Technische Universität Ilmenau

Electronics Technology 1 - Modultafeln of TU Ilmenau

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module properties Electronics Technology 1 in degree program Master Wirtschaftsingenieurwesen 2021 (ET)
module number200573
examination number2100915
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology)
module leaderProf. Dr. Jens Müller
term winter term only
credit points5
on-campus program (h)56
self-study (h)94
obligationobligatory module
examwritten examination performance, 90 minutes
details of the certificate
signup details for alternative examinations
maximum number of participants
previous knowledge and experience

Basics of electrical engineering and material science

learning outcome

After the lectures and exercises the students are able to design and analyze printed circuit boards, hybrid circuits and electronic assemblies and can evaluate these regarding their applicability and performance.

They are able to apply their systematic knowledge in electronics technology (e.g. in complex student projects or lab work).


The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.

  1. Design process and product cycle (from idea to the product)
  2. Thermal management in microelectronics
  3. Board technologies
    • Overview of available technologies
    • Materials and their properties
    • Additive and subtractive structuring processes
    • Practical work: design of a PCB
  4. Microelectronic components
  5. Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)
  6. Design and layout aspects of PCBs (electrical and thermal design)
  7. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)
  8. Basics of RF design
  9. Hybrid circuit technologies
    • Thick- and Thinfilm technology
    • LTCC technology
  10. Basics of component packaging

follow the link in moodle:

media of instruction

. Powerpoint slides (also available as script)
. Videos
. Writings on the board
. Exercises (presented by both students and lecturer)

Technical requirements for online participation:
Internet access with 600 kB/s or faster
Computer / laptop with operable camera and microphone

literature / references

Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5
Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9

evaluation of teaching