Technische Universität Ilmenau

Advanced Packaging and Assembly Technology - Interactive curriculae of TU Ilmenau

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module properties Advanced Packaging and Assembly Technology in degree program Master Elektrotechnik und Informationstechnik 2014 (MNE)
module nameAdvanced Packaging and Assembly Technology
module number100713
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology)
module leaderProf. Dr. Jens Müller
credit points5
obligationobligatory module
requirements

Bachelor in engineering or natural sciences

Foundations of Material science

Electronics Technology or Basics of Microelectronic Packaging

certificate of the module Individual achievements or exams
details of the certificate
link to Moodle course
teacher
signup details for alternative examinations
learning outcome

Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications.


Special skills: basics of material science and engineering sciences, early identification of development trends, new technologies and techniques.


Methodological competences: systematic identification of problems and requirements, application of state of the art knowledge, computer aided design, documentation of results. Systems competences:understanding the correlations between design/material/technology and function/system reliability, development of interdisciplinary thinking


Social competences: communication, ability to work in a team, self-confident presenting, environmental consciousness

The module contains the following subjects:
Advanced Packaging and Assembly Technology
credit points5
obligationobligatory module
certificate of the modulealternative examination performance
term Sommersemester