Electronics Technology 2 - Interaktive Studienpläne der TU Ilmenau

Das Modul Electronics Technology 2 mit der Prüfungsnummer 210544 schließt mit folgenden Leistungen ab:

- alternative Prüfungsleistung mit einer Wichtung von 50% (Prüfungsnummer: 2100917)

- alternative Studienleistung mit einer Wichtung von 50% (Prüfungsnummer: 2101081)

 

Details zum Abschluss Teilleistung 1:

Seminar Work: Presentation and discussion on a technological topic

 

Details zum Abschluss Teilleistung 2:

Lab work: Lab protocols

Prof. Dr. Müller, Jens;
Dr. Bartsch, Heike;
Dipl.-Ing. Fischer, Michael

Dieses Modul enthält mindestens eine alternative semesterbegleitende Abschlussleistung. Bitte beachten Sie, dass diese in der Regel schon zu Beginn des Semesters, in dem diese angeboten wird, angemeldet werden muss.
Über die Details und Zeiträume dazu werden Sie vom Lehrenden und/oder dem Prüfungsamt informiert. Fragen Sie gegebenenfalls unbedingt beim Lehrenden nach.

This module contains at least one alternative exam part. Please note that this must usually be registered at the beginning of the semester in which it is offered.
The lecturer and/or the examination office will inform you about the details and time periods. If necessary, be sure to ask the lecturer.

Fundamentals of Electrical Engineering, Circuit Technology, Materials of EE., Electronics Technology 1

After the lecture and related exercises, students will be able to apply knowledge of ceramic packaging technology and will be able to assess and differentiate requirements for microelectronic modules and components and their interaction with material properties and process technology. They will have the ability to apply this knowledge to implement device requirements.

Technical competencies:
Students are familiar with materials science and engineering fundamentals. They are able to recognize development trends of new technologies and techniques at an early stage.

Methodological competence:
Students are able to systematically understand problems, are able to analyze failure mechanisms. They are able to apply their expertise and construct a component design using CAD tools. They can document their results accordingly.

System competencies:
Students understand the influences of technological circuit implementation on its function and reliability. They have developed interdisciplinary thinking (interaction design, material, technology).

Social competencies:
Students are capable of active communication, possess teamwork skills and are able to present their results confidently. They are able to consider ecological aspects for circuit realization

Consolidation of thick-film technology
Substrate properties, Resistor parameters, adjustment, trim sensitivity, Design of DiS resistors, Conductor and dielectric materials

Thick-film circuit design
Structure of the layout system Hyde (differentiation to circuit board design), Introduction to the Hyde program, Procedure for designing a DiS circuit, Dimensioning of thick-film circuits

Consolidation of multilayer ceramic technology
Tape production and material classes, tape-on-substrate technology, HTCC technology, LTCC technology and materials, Properties of multilayer ceramics

Heat dissipation solutions
Thick-film on alumina substrates, LTCC-M

Direct Copper Bonding technology for power electronic circuits
Production of the DCB substrates, Design of DCB circuits, Method of mounting components on DCB substrates, Reliability of DCB circuits

Reliability of microelectronic assemblies
Failure statistics, Causes and mechanisms of failure, Reliability studies

Ceramic Packaging
1st level packaging, 2nd level packaging

Slides/Powerpoint and videos, scripts, derivations and in-depth explanations on the blackboard.

Technical requirements: Internet access with sufficient bandwidth for video stream, camera and microphone must be switched on over the whole time.

H. Thust, J. Müller: Script Electronics Technology – Hybrid Technologies, available at Copyshop (currently under prep.)
F. Barlow, A. Elshabini: Ceramic Interconnect Technology Handbook,CRC Press, ISBN 0-8483-3557-4
Yoshihiko Imanaka: Multilayered Low Temperature Cofired Ceramics (LTCC) Technology, Springer, ISBN 0-387-23130-7