Advanced Packaging and Assembly Technology - Interactive curriculae of TU Ilmenau
The interactive curriculae provide information on the degree programmes offered by the TU Ilmenau.
Please refer to the respective study and examination rules and regulations for the legally binding curricula (Annex Curriculum).
You can find all details on planned lectures and classes in the course catalogue.
Please note that this page is no longer updated. All modules and study plans from PO version 2021 onwards (Bachelor and Master study programs) are now available on the Campus Portal.
| module properties module number 100713 - common information | |
|---|---|
| module number | 100713 |
| department | Department of Electrical Engineering and Information Technology |
| ID of group | 2146 (Electronics Technology) |
| module leader | Prof. Dr. Jens Müller |
| language | |
| term | unbekannt |
| previous knowledge and experience | |
| learning outcome | Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications. Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques. Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness |
| content | |
| media of instruction and technical requirements for education and examination in case of online participation | |
| literature / references | |
| evaluation of teaching | |
| Details reference subject | |
|---|---|
| module name | Advanced Packaging and Assembly Technology |
| examination number | 90100 |
| credit points | 5 |
| SWS | 0 |
| on-campus program (h) | 0 |
| self-study (h) | 150 |
| obligation | obligatory module |
| exam | multiple performances |
| details of the certificate | |
| link to Moodle course | |
| teacher | |
| signup details for alternative examinations | |
| maximum number of participants | |