The research group FOR 1522 "MUSIK" (Multiphysical Synthesis and Integration of Complex High-Frequency Circuits), funded by the DFG (first project phase: 2012 - 2015), is investigating the controlling, oscillating and switching properties of microelectromechanical systems with the aim of using these for applications in radio communication and radio sensor technology by means of a consistent design of energy-efficient and reconfigurable circuits.

A novel silicon-ceramic composite substrate (SiCer) serves as the material basis. Its advantageous properties are investigated and specifically further developed by combining both material and technology classes.

MUSIC Phase 2

The main objective of the work planned for the second phase (2016 - 2018) in the Department of Electronics Technology is the implementation of the MUSIK demonstrator on a SiCer platform with a continuous technology run. Similar to the semiconductor processing of electronic components, the technology steps for the individual functional elements (switch, resonator, etc.) are coordinated so that they can be manufactured in parallel.

All wiring levels for the interconnection of the individual functional elements as well as the CMOS assemblies to be integrated hybrid are realized by pre- and post-processing of the SiCer substrate in the ceramic layer. The last process step is the hybrid integration of the CMOS functional elements by means of adapted chip bonding processes on the SiCer substrate.

The realization of the main goal was achieved in three steps:

1. Realization of all RF MEMS components on a SiCer substrate as independent RF functional elements.
2. Realization of interconnected RF functional groups on a SiCer substrate
3. Realization of the demonstrator platform with interconnected functional groups and hybrid integrated CMOS devices

Project leader: Prof. Dr.-Ing. Jens Müller
Scientific assistant: Dipl.-Ing. Michael Fischer
Project duration: 01/2016 - 06/2019
Funding: DFG - Deutsche Forschungsgemeinschaft
Funding number: Research Group 1522
Project partners: Micromechanical Systems Group, Electronic Circuits and Systems Group, High Frequency and Microwave Technology Group, Institute for Microelectronic and Mechatronic Systems gGmbH, Chair of Technical Electronics (FAU Erlangen)

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