Electronics Technology 1 - Modultafeln of TU Ilmenau

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module properties Electronics Technology 1 in degree program Master Wirtschaftsingenieurwesen 2010
module number	66
examination number	2100048
department	Department of Electrical Engineering and Information Technology
ID of group	2146 (Electronics Technology)
module leader	Prof. Dr. Jens Müller
term	winter term only
language	Deutsch/Englisch
credit points	3
on-campus program (h)	34
self-study (h)	56
obligation	elective module
exam	written examination performance, 90 minutes
details of the certificate
alternative examination performance due to COVID-19 regulations incl. technical requirements
signup details for alternative examinations
maximum number of participants
previous knowledge and experience	Basics of electrical engineering and material science
learning outcome	Students are able to design and analyze printed circuit boards, hybrid circuits and electronic assemblies and can evaluate these regarding their applicability and performance. They are able to apply their systematic knowledge in electronics technology (e.g. in complex student projects or lab work)
content	The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced. Design process and product cycle (from idea to the product) Thermal management in microelectronics Board technologies Overview of available technologies Materials and their properties Additive and subtractive structuring processes Practical work: design of a PCB Microelectronic components Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.) Design and layout aspects of PCBs (electrical and thermal design) Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) Basics of RF design Hybrid circuit technologies Thick- and Thinfilm technology LTCC technology Basics of component packaging
media of instruction and technical requirements for education and examination in case of online participation	Powerpoint slides (also available as script) Videos Writings on the board Exercises (presented by both students and lecturer)
literature / references	Scripts, Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5 Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9
evaluation of teaching	Pflichtevaluation: WS 2011/12 (Fach) WS 2017/18 (Fach) Freiwillige Evaluation: Hospitation: WS 2011/12