Functionalized Peripherics - Interactive curriculae of TU Ilmenau

Course Project Functionalized Peripherics

Im o.g. Course Project wird basierend auf der LTCC- Technologie (Low Temperature Cofired Ceramic) ein Durchflusssensor für flüssige Medien entwickelt. Ausgehend von einer Literaturrecherche, bei der auch kurz auf das Lesen wissenschaftlicher Paper eingegangen wird, werden Messprinzipien basierend auf elektrischen Widerstandsmessungen kombiniert mit fluidischen Strukturen in LTCC diskutiert. Nach der Dimensionierung der elektrischen Größen wird auf notwendige strömungsmechanische Parameter (Mikrofluidik) des Sensors eingegangen. Design und Berechnungen werden unter dem Aspekt der technologischen Umsetzbarkeit und einer robusten Aufbau- und Verbindungstechnik betrachtet.

Im Course Project sind zwei Belege anzufertigen, die am Ende des Semesters mittels eines Punktesystems benotet werden. Aus der Gesamtpunktzahl beider Belege ergibt sich die Note. Es müssen mindestens 40 % der Gesamtleistung erreicht werden um den Kurs zu bestehen. Es ist möglich, in der Vorlesung „Functionalized Peripherics“ bei fünf kurzen Tests 25 Zusatzpunkte zu erarbeiten, um eine Verbesserung der Note zu erreichen. Die Zusatzpunkte gehen mit 30% in die Gesamtleistung mit ein.

In the above-mentioned course project, a flow sensor for liquid media is being developed based on LTCC (Low Temperature Cofired Ceramic) technology. Starting with a literature review, which also briefly discusses the reading of scientific papers, measurement principles based on electrical resistance measurements combined with fluidic structures in LTCC are discussed. After dimensioning the electrical variables, the necessary fluid mechanical parameters (microfluidics) of the sensor are discussed. Design and calculations are considered from the perspective of technological feasibility and robust assembly and connection technology.

In the course project, two homework assignments must be completed, which will be graded at the end of the semester using a point system. The grade is based on the total number of points from both assignments. A minimum of 40% of the total achievement must be attained in order to pass the course. It is possible to earn 25 additional points in the “Functionalized Peripherics” lecture by completing five short tests in order to improve the grade. The additional points account for 30% of the total achievement.

Prof. Dr. Müller, Jens

Dr.-Ing. Heike Bartsch

Dieses Modul enthält mindestens eine alternative semesterbegleitende Abschlussleistung. Bitte beachten Sie, dass diese in der Regel schon zu Beginn des Semesters, in dem diese angeboten wird, angemeldet werden muss.
Über die Details und Zeiträume dazu werden Sie vom Lehrenden und/oder dem Prüfungsamt informiert. Fragen Sie gegebenenfalls unbedingt beim Lehrenden nach.

This module contains at least one alternative exam part. Please note that this must usually be registered at the beginning of the semester in which it is offered.
The lecturer and/or the examination office will inform you about the details and time periods. If necessary, be sure to ask the lecturer.

Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging

After the lectures and exercises the students are familiar with modern microelectronic components. They know, that packages and devices require different interfaces to connect the periphery electrically, thermally, mechanically, optically and fluidly in order to meet the requirements on power management, data transmission band width, signal frequency etc. They know these specific functions, which are covered in the lecture Functionalized Peripherics.

Students are able to identify and differentiate the requirements on the interface between nano structures (semiconductor) and the circuit board technology. They have developed the ability to apply this knowledge for the conversion of electronic circuit requirements to the products and processes.

Special skills: Students know thebasics of material science and engineering sciences. They are able to identify development trends, new technologies and techniques early.

Methodological competences: Students can systematically identify problems and requirements. They can applicate state of the art knowledge, are familiar with computer aided design and documentation of results.

Systems competences: Students understand the correlations between design/material/technology and function/system reliability. They have the ability to interdisciplinary thinking

Social competences: Students are able to active communication, have the ability to work in a team and can self-confidently present results. They have developed environmental consciousness.

1)  In-depth module circuit board technology

• Thick- and thinfilm processes
• LTCC-technology
• Flexible printed circuit boards
• stretchable electronics
• Silicon/ceramic composite substrates

2) RF- and microwave board technologies

• Materials, properties
• Lumped integrated passive components
• Distributed integrated passive components
• Design
• Measurement principles

3) Ceramic sensors and actuators

• Application scenarios
• Sensor principles
• Construction of ceramic sensors and actors
• Sensor packaging

follow the link in moodle (lecture): https://moodle.tu-ilmenau.de/course/view.php?id=3631

follow the link in moodle (seminar): https://moodle.tu-ilmenau.de/course/view.php?id=3574

• Powerpoint slides (also available as script)
• Videos
• Writings on the board
• Exercises (presented by both students and lecturer)

   

  Technical requirements for online participation:
  Internet access with 600 kB/s or faster
  Computer / laptop with operable camera and microphone

Handbuch der Leiterplattentechnik Band 4, Eugen G. Leuze Verlag, Bad Saulgau, 2003, ISBN 3-87480-184-5.

Scheel, Wolfgang: Baugruppen-Technologie der Elektronik. Montage Verlag Technik, Berlin 1999.

Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York.