BE Semiconductor Industries NV (Besi) designs and manufactures state-of-the-art assembly systems and equipment for leadframe, substrate and wafer-level packaging applications in a variety of end-user markets, including electronics, mobile Internet, cloud server, computer, automotive, industrial, LED and solar energy. Besi's customers are primarily leading multinational chip manufacturers, assembly suppliers, and electronics and industrial companies around the world. For Besi's Die Bonders, requirements have shifted from a few microns to 200 nm in recent years, necessitating the procurement of a reference system.
The NMM-1 Nanopositioning and Nanomeasuring Machine was installed in the R&D department. With a measurement volume of 25 x 25 x 5 cubic millimeters and a positioning uncertainty of less than 10 nanometers, the nanomeasuring machine is currently the most accurate of its kind in the world. Developers use the NMM-1, among other things, for the further development and quality control of their high-precision camera systems.
For several years, research at the Institute of Process Measurement and Sensor Technology has focused on the next generations of nanomeasurement and nanofabrication machines. The NPMM-200, also equipped with SIOS laser interferometers, operates in a larger measurement volume. In the NanoFab International Research Training Group, young scientists are conducting research on the development of nanofabrication machines. The third generation of doctoral students will begin their scientific work there in the next year. The calls for proposals are already underway.