Technische Universität Ilmenau

Functionalized Peripherics - Modultafeln der TU Ilmenau

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Modulinformationen zu Functionalized Peripherics im Studiengang Diplom Elektrotechnik und Informationstechnik 2017
Modulnummer200574
Prüfungsnummer2100916
FakultätFakultät für Elektrotechnik und Informationstechnik
Fachgebietsnummer 2146 (Elektroniktechnologie)
Modulverantwortliche(r)Prof. Dr. Jens Müller
TurnusWintersemester
SpracheEnglisch
Leistungspunkte5
Präsenzstudium (h)45
Selbststudium (h)105
VerpflichtungWahlmodul
Abschlussmündliche Prüfungsleistung, 30 Minuten
Details zum Abschluss
Anmeldemodalitäten für alternative PL oder SL
max. Teilnehmerzahl
Vorkenntnisse

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

Lernergebnisse und erworbene Kompetenzen

After the lectures and exercises the students are familiar with modern microelectronic components. They know, that packages and devices require different interfaces to connect the periphery electrically, thermally, mechanically, optically and fluidly in order to meet the requirements on power management, data transmission band width, signal frequency etc. They know these specific functions, which are covered in the lecture Functionalized Peripherics.

Students are able to identify and differentiate the requirements on the interface between nano structures (semiconductor) and the circuit board technology. They have developed the ability to apply this knowledge for the conversion of electronic circuit requirements to the products and processes.

Special skills: Students know thebasics of material science and engineering sciences. They are able to identify development trends, new technologies and techniques early.

Methodological competences: Students can systematically identify problems and requirements. They can applicate state of the art knowledge, are familiar with computer aided design and documentation of results.

Systems competences: Students understand the correlations between design/material/technology and function/system reliability. They have the ability to interdisciplinary thinking

Social competences: Students are able to active communication, have the ability to work in a team and can self-confidently present results. They have developed environmental consciousness.

Inhalt

1) In-depth module circuit board technology

  • Thick- and thinfilm processes
  • LTCC-technology
  • Flexible printed circuit boards
  • stretchable electronics
  • Silicon/ceramic composite substrates

2) RF- and microwave board technologies

  • Materials, properties
  • Lumped integrated passive components
  • Distributed integrated passive components
  • Design
  • Measurement principles

3) Ceramic sensors and actuators

  • Application scenarios
  • Sensor principles
  • Construction of ceramic sensors and actors
  • Sensor packaging
Medienformen
  • Powerpoint slides (also available as script)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)
Literatur

Handbuch der Leiterplattentechnik Band 4, Eugen G. Leuze Verlag, Bad Saulgau, 2003, ISBN 3-87480-184-5.

Scheel, Wolfgang: Baugruppen-Technologie der Elektronik. Montage Verlag Technik, Berlin 1999.

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York.

Lehrevaluation