Bachelorthemen/Masterthemen/Forschungsprojekt (Research Project)

 Topic: Development and investigation of two-layer “LTCC-sol-gel thin film” structures (Language: English)

The methods for preparing LTCC after sintering are based on the processes of polishing and lapping. These processes are used to create the required thickness tolerance and parallelism for thin film processes. However, at the same time, polishing / lapping led to the opening of the pores contained in the bulk of the ceramic substrates. In order to remove pores and smooth the surface, inorganic layers with a dense structure are applied to the substrates.

In this work, the effect of sol-gel coating of LTCC on the quality of its surface will be investigated.

The basic research steps:

  1. Preparation of substrates before sol-gel spin-coating process:
    1. Cleaning process
    2. investigation of physical parameters of pure substrate before coating (LSM, AFM, SEM)
  2. Application variation of spin-coating method, and sintering parameters to optimize the layer quality
  3. Study of physical parameters of obtained composite structures (LSM, AFM, SEM)
 

Contact:  Dr. Kateryna Soloviova, ZMN 206, Tel. 03677 69-3440

 

Einfluss der Variation von Prozessparametern bei der Dünnschichtprozessierung von LTCC-Substraten (Sprache: Deutsch oder Englisch)

Die Verwendung von LTCC-Multilayerkeramiken kann insbesondere in der Hochfrequenztechnik als vielversprechende Zukunftstechnologie angesehen werden. Eine Möglichkeit zur Prozessierung dieser Keramiken ist die Verarbeitung mittels Dünnschichtprozessen, bei welcher besonders hohe Strukturauflösungen erreicht werden können. Bei der Dünnschichtprozessierung von LTCC-Substraten sind Prozessparameter wie die Fotolackdicke, die Belichtungsdosis und die Entwicklungszeit im Rahmen der Fotolithografie von entscheidender Bedeutung für die erreichbaren Strukturauflösungen.

Im Rahmen einer Bachelor-, Master- oder Projektarbeit soll der Einfluss von verschiedenen Parametern auf die Qualität von Metallisierungen verschiedener Metalle in postfire-LTCC-Schritten untersucht werden.

Die Bearbeitungsschritte umfassen:

  1. Aufstellung eines Prozessplans mit Variierung der Parameter
  2. Selbstständige Durchführung der Prozessreihen
  3. Reiteration mit Fokus auf Auflösungsoptimierung
  4. Auswertung der Ergebnisse und umfangreiche Aufarbeitung der gefundenen Optima

Kontakt:M.Sc. Uwe Ziegler, K1065, Tel. 03677 69-1360

 

The development of high density interconnect ceramic-based platform (Language: English)

The evolution of high performance electronics requires the development of high density interconnect packages. Hence, the development of miniaturized conductive structures and microvias to electrically connect the structures in different ceramic layers is very important.

This project aims to analyse the combination of fine line structures with conductive microvias fabricated in green Low Temperature Co-fired Ceramics (LTCC) tapes to create on-surface and embedded miniaturized structures. The conductors will be optimized to be connected to microvias up to 8 µm in diameter. The following goals should be achieved:

  • The optimization of stencil printing for fine line structuring in green state of LTCC tapes
  • The combination of microvias with the achieved structures in the green and sintered states
 

Keyword: Stencil-printing, screen-printing, HDI, microvias, LTCC technology

Tasks:

Step 1:

Literature review in the following subjects:

  • Technological evolution of LTCC technology
  • What are the limitations and problems found in the creation of HDI packages (LTCC/PCB)
  • How to overcome HDI design issues
 

Step 2

  • The design analysis of optimized stencil printing of conductive lines on LTCC green tapes with embedded conductive vias (AutoCAD)
  • The design optimization microstructures with low alignment tolerance
  • The geometrical analysis of miniaturized conductive lines in LTCC green tapes (UHL and Nikon microscopes, LSM, SEM)
  • The electrical investigation of the combined high resolution lines and vias
 

We expect very good professional performance in studies, above-average commitment and willingness to learn.

We offer an interesting job in a motivated, interdisciplinary team. If you are curious, I look forward to a personal conversation.

Contact: M. Sc. Nesrine Jaziri, Kirchhoff building room 1065, Tel. 69 1117

 

The analysis of hybrid thick/thin-film based micro-thermoelectric generator (Language: English)

Thermoelectric generators (TEGs) present an outstanding performance for converting thermal into electrical energy. TEGs are used in many sectors from low to high power applications. Combining thick and thin technologies allows the creation of high performance miniaturized TEGs.

The objective of this work is the analysis of thermoelectric generators fabricated in in Low Temperature Co-fired Ceramics (LTCC) substrates using both thick and thin-film technologies.

For this purpose, the following subtasks are to be solved:

  • Literature review of thermoelectric generators fabricated in both LTCC and Si technologies
  • Surface analysis of glass structures on the thermocouples (screen printing and deposition)
  • Geometrical and electrical analysis of the hybrid thick/thin-film thermocouples
 

Tools: LSM, SEM, AFM, AutoCAD, optical microscopes (UHL and Nikon microscopes)

Keyword: TEGs, energy harvesting, LTCC, PECVD, sputtering

We expect very good professional performance in studies, above-average commitment and willingness to learn.

We offer an interesting job in a motivated, interdisciplinary team. If you are curious, I look forward to a personal conversation.

Contact: M. Sc. Nesrine Jaziri, Kirchhoff building room 1065, Tel. 69 1117