Electronics Technology 1 - Interactive curriculae of TU Ilmenau

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module properties Electronics Technology 1 in degree program Master Micro- and Nanotechnologies 2016
module number	66
examination number	2100553
department	Department of Electrical Engineering and Information Technology
ID of group	2146 (Electronics Technology)
module leader	Prof. Dr. Jens Müller
term	winter term only
language	Englisch/Deutsch
credit points	6
on-campus program (h)	45
self-study (h)	135
obligation	obligatory module
exam	written examination performance, 90 minutes
details of the certificate
link to Moodle course	https://moodle.tu-ilmenau.de/enrol/index.php?id=3556
teacher	Dr.-Ing. Heike Bartsch
signup details for alternative examinations
maximum number of participants
previous knowledge and experience	Basics of electrical engineering and material science
learning outcome	Die Studierenden sind in der Lage Anforderungen an mikroelektronische Verbindungsträger zu beurteilen und zu differenzieren. Sie erlernen die Fähigkeit, diese Kenntnisse zur Umsetzung von Schaltungsanforderungen anzuwenden. Fachkompetenzen: Werkstoffwissenschaftliche und ingenieurtechnische Grundlagen, frühzeitiges Erkennen von Entwicklungstrends, neuen Technologien und Techniken. Methodenkompetenz: Systematisches Erfassen von Problemstellungen, Anwendung des Fachwissens, Umgang mit CAD-Tools, Dokumentation von Ergebnissen. Systemkompetenzen: Verstehen der Einflüsse der technologischen Schaltungsumsetzung auf deren Funktion und Zuverlässigkeit, Entwicklung interdisziplinären Denkens. Sozialkompetenzen: Kommunikation, Teamfähigkeit, selbstbewusstes Präsentieren; Beachtung ökologischer Aspekte in der Elektronikfertigung.
content	The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced. Design process and product cycle (from idea to the product) Thermal management in microelectronics Board technologies Overview of available technologies Materials and their properties Additive and subtractive structuring processes Practical work: design of a PCB Microelectronic components Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.) Design and layout aspects of PCBs (electrical and thermal design) Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) Basics of RF design Hybrid circuit technologies Thick- and Thinfilm technology LTCC technology Basics of component packaging follow the link in moodle (lecture): https://moodle.tu-ilmenau.de/enrol/index.php?id=3556 follow the link in moodle (seminar):https://moodle.tu-ilmenau.de/enrol/index.php?id=3565
media of instruction and technical requirements for education and examination in case of online participation	• Powerpoint slides (also available as script) • Videos • Writings on the board • Exercises (presented by both students and lecturer) Technical requirements for online participation: Internet access with 600 kB/s or faster Computer / laptop with operable camera and microphone
literature / references	Scripts, Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5 Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9
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