Electronics Technology 1 - Interaktive Studienpläne der TU Ilmenau

Basics of electrical engineering and material science

After the lectures and exercises the students are able to design and analyze printed circuit boards, hybrid circuits and electronic assemblies and can evaluate these regarding their applicability and performance.

They are able to apply their systematic knowledge in electronics technology (e.g. in complex student projects or lab work).

The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.

1. Design process and product cycle (from idea to the product)

2. Thermal management in microelectronics

3. Board technologies

• Overview of available technologies
• Materials and their properties
• Additive and subtractive structuring processes
• Practical work: design of a PCB

4. Microelectronic components

5. Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)

6. Design and layout aspects of PCBs (electrical and thermal design)

7. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)

8. Basics of RF design

9. Hybrid circuit technologies

• Thick- and Thinfilm technology
• LTCC technology

10. Basics of component packaging

follow the link in moodle (lecture): https://moodle.tu-ilmenau.de/enrol/index.php?id=3556

follow the link in moodle (seminar):https://moodle.tu-ilmenau.de/enrol/index.php?id=3565

. Powerpoint slides (also available as script)
. Videos
. Writings on the board
. Exercises (presented by both students and lecturer)

Technical requirements for online participation:
Internet access with 600 kB/s or faster
Computer / laptop with operable camera and microphone

Scripts,
Handbuch der Leiterplattentechnik Band 1-4, Eugen Leuze Verlag ISBN3-87480-184-5
Fundamentals of Microsystems Packaging, McGraw-Hill, ISBN 0-07-137169-9

Prof. Dr. Müller, Jens

Dr.-Ing. Heike Bartsch