Technische Universität Ilmenau

Electronics Technology 1 - Modultafeln of TU Ilmenau

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module properties Electronics Technology 1 in major Diplom Elektrotechnik und Informationstechnik 2017
module number66
examination number2100553
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology Group)
module leaderProf. Dr. Jens Müller
term winter term only
languageEnglisch/Deutsch
credit points5
on-campus program (h)56
self-study (h)94
Obligationelective module
examwritten examination performance, 90 minutes
details of the certificate
Signup details for alternative examinations
maximum number of participants
previous knowledge and experience

Basics of electrical engineering and material science

learning outcome

Die Studierenden sind in der Lage Anforderungen an mikroelektronische Verbindungsträger zu beurteilen und zu differenzieren. Sie erlernen die Fähigkeit, diese Kenntnisse zur Umsetzung von Schaltungsanforderungen anzuwenden.

Fachkompetenzen: Werkstoffwissenschaftliche und ingenieurtechnische Grundlagen, frühzeitiges Erkennen von Entwicklungstrends, neuen Technologien und Techniken.

Methodenkompetenz: Systematisches Erfassen von Problemstellungen, Anwendung des Fachwissens, Umgang mit CAD-Tools, Dokumentation von Ergebnissen.

Systemkompetenzen: Verstehen der Einflüsse der technologischen Schaltungsumsetzung auf deren Funktion und Zuverlässigkeit, Entwicklung interdisziplinären Denkens.

Sozialkompetenzen: Kommunikation, Teamfähigkeit, selbstbewusstes Präsentieren; Beachtung ökologischer Aspekte in der Elektronikfertigung.

content

The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.

  1. Design process and product cycle (from idea to the product)
  2. Thermal management in microelectronics
  3. Board technologies
    • Overview of available technologies
    • Materials and their properties
    • Additive and subtractive structuring processes
    • Practical work: design of a PCB
  4. Microelectronic components
  5. Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)
  6. Design and layout aspects of PCBs (electrical and thermal design)
  7. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)
  8. Basics of RF design
  9. Hybrid circuit technologies
    • Thick- and Thinfilm technology
    • LTCC technology
  10. Basics of component packaging
media of instruction

• Powerpoint slides (also available as script)
• Videos
• Writings on the board
• Exercises (presented by both students and lecturer)

Access to the online course (moodle)

literature / references

Scripts,
Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5
Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9

 

evaluation of teaching

Pflichtevaluation:

WS 2011/12 (Fach)

WS 2017/18 (Fach)

Freiwillige Evaluation:

Hospitation:

WS 2011/12