circuit boards
  • stretchable electronics
  • Silicon/ceramic composite substrates

2) RF- and microwave board technologies

  • Materials, properties
  • Lumped integrated passive components
  • Distributed integrated passive components
  • Design
  • Measurement principles

3) Ceramic sensors and actuators

  • Application scenarios
  • Sensor principles
  • Construction of ceramic sensors and actors
  • Sensor packaging

4) Ceramic technologies for microelectronic and microfluidic systems

  • Requirements and properties
  • Design
  • Technologies and processes
  • Applications

5) Microelectronic design- and manufacturing processes

  • Development process
  • Design of experiments approach
  • Reliability
  • Quality control in production

6) Micro-Nano- and Photonic Integration

  • Nanotechnology for Packaging
  • Optical Packages and Boards

7) Selected applications

  • Biomedical implants
  • Fotovoltaics
  • Solid State Ligthing
media of instruction and technical requirements for education and examination in case of online participation
  • Powerpoint slides (also available as script)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)
literature / references

Handbuch der Leiterplattentechnik Band 4, Eugen G. Leuze Verlag, Bad Saulgau, 2003, ISBN 3-87480-184-5.

Scheel, Wolfgang: Baugruppen-Technologie der Elektronik. Montage Verlag Technik, Berlin 1999.

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York.

evaluation of teaching


Freiwillige Evaluation: