Funktionalisierte Peripherik - Modultafeln of TU Ilmenau
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module properties Funktionalisierte Peripherik
in degree program Master Micro- and Nanotechnologies 2008
ATTENTION: not offered anymore
|department||Department of Electrical Engineering and Information Technology|
|ID of group||2146 (Electronics Technology)|
|module leader||Prof. Dr. Jens Müller|
|term||winter term only|
|on-campus program (h)||34|
|exam||oral examination performance, 30 minutes|
|details of the certificate|
|alternative examination performance due to COVID-19 regulations incl. technical requirements|
|signup details for alternative examinations|
|maximum number of participants|
|previous knowledge and experience|
Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging
Modern microelectronic components, packages and devices require different interfaces to connect the periphery electrically, thermally, mechanically, optically and fluidly in order to meet the requirements on power management, data transmission band width, signal frequency etc. These specific functions are covered in the lecture Functionalized Peripherics.
Students are able to identify and differentiate the requirements on the interface between nano structures (semiconductor) and the circuit board technology. They develop the ability to apply this knowledge for the conversion of electronic circuit requirements to the products and processes.
Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.
Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking
Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness
1) In-depth module circuit board technology
2) RF- and microwave board technologies
3) Ceramic sensors and actuators
4) Ceramic technologies for microelectronic and microfluidic systems
5) Microelectronic design- and manufacturing processes
6) Micro-Nano- and Photonic Integration
7) Selected applications
|media of instruction and technical requirements for education and examination in case of online participation|
|literature / references|
Handbuch der Leiterplattentechnik Band 4, Eugen G. Leuze Verlag, Bad Saulgau, 2003, ISBN 3-87480-184-5.
Scheel, Wolfgang: Baugruppen-Technologie der Elektronik. Montage Verlag Technik, Berlin 1999.
Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York.
|evaluation of teaching|