Advanced Packaging and Assembly Technology - Interactive curriculae of TU Ilmenau

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module properties Advanced Packaging and Assembly Technology in degree program Master Micro- and Nanotechnologies 2016
module number	200576
examination number	210546
department	Department of Electrical Engineering and Information Technology
ID of group	2146 (Electronics Technology)
module leader	Prof. Dr. Jens Müller
term	summer term only
language	Englisch
credit points	5
on-campus program (h)	45
self-study (h)	105
obligation	elective module
exam	examination performance with multiple performances
details of the certificate	Das Modul Advanced Packaging and Assembly Technology mit der Prüfungsnummer 210546 schließt mit folgenden Leistungen ab: - schriftliche Prüfungsleistung (60 Minuten) mit einer Wichtung von 50% (Prüfungsnummer 2101082) - alternative Prüfungsleistung mit einer Wichtung von 50% (Prüfungsnummer 2101083) Details for examination part 2: - Writing a seminar paper with a final presentation (Erstellen einer Seminararbeit mit abschließender Präsentation)
link to Moodle course	https://moodle.tu-ilmenau.de/enrol/index.php?id=2958
teacher	Prof. Dr. Müller, Jens
signup details for alternative examinations	Dieses Modul enthält mindestens eine alternative semesterbegleitende Abschlussleistung. Bitte beachten Sie, dass diese in der Regel schon zu Beginn des Semesters, in dem diese angeboten wird, angemeldet werden muss. Über die Details und Zeiträume dazu werden Sie vom Lehrenden und/oder dem Prüfungsamt informiert. Fragen Sie gegebenenfalls unbedingt beim Lehrenden nach. This module contains at least one alternative exam part. Please note that this must usually be registered at the beginning of the semester in which it is offered. The lecturer and/or the examination office will inform you about the details and time periods. If necessary, be sure to ask the lecturer.
maximum number of participants
previous knowledge and experience	Bachelor in engineering or natural sciences, Foundations of Material science, Electronics Technology or Basics of Microelectronic Packaging
learning outcome	After the lectures and exercises the students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor devices, packages, modules and circuit boards and can evaluate these for specific applications. Special skills: Students know the basics of material science and engineering sciences, early identification of development trends, new technologies and techniques. Methodological competences: Students can systematically identify problems and requirements. They can applicate state of the art knowledge, are familiar with computer aided design and documentation of results. Systems competences: Students understand the correlations between design/material/technology and function/system reliability. They have the ability to interdisciplinary thinking Social competences: Students are able to active communication, have the ability to work in a team and can self-confidently present results. They have developed environmental consciousness.
content	Repetition of the basics of microelectronic packaging Circuit board technologies Assembly technologies Packaging of components and modules Packaging Roadmap Interconnection types (FlipChip, BGA, CGA, LGA u.a.) Multichipmodules System-in-Packages (SiP) System-on-Chip concept Stacked IC-technology, stacked Packages (PoP) Chip embedding 3D-Chip-Packaging (TSV-processes) Power-Packaging Moulded Interconnect Device Technology RF- and microwave packaging MEMS-Packaging Test and Inspection (Board, Module, AOI, X-Ray, US, ICT ) Methods of failure analysis
media of instruction and technical requirements for education and examination in case of online participation	Powerpoint slides (also available online) Videos Writings on the board Exercises (presented by both students and lecturer)
literature / references	Rao R. Tummala et al.: Microelectronics Packaging Handbook, Verlag Chapman & Hall, New York Rao R. Tummala, Madhavan Swaminathan: Introduction to System-on-Package (SOP), McGrawHill, ISBN 978-0-07-145906-8 3D-MID Technologie Räumliche elektronische Baugruppen, Hanser-Verlag, ISBN 3-446-22720-2. Joseph Fjeldstad et al.: Chip Scale Packaging for modern electronics, Electrochemical Publications Ltd, ISBN 0 901150 43 6.
evaluation of teaching