Electronics Technology 1 - Modultafeln of TU Ilmenau

The Modultafeln have a pure informational character. The legally binding information can be found in the corresponding Studienplan and Modulhandbuch, which are served on the pages of the course offers. Please also pay attention to this legal advice (german only). Information on place and time of the actual lectures is served in the Vorlesungsverzeichnis.

subject properties Electronics Technology 1 in major Master Wirtschaftsingenieurwesen 2010
subject number	66
examination number	2100048
department	Department of Electrical Engineering and Information Technology
ID of group	2146 (Electronics Technology Group)
subject leader	Prof. Dr. Jens Müller
term	Wintersemester
language	Deutsch/Englisch
credit points	3
on-campus program (h)	34
self-study (h)	56
Obligation	obligatory elective
exam	oral examination performance, 30 minutes
details of the certificate
maximum number of participants
previous knowledge and experience	Basics of electrical engineering and material science
learning outcome	Students are able to design and analyze printed circuit boards, hybrid circuits and electronic assemblies and can evaluate these regarding their applicability and performance. They are able to apply their systematic knowledge in electronics technology (e.g. in complex student projects or lab work)
content	The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced. Design process and product cycle (from idea to the product) Thermal management in microelectronics Board technologies Overview of available technologies Materials and their properties Additive and subtractive structuring processes Practical work: design of a PCB Microelectronic components Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.) Design and layout aspects of PCBs (electrical and thermal design) Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) Basics of RF design Hybrid circuit technologies Thick- and Thinfilm technology LTCC technology Basics of component packaging
media of instruction	Powerpoint slides (also available as script) Videos Writings on the board Exercises (presented by both students and lecturer)
literature / references	Scripts, Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5 Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9
evaluation of teaching	Pflichtevaluation: WS 2011/12 (Fach) WS 2017/18 (Fach) Freiwillige Evaluation: Hospitation: WS 2011/12