Technische Universität Ilmenau

Electronics Technology 1 - Interactive curriculae of TU Ilmenau

The interactive curriculae provide information on the degree programmes offered by the TU Ilmenau.

Please refer to the respective study and examination rules and regulations for the legally binding curricula (Annex Curriculum).

You can find all details on planned lectures and classes in the course catalogue.

Please note that this page is no longer updated. All modules and study plans from PO version 2021 onwards (Bachelor and Master study programs) are now available on the Campus Portal.

module properties Electronics Technology 1 in degree program Diplom Elektrotechnik und Informationstechnik 2021
module number200573
examination number2100915
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology)
module leaderProf. Dr. Jens Müller
term winter term only
languageEnglisch
credit points5
on-campus program (h)56
self-study (h)94
obligationelective module
examwritten examination performance, 90 minutes
details of the certificate
link to Moodle course https://moodle.tu-ilmenau.de/enrol/index.php?id=3556
teacher

Prof. Dr. Müller, Jens

Dr.-Ing. Heike Bartsch

signup details for alternative examinations
maximum number of participants
previous knowledge and experience

Basics of electrical engineering and material science

learning outcome

After the lectures and exercises the students are able to design and analyze printed circuit boards, hybrid circuits and electronic assemblies and can evaluate these regarding their applicability and performance.

They are able to apply their systematic knowledge in electronics technology (e.g. in complex student projects or lab work).

content

The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.

1. Design process and product cycle (from idea to the product)

2. Thermal management in microelectronics

3. Board technologies

  • Overview of available technologies
  • Materials and their properties
  • Additive and subtractive structuring processes
  • Practical work: design of a PCB

4. Microelectronic components

5. Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)

6. Design and layout aspects of PCBs (electrical and thermal design)

7. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)

8. Basics of RF design

9. Hybrid circuit technologies

  • Thick- and Thinfilm technology
  • LTCC technology

10. Basics of component packaging

follow the link in moodle (lecture): https://moodle.tu-ilmenau.de/enrol/index.php?id=3556

follow the link in moodle (seminar):https://moodle.tu-ilmenau.de/enrol/index.php?id=3565

 

 

media of instruction and technical requirements for education and examination in case of online participation

. Powerpoint slides (also available as script)
. Videos
. Writings on the board
. Exercises (presented by both students and lecturer)

Technical requirements for online participation:
Internet access with 600 kB/s or faster
Computer / laptop with operable camera and microphone

literature / references

Scripts,
Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5
Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9

evaluation of teaching