Technische Universität Ilmenau

Advanced Packaging and Assembly Technology - Modultafeln of TU Ilmenau

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Please refer to the respective study and examination rules and regulations for the legally binding curricula (Annex Curriculum).

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module properties module number 200576 - common information
module number200576
departmentDepartment of Electrical Engineering and Information Technology
ID of group2146 (Electronics Technology)
module leaderProf. Dr. Jens Müller
languageEnglisch
term Sommersemester
previous knowledge and experience

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

learning outcome

After the lectures and exercises the students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications.

Special skills: Students know the basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.

Methodological competences: Students can systematically identify problems and requirements. They can applicate state of the art knowledge, are familiar with computer aided design and documentation of results.

Systems competences: Students understand the correlations between design/material/technology and function/system reliability. They have the ability to interdisciplinary thinking

Social competences: Students are able to active communication, have the ability to work in a team and can self-confidently present results. They have developed environmental consciousness.

content

Repetition of the basics of microelectronic packaging

  • Circuit board technologies
  • Assembly technologies

Packaging of components and modules

  • Packaging Roadmap
  • Interconnection types (FlipChip, BGA, CGA, LGA u.a.)
  • Multichipmodules
  • System-in-Packages (SiP)
  • System-on-Chip concept
  • Stacked IC-technology, stacked Packages (PoP)
  • Chip embedding
  • 3D-Chip-Packaging (TSV-processes)

Power-Packaging

Moulded Interconnect Device Technology

RF- and microwave packaging

MEMS-Packaging

Test and Inspection (Board, Module, AOI, X-Ray, US, ICT )

Methods of failure analysis

media of instruction and technical requirements for education and examination in case of online participation
  • Powerpoint slides (also available online)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)
literature / references

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York

Rao R. Tummala, Madhavan Swaminathan: Introduction to System-on-Package (SOP), McGrawHill, ISBN 978-0-07-145906-8

3D-MID Technologie Räumliche elektronische Baugruppen, Hanser-Verlag, ISBN 3-446-22720-2.

Joseph Fjeldstad et al.: Chip Scale Packaging for modern electronics, Electrochemical Publications Ltd, ISBN 0 901150 43 6.

evaluation of teaching
Details reference subject
module nameAdvanced Packaging and Assembly Technology
examination number2100918
credit points5
SWS4 (2 V, 2 Ü, 0 P)
on-campus program (h)45
self-study (h)105
obligationobligatory module
examoral examination performance, 30 minutes
details of the certificate
alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants
Details in degree program Master Micro- and Nanotechnologies 2016, Master Micro- and Nanotechnologies 2021
module nameAdvanced Packaging and Assembly Technology
examination number2100918
credit points5
on-campus program (h)45
self-study (h)105
obligationelective module
examoral examination performance, 30 minutes
details of the certificate
alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants