| Name, Vorname | Bearbeitungszeitraunm | Thema |
| Thampi, Alwin | 05.11.2025 - 05.05.2026 | Combination of through-substrate vias with laterial SiCer |
| Sudhish, Ahalya | 11.11.2025 - 11.05.2026 | Printed electronics on biodegradable substratesw/carriers of organic origin |
| Vazhayil, Neeraj | 27.11.2025 - 27.05.2026 | Optimization of a sintering process for the production of a composite substrate
made of glass and LTCC |
| Ali, Amir | 01.01.2026 - 31.05.2026 | Optimization of lapping process for LTCC for the construction of a cryogenic interposer |
| Sial, Muhammad Junaid | 01.02.2026 - 31.07.2026 | Implementation of select Post-Fire-Glass-Pastes on Low-Temperatur-Cofired-
Ceramic Substrates for high-resolution thick-and thin-film structuring |
| Ahmed, Rehan | 01.04.2026 - 30.09.2026 | Modeling of in-plane test setup for the measurements of the thermoelectric properties of thick-film materials |
| Cadayalu, Sai Santhosh | 01.04.2026 - 30.09.2026 | Bonding behavior and reliability testing of deposited reactive multilayer systems |
| Ahmed, Abdul Basit | 15.04.2026 - 14.10.2026 | Bonding and Debonding of SMDs on LTCC substrate using reactive multilayer systems |
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