Technische Universität Ilmenau

Electronics Technology 1 - Modultafeln of TU Ilmenau

The Modultafeln have a pure informational character. The legally binding information can be found in the corresponding Studienplan and Modulhandbuch, which are served on the pages of the course offers. Please also pay attention to this legal advice (german only). Information on place and time of the actual lectures is served in the Vorlesungsverzeichnis.

subject properties Electronics Technology 1 in major Master Micro- and Nanotechnologies 2016
subject number66
examination number2100553
departmentDepartment of Electrical Engineering and Information Technology
ID of group 2146 (Electronics Technology Group)
subject leaderProf. Dr. Jens Müller
term Wintersemester
languageEnglisch/Deutsch
credit points6
on-campus program (h)56
self-study (h)124
Obligationobligatory
examoral examination performance, 30 minutes
details of the certificate
maximum number of participants
previous knowledge and experience

Basics of electrical engineering and material science

learning outcome

Die Studierenden sind in der Lage Anforderungen an mikroelektronische Verbindungsträger zu beurteilen und zu differenzieren. Sie erlernen die Fähigkeit, diese Kenntnisse zur Umsetzung von Schaltungsanforderungen anzuwenden.

Fachkompetenzen: Werkstoffwissenschaftliche und ingenieurtechnische Grundlagen, frühzeitiges Erkennen von Entwicklungstrends, neuen Technologien und Techniken.

Methodenkompetenz: Systematisches Erfassen von Problemstellungen, Anwendung des Fachwissens, Umgang mit CAD-Tools, Dokumentation von Ergebnissen.

Systemkompetenzen: Verstehen der Einflüsse der technologischen Schaltungsumsetzung auf deren Funktion und Zuverlässigkeit, Entwicklung interdisziplinären Denkens.

Sozialkompetenzen: Kommunikation, Teamfähigkeit, selbstbewusstes Präsentieren; Beachtung ökologischer Aspekte in der Elektronikfertigung.

content

The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.

  1. Design process and product cycle (from idea to the product)
  2. Thermal management in microelectronics
  3. Board technologies
    • Overview of available technologies
    • Materials and their properties
    • Additive and subtractive structuring processes
    • Practical work: design of a PCB
  4. Microelectronic components
  5. Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)
  6. Design and layout aspects of PCBs (electrical and thermal design)
  7. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)
  8. Basics of RF design
  9. Hybrid circuit technologies
    • Thick- and Thinfilm technology
    • LTCC technology
  10. Basics of component packaging
media of instruction

• Powerpoint slides (also available as script)
• Videos
• Writings on the board
• Exercises (presented by both students and lecturer)

literature / references

Scripts,
Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5
Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9

 

evaluation of teaching

Pflichtevaluation:

WS 2011/12 (Fach)

WS 2017/18 (Fach)

Freiwillige Evaluation:

Hospitation:

WS 2011/12