Advanced Packaging and Assembly Technology - Interactive curriculae of TU Ilmenau
The interactive curriculae provide information on the degree programmes offered by the TU Ilmenau.
Please refer to the respective study and examination rules and regulations for the legally binding curricula (Annex Curriculum).
You can find all details on planned lectures and classes in the course catalogue.
Please note that this page is no longer updated. All modules and study plans from PO version 2021 onwards (Bachelor and Master study programs) are now available on the Campus Portal.
| module properties module number 5620 - common information | |
|---|---|
| module number | 5620 |
| department | Department of Electrical Engineering and Information Technology |
| ID of group | 2146 (Electronics Technology) |
| module leader | Prof. Dr. Jens Müller |
| language | Deutsch/Englisch |
| term | Sommersemester |
| previous knowledge and experience | Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging |
| learning outcome | Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications. Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques. Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness |
| content | Repetition of the basics of microelectronic packaging
Packaging of components and modules
Power-Packaging Moulded Interconnect Device Technology RF- and microwave packaging MEMS-Packaging Test and Inspection (Board, Module, AOI, X-Ray, US, ICT ) Methods of failure analysis |
| media of instruction and technical requirements for education and examination in case of online participation |
|
| literature / references | Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York
|
| evaluation of teaching | |
| Details reference subject | |
|---|---|
| module name | Advanced Packaging and Assembly Technology |
| examination number | 2100563 |
| credit points | 5 |
| SWS | 4 |
| on-campus program (h) | 45 |
| self-study (h) | 105 |
| obligation | obligatory module |
| exam | alternative examination performance |
| details of the certificate | Die alternative Prüfungsleistung besteht aus - schriftliche Prüfungsleistung (60 Minuten) mit einer Wichtung von 50% - alternative Prüfungsleistung mit einer Wichtung von 50%
Details for examination part 2: - Writing a seminar paper with a final presentation (Erstellen einer Seminararbeit mit abschließender Präsentation) - only offered in summer semester |
| link to Moodle course | https://moodle.tu-ilmenau.de/enrol/index.php?id=2958 |
| teacher | Prof. Dr.-Ing. Jens Müller |
| signup details for alternative examinations | Dieses Modul enthält mindestens eine alternative semesterbegleitende Abschlussleistung. Bitte beachten Sie, dass diese in der Regel schon zu Beginn des Semesters, in dem diese angeboten wird, angemeldet werden muss. This module contains at least one alternative exam part. Please note that this must usually be registered at the beginning of the semester in which it is offered. |
| maximum number of participants | |
| Details in degree program Diplom Elektrotechnik und Informationstechnik 2017 | |
|---|---|
| module name | Advanced Packaging and Assembly Technology |
| examination number | 2100563 |
| credit points | 5 |
| on-campus program (h) | 45 |
| self-study (h) | 105 |
| obligation | elective module |
| exam | alternative examination performance |
| details of the certificate | Die alternative Prüfungsleistung besteht aus - schriftliche Prüfungsleistung (60 Minuten) mit einer Wichtung von 50% - alternative Prüfungsleistung mit einer Wichtung von 50%
Details for examination part 2: - Writing a seminar paper with a final presentation (Erstellen einer Seminararbeit mit abschließender Präsentation) - only offered in summer semester |
| link to Moodle course | https://moodle.tu-ilmenau.de/enrol/index.php?id=2958 |
| signup details for alternative examinations | Dieses Modul enthält mindestens eine alternative semesterbegleitende Abschlussleistung. Bitte beachten Sie, dass diese in der Regel schon zu Beginn des Semesters, in dem diese angeboten wird, angemeldet werden muss. This module contains at least one alternative exam part. Please note that this must usually be registered at the beginning of the semester in which it is offered. |
| maximum number of participants | |
| Details in degree program Master Elektrotechnik und Informationstechnik 2014 (MNE) | |
|---|---|
| module name | Advanced Packaging and Assembly Technology |
| examination number | 2100452 |
| credit points | 5 |
| on-campus program (h) | 45 |
| self-study (h) | 105 |
| obligation | obligatory module |
| exam | alternative examination performance |
| details of the certificate | Die alternative Prüfungsleistung besteht aus - schriftliche Prüfungsleistung (60 Minuten) mit einer Wichtung von 50% - alternative Prüfungsleistung mit einer Wichtung von 50%
Details for examination part 2: - Writing a seminar paper with a final presentation (Erstellen einer Seminararbeit mit abschließender Präsentation) - only offered in summer semester |
| link to Moodle course | https://moodle.tu-ilmenau.de/enrol/index.php?id=2958 |
| signup details for alternative examinations | Dieses Modul enthält mindestens eine alternative semesterbegleitende Abschlussleistung. Bitte beachten Sie, dass diese in der Regel schon zu Beginn des Semesters, in dem diese angeboten wird, angemeldet werden muss. This module contains at least one alternative exam part. Please note that this must usually be registered at the beginning of the semester in which it is offered. |
| maximum number of participants | |