Technische Universität Ilmenau

Functionalized Peripherics - Modultafeln of TU Ilmenau

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module properties Functionalized Peripherics in degree program Diplom Elektrotechnik und Informationstechnik 2017
module number200574
examination number2100916
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology)
module leaderProf. Dr. Jens Müller
term winter term only
languageEnglisch
credit points5
on-campus program (h)45
self-study (h)105
obligationelective module
examalternative examination performance
details of the certificate

Course project

alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants
previous knowledge and experience

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

learning outcome

After the lectures and exercises the students are familiar with modern microelectronic components. They know, that packages and devices require different interfaces to connect the periphery electrically, thermally, mechanically, optically and fluidly in order to meet the requirements on power management, data transmission band width, signal frequency etc. They know these specific functions, which are covered in the lecture Functionalized Peripherics.

Students are able to identify and differentiate the requirements on the interface between nano structures (semiconductor) and the circuit board technology. They have developed the ability to apply this knowledge for the conversion of electronic circuit requirements to the products and processes.

Special skills: Students know thebasics of material science and engineering sciences. They are able to identify development trends, new technologies and techniques early.

Methodological competences: Students can systematically identify problems and requirements. They can applicate state of the art knowledge, are familiar with computer aided design and documentation of results.

Systems competences: Students understand the correlations between design/material/technology and function/system reliability. They have the ability to interdisciplinary thinking

Social competences: Students are able to active communication, have the ability to work in a team and can self-confidently present results. They have developed environmental consciousness.

content

1) In-depth module circuit board technology

  • Thick- and thinfilm processes
  • LTCC-technology
  • Flexible printed circuit boards
  • stretchable electronics
  • Silicon/ceramic composite substrates

2) RF- and microwave board technologies

  • Materials, properties
  • Lumped integrated passive components
  • Distributed integrated passive components
  • Design
  • Measurement principles

3) Ceramic sensors and actuators

  • Application scenarios
  • Sensor principles
  • Construction of ceramic sensors and actors
  • Sensor packaging
media of instruction and technical requirements for education and examination in case of online participation
  • Powerpoint slides (also available as script)
  • Videos
  • Writings on the board
  • Exercises (presented by both students and lecturer)

    Access to the online course (moodle)

    Technical requirements for online participation:
    Internet access with 600 kB/s or faster
    Computer / laptop with operable camera and microphone

literature / references

Handbuch der Leiterplattentechnik Band 4, Eugen G. Leuze Verlag, Bad Saulgau, 2003, ISBN 3-87480-184-5.

Scheel, Wolfgang: Baugruppen-Technologie der Elektronik. Montage Verlag Technik, Berlin 1999.

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York.

evaluation of teaching