Direct polymer microcantilever fabrication from free-standing dry film photoresists. - In: Journal of micromechanics and microengineering, ISSN 1361-6439, Bd. 30 (2020), 9, 095012, S. 1-13
https://doi.org/10.1088/1361-6439/ab9e4c
Progress of nanopositioning and nanomeasuring machines for cross-scale measurement with sub-nanometre precision. - In: Measurement science and technology, ISSN 1361-6501, Volume 31 (2020), number 8, 085005, Seite 1-8
https://doi.org/10.1088/1361-6501/ab848c
Nanopositioning and nanomeasuring machine for multi-sensor applications. - In: Measuring Equipment and Metrology, ISSN 2617-846X, Bd. 81 (2020), 2, S. 17-24
In micro- and nanotechnology, the demands placed on measurement technology are increasing. The structures to be measured are becoming more complex with smaller structure widths, increasingly larger surface regions, and thousands of inspection features. To solve the problems, it has become desirable and even necessary to combine multi-sensor technology with high precision nanopositioning and nano measuring technology. The Nanopositioning and Nanomeasuring Machine NMM-1 with a measuring range of 25 mm × 25 mm × 5 mm and sub-nanometer resolution allow the application of several optical, tactile and atomic force probes. The combination of several sensor technologies in a multi-sensor approach for application with the NMM-1 is demonstrated.
https://doi.org/10.23939/istcmtm2020.02.017
Structural and local electronic properties of clean and Li-intercalated graphene on SiC(0001). - In: Surface science, ISSN 1879-2758, Bd. 699 (2020), 121638
https://doi.org/10.1016/j.susc.2020.121638
The revised International System of Units (SI) and the resulting new potentials :
Das erneuerte Internationale Einheitensystem (SI) und seine Potenziale. - In: Technisches Messen, ISSN 2196-7113, Bd. 87 (2020), 4, S. 223-225
Editorial
https://doi.org/10.1515/teme-2020-0007
New ways to calibrate E2 mass standards and realization of forces up to 10 N :
Neue Wege zur Kalibrierung von E2-Massenormalen und Darstellung von Kräften bis 10 N. - In: Technisches Messen, ISSN 2196-7113, Bd. 87 (2020), 4, S. 280-293
https://doi.org/10.1515/teme-2019-0143
Cryogenic etching for pattern transfer into silicon of Mix-and-Match structured resist layers. - In: Microelectronic engineering, Bd. 227 (2020), 111325, insges. 5 S.
A Mix-and-Match lithography method for a high-resolution, high-precision and cost effective lithography tool using DLW and FE-SPL was developed and successfully realized. The pattern transfer from the photoresist to the silicon substrate is done by so-called "cryogenic etching". It means that the substrate is cooled down to cryogenic temperatures. In contrast to etching processes at standard room temperature, the cryogenic temperatures (below -100 ˚C) enable a highly anisotropic etching process. The difference between etching at room temperature compared to cryogenic etching is carried out in this work. The advantages of the etching process are highlighted for the pattern transfer from Mix-and-Match-structured samples. Therefore, the used photoresist mr-P 1201LIL (microresist technologies GmbH) has been examined concerning its silicon-to-resist selectivity which could be determined to be 6:1 for the applied etching recipe. Using cryogenic etching, we are now able to transfer the Mix-and-Match-structured patterns into silicon with appreciable high selectivities. This opens a novel pathway for the manufacturing of quantum devices on large wafers. The paper discusses current research results based on the TU Ilmenau Nanopositioning and Nanomeasuring Machines (NPMM) including the novel application of nanofabrication. First, the basic setup and the resulting benefits of the NPMMs for measuring and fabrication in a working volume of up to 200 mm × 200 mm × 25 mm while abiding nanometer accuracy is described. This is in contradiction to state-of-the-art AFM scanners, which have a limited working range of appr. 100 [my]m × 100 [my]m. Next, the principle and the results of different nanofabrication technologies are shown. These include Scanning Probe Lithography (SPL), Direct Laser Writing (DLW) and UV-nanoimprint lithography (NIL). Last, efforts for further improving the feature placement accuracy of the NPMMs as well as attempts to combine several fabrication technologies to improve their throughput are touched on.
https://doi.org/10.1016/j.mee.2020.111325
Challenges of temperature measurement during the friction stir welding process. - In: Measuring Equipment and Metrology, ISSN 2617-846X, Bd. 81 (2020), 1, insges. 8 S.
The exact determination of the process zone temperature can be considered as an increasingly important role in the control and monitoring of the friction stir welding process (FSW). At present, temperature measurement is carried out with the aid of a temperature sensor integrated into the tool (usually thermocouples). Since these cannot be attached directly to the joining area, heat dissipation within the tool and to the environment cause measurement deviations as well as a time delay in the temperature measurement. The article describes a process and the challenges that arise in this process, how a direct temperature measurement during the process can be achieved by exploiting the thermoelectric effect between tool and workpiece, without changing the tool by introducing additional temperature sensors.
https://doi.org/10.23939/istcmtm2020.01.034
Crystallinity, thermal diffusivity, and electrical conductivity of carbon black filled polyamide 46. - In: Journal of applied polymer science, ISSN 1097-4628, Bd. 137 (2020), 29, 48882, S. 1-10
https://doi.org/10.1002/app.48882
Linear displacement calibration system integrated with a novel auto-alignment module for optical axes. - In: Sensors, ISSN 1424-8220, Bd. 20 (2020), 9, 2462, insges. 13 S.
https://doi.org/10.3390/s20092462