Technische Universität Ilmenau

Elektroniktechnologie 1 - Modultafeln der TU Ilmenau

Die Modultafeln sind ein Informationsangebot zu den Studiengängen der TU Ilmenau.

Die rechtsverbindlichen Studienpläne entnehmen Sie bitte den jeweiligen Studien- und Prüfungsordnungen (Anlage Studienplan).

Alle Angaben zu geplanten Lehrveranstaltungen finden Sie im elektronischen Vorlesungsverzeichnis.

Informationen und Handreichungen zur Pflege von Modulbeschreibungen durch die Modulverantwortlichen finden Sie unter Modulpflege.

Hinweise zu fehlenden oder fehlerhaften Modulbeschreibungen senden Sie bitte direkt an modulkatalog@tu-ilmenau.de.

Modulinformationen zu Elektroniktechnologie 1 im Studiengang Bachelor Elektrotechnik und Informationstechnik 2013
Modulnummer66
Prüfungsnummer2100048
FakultätFakultät für Elektrotechnik und Informationstechnik
Fachgebietsnummer 2146 (Elektroniktechnologie)
Modulverantwortliche(r)Prof. Dr. Jens Müller
TurnusWintersemester
SpracheDeutsch/Englisch
Leistungspunkte6
Präsenzstudium (h)45
Selbststudium (h)135
VerpflichtungPflichtmodul
Abschlussschriftliche Prüfungsleistung, 90 Minuten
Details zum Abschluss
Anmeldemodalitäten für alternative PL oder SL
max. Teilnehmerzahl
Vorkenntnisse

Basics of electrical engineering and material science

Lernergebnisse und erworbene Kompetenzen

The students are able to assess and differentiate requirements for microelectronic interconnect substrates. They acquire the ability to use this knowledge to implement circuit requirements.

 

Specialist competencies: Materials science and engineering fundamentals, early recognition of development trends, new technologies and techniques.

 

Methodological skills: Systematic identification of problems, application of expertise, handling CAD tools, documentation of results.

 

System competencies: Understanding the influences of technological circuit implementation on their function and reliability, development of interdisciplinary thinking.

 

Social skills: Communication, ability to work in a team, self-confident presentation; consideration of ecological aspects in electronics production.

Inhalt

The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.

  1. Design process and product cycle (from idea to the product)
  2. Thermal management in microelectronics
  3. Board technologies
    • Overview of available technologies
    • Materials and their properties
    • Additive and subtractive structuring processes
    • Practical work: design of a PCB
  4. Microelectronic components
  5. Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)
  6. Design and layout aspects of PCBs (electrical and thermal design)
  7. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)
  8. Basics of RF design
  9. Hybrid circuit technologies
    • Thick- and Thinfilm technology
    • LTCC technology
  10. Basics of component packaging

follow the link in moodle: https://moodle2.tu-ilmenau.de/course/view.php?id=3678

Medienformen

• Powerpoint slides (also available as script)
• Videos
• Writings on the board
• Exercises (presented by both students and lecturer)

Access to the online course (moodle)

Technical requirements for online participation:
Internet access with 600 kB/s or faster
Computer / laptop with operable camera and microphone

Literatur

Scripts,
Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5
Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9

 

Lehrevaluation

Pflichtevaluation:

WS 2011/12 (Fach)

WS 2017/18 (Fach)

Freiwillige Evaluation:

Hospitation:

WS 2011/12