Technische Universität Ilmenau

Advanced Packaging and Assembly Technology - Modultafeln of TU Ilmenau

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module properties Advanced Packaging and Assembly Technology in major Diplom Elektrotechnik und Informationstechnik 2017
module number5620
examination number2100563
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology Group)
module leaderProf. Dr. Jens Müller
term summer term only
credit points5
on-campus program (h)45
self-study (h)105
Obligationelective module
examalternative examination performance, 30 minutes
details of the certificate

5 home tests via Moodle (15 minutes each / each covering 3 lectures)
For each test 20 points can be reached
Each test makes 20% of the final grade

Signup details for alternative examinations

Summer semester 2021:
Registration period: 10th May until 14th May 2021
De-registration possible until 20th May 2021

  • signup begins: 10.05.2021
  • signup ends: 14.05.2021
  • resignation not after: 20.05.2021
  • last modification of this information: 10.05.2021
maximum number of participants
previous knowledge and experience

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

learning outcome

Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications.

Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.

Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking

Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness


Repetition of the basics of microelectronic packaging

  • Circuit board technologies
  • Assembly technologies

Packaging of components and modules

  • Packaging Roadmap
  • Interconnection types (FlipChip, BGA, CGA, LGA u.a.)
  • Multichipmodules
  • System-in-Packages (SiP)
  • System-on-Chip concept
  • Stacked IC-technology, stacked Packages (PoP)
  • Chip embedding
  • 3D-Chip-Packaging (TSV-processes)


Moulded Interconnect Device Technology

RF- and microwave packaging


Test and Inspection (Board, Module, AOI, X-Ray, US, ICT )

Methods of failure analysis

media of instruction
  • Powerpoint slides (also available online)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)

Access to the online course (moodle)

literature / references

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York

Rao R. Tummala, Madhavan Swaminathan: Introduction to System-on-Package (SOP), McGrawHill, ISBN 978-0-07-145906-8

3D-MID Technologie Räumliche elektronische Baugruppen, Hanser-Verlag, ISBN 3-446-22720-2.

Joseph Fjeldstad et al.: Chip Scale Packaging for modern electronics, Electrochemical Publications Ltd, ISBN 0 901150 43 6.

evaluation of teaching


SS 2010 (Fach)

Freiwillige Evaluation: