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Prof. Matthias Hein

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DFG Research Unit FOR 1522 MUSIK

"Multiphysical Synthesis and Integration of Complex RF Circuits"



  • Benefits of Silicon and LTCC Technology
    => SiCer Composite Substrate

  • Multiphysical Design of RF-Micromechatronics

  • Consistent Cross-Layer Design through all Abstraction Levels

  • Nine Subprojects contribute to one Demonstrator

  • High Level Research in Methodology, Design and Fabrication


The key constituents of micro-electromechanical systems (MEMS) are mechanically flexible devices on the micrometre scale, where the mechanical motions can be excited and detected by electrical signals. The DFG Research Unit MUSIK aims at including the basic functions of MEMS at high frequencies, such as amplifying, controlling, oscillating, and switching, into the design of complex radio frequency (RF) circuits. Through the combination of micro-electronic and micro-mechanic properties at device, circuit, and system levels, a novel circuit technology “RF micromechatronics” is made accessible. As a consequence, the research focus on RF-MEMS is steered from the technology and single-device levels to an application-oriented system level, e.g., for mobile communications.

The DFG Research Unit MUSIK consist of eight projects carried out at the RF & Microwave Research Laboratory (HMT), the Electronic Circuits and Systems Group (ESS), the Micromechanical Systems Group (MMS), and the Electronics Technology Group (ET) at Ilmenau University of Technology; at the Chair for Technical Electronics (LTE) at the Friedrich-Alexander-University Erlangen-Nuremberg; and at the IMMS Ilmenau. Resulting from the co-operation of researchers from different scientific disciplines, a core approach of MUSIK is the multi-physical modelling and simulation, which explicitly accounts for the coupled electric and mechanic properties of MEMS in relation to their mathematical description as well as the physically different effects of electronic and mechanic functions, including their unwanted and wanted parasictics. This fundamental approach is accompanied by a substrate technology tailored to the simultaneous implementation of micro-electronic and micro-mechanic devices, namely by merging silicon and ceramic technologies into a novel compound substrate (SiCer), originally investigated at the IMN MacroNano® at Ilmenau University of Technology.

The following objectives are jointly addressed, investigated in complementary subprojects, and verified respectively demonstrated jointly: Model and system design and system analysis of complex RF circuits; integrated micro-electronic-micro-electromechanic RF components and circuits; system simulation and integration analysis of non-ideal RF MEMS; simulations and tests crossing multiple abstraction levels; micro-mechanic and micro-electronic integration in SiCer substrate technology; demonstration of the approach in terms of selected subsystems. To achieve these goals a concept for continuous design and verification is developed including all abstraction levels (K-, F-, ME- and MEM-systems). As an effect the various subprojects are able to optimize their cooperation and to get better research results. This symbiosis can be described well by the following illustration.