Technische Universität Ilmenau

Advanced Packaging and Assembly Technology - Modultafeln of TU Ilmenau

The module lists provide information on the degree programmes offered by the TU Ilmenau.

Please refer to the respective study and examination rules and regulations for the legally binding curricula (Annex Curriculum).

You can find all details on planned lectures and classes in the electronic university catalogue.

Information and guidance on the maintenance of module descriptions by the module officers are provided at Module maintenance.

Please send information on missing or incorrect module descriptions directly to modulkatalog@tu-ilmenau.de.

module properties Advanced Packaging and Assembly Technology in degree program Diplom Elektrotechnik und Informationstechnik 2017
module number5620
examination number2100563
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology)
module leaderProf. Dr. Jens Müller
term summer term only
languageDeutsch/Englisch
credit points5
on-campus program (h)45
self-study (h)105
obligationelective module
examalternative examination performance
details of the certificate

5 home tests via Moodle (15 minutes each / each covering 3 lectures)
For each test 20 points can be reached
Each test makes 20% of the final grade

Exam is offered in the summer semester only.

alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations

Die Anmeldung zur alternativen semesterbegleitenden Abschlussleistung erfolgt über das Prüfungsverwaltungssystem (thoska) außerhalb des zentralen Prüfungsanmeldezeitraumes. Die früheste Anmeldung ist generell ca. 2-3 Wochen nach Semesterbeginn möglich. Der späteste Zeitpunkt für die An- oder Abmeldung von dieser konkreten Abschlussleistung ist festgelegt auf den (falls keine Angabe, erscheint dies in Kürze):

  • signup begins: 02.11.2021
  • signup ends: 02.11.2021
  • resignation not after: 02.11.2021
  • last modification of this information: 04.11.2021
maximum number of participants
previous knowledge and experience

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

learning outcome

Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications.

Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.

Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking

Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness

content

Repetition of the basics of microelectronic packaging

  • Circuit board technologies
  • Assembly technologies

Packaging of components and modules

  • Packaging Roadmap
  • Interconnection types (FlipChip, BGA, CGA, LGA u.a.)
  • Multichipmodules
  • System-in-Packages (SiP)
  • System-on-Chip concept
  • Stacked IC-technology, stacked Packages (PoP)
  • Chip embedding
  • 3D-Chip-Packaging (TSV-processes)

Power-Packaging

Moulded Interconnect Device Technology

RF- and microwave packaging

MEMS-Packaging

Test and Inspection (Board, Module, AOI, X-Ray, US, ICT )

Methods of failure analysis

media of instruction and technical requirements for education and examination in case of online participation
  • Powerpoint slides (also available online)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)

Access to the online course (moodle)

literature / references

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York


Rao R. Tummala, Madhavan Swaminathan: Introduction to System-on-Package (SOP), McGrawHill, ISBN 978-0-07-145906-8


3D-MID Technologie Räumliche elektronische Baugruppen, Hanser-Verlag, ISBN 3-446-22720-2.


Joseph Fjeldstad et al.: Chip Scale Packaging for modern electronics, Electrochemical Publications Ltd, ISBN 0 901150 43 6.

evaluation of teaching

Pflichtevaluation:

SS 2010 (Fach)


Freiwillige Evaluation:

Hospitation: