Functionalized Peripherics - Modultafeln of TU Ilmenau
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|module properties Functionalized Peripherics in degree program Diplom Elektrotechnik und Informationstechnik 2017|
|department||Department of Electrical Engineering and Information Technology|
|ID of group||2146 (Electronics Technology)|
|module leader||Prof. Dr. Jens Müller|
|term||winter term only|
|on-campus program (h)||45|
|exam||alternative examination performance|
|details of the certificate|
|alternative examination performance due to COVID-19 regulations incl. technical requirements|
|signup details for alternative examinations|
|maximum number of participants|
|previous knowledge and experience|
Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging
After the lectures and exercises the students are familiar with modern microelectronic components. They know, that packages and devices require different interfaces to connect the periphery electrically, thermally, mechanically, optically and fluidly in order to meet the requirements on power management, data transmission band width, signal frequency etc. They know these specific functions, which are covered in the lecture Functionalized Peripherics.
Students are able to identify and differentiate the requirements on the interface between nano structures (semiconductor) and the circuit board technology. They have developed the ability to apply this knowledge for the conversion of electronic circuit requirements to the products and processes.
Special skills: Students know thebasics of material science and engineering sciences. They are able to identify development trends, new technologies and techniques early.
Methodological competences: Students can systematically identify problems and requirements. They can applicate state of the art knowledge, are familiar with computer aided design and documentation of results.
Systems competences: Students understand
the correlations between design/material/technology and function/system
reliability. They have the ability to interdisciplinary thinking
Social competences: Students are able to active communication, have the ability to work in a team and can self-confidently present results. They have developed environmental consciousness.
1) In-depth module circuit board technology
2) RF- and microwave board technologies
3) Ceramic sensors and actuators
|media of instruction and technical requirements for education and examination in case of online participation|
|literature / references|
Handbuch der Leiterplattentechnik Band 4, Eugen G. Leuze Verlag, Bad Saulgau, 2003, ISBN 3-87480-184-5.
Scheel, Wolfgang: Baugruppen-Technologie der Elektronik. Montage Verlag Technik, Berlin 1999.
Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York.
|evaluation of teaching|