Konferenzbeiträge 2019
- Töpfer, J.; Schulz, Th.; Capraro, B.; Bartsch, H.:
Relaxor Dielectrics for Multilayer Capacitors with Temperature-stable Permittivity Up to 250°C
MS&T19 (Material Science and Technology), September 29 to October 3, Portland, Oregon, USA, - Schur, J.; Müller, J.:
Zirkulatoren für Ka- und Q-Band-Anwendungen mit eingebetteten Sc-substituierten Bariumhexaferriten in LTCC
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 534-536 - Kaltwasser, M.; Karmaleevah, K.; Müller, J.:
Dünnschichtstrukturierung metallorganischer Resinatpasten auf Glaswafern
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin. S. 607-609 - Fischer, M; Werthes, T.; Kleinholz, C.; Müller, J.:
Aktive Kühlung unter Verwendung von Fluidkanälen in einem Silizium-Keramik-Verbundsubstrat
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin: VDE Verlag (2019), ISBN: 978-3-8007-5090-0 - Bartsch, H.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
Keramische Multilagenspulen zur Anwendung in der Hochtemperaturelektronik
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 565-568 - Gutzeit, N.; Schulz, A.; Fischer, M.; Thelemann, T.; Müller, J.:
Picosecond laser structuring technology for LTCC - the improvement of fine line structuring
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy; DOI: 10.23919/EMPC44848.2019.8951813 - Schulz, A.; Gutzeit, N.; Müller, J.:
Laser sturctured passive components and RF filter in LTCC technology with operating frequencies up to 40 GHz focusing on 5G mobile applications
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy; doi: 10.23919/EMPC44848.2019.8951846 - Fischer, M.; Werthes, T.; Kleinholz, C.; Müller, J.:
Active cooling using fluid channels in a silicon-ceramic composite substrate
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy; DOI: 10.23919/EMPC44848.2019.8951844 - Petrich, R.; Bartsch, H.; Tonisch, K.; Jaekel, K.; Barth, S.; Bartzsch, H.; Glöß, D.; Delan, A.; Krischok, St.; Strehle, S.; Hoffmann M.; Müller, J.:
Investigation of ScAlN for piezoelectric and ferroelectric applications
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy, DOI: 10.23919/EMPC44848.2019.8951824 - Bartsch, H.; Pezoldt, J.; Morales Sanchez, F. M.; Jimenez Rios, J.J.; Mánuel Delgado, J.M.; Breiling, J.; Müller, J.:
LTCC as substrate - enabling semiconductor and packaging integration
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy, DOI: 10.23919/EMPC44848.2019.8951794 - Bartsch, H.; Thiele, S.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
Multilayer coils for the Use at High Temperatures
43rd IMAPS Poland Conference 2019, 4th - 6th September 2019, Wroclaw, Poland - Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M. A.:
Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
International Microwave Symposium (IMS), Boston, MA, USA, 2th - 7th June 2019 - Müller, J.; Kloska, M.; Schulz, A.; Gutzeit, N.; Haas, T-; Zeilmann, C.:
HDI-Technology for Harsh Environment Electronics based on LTCC Substrates
Electronics in Harsh Environments Conference, 2. - 4. April 2019, Park Plaza Amsterdam Airport, Netherlands - Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
Joint Conference of the IEEE International Frequency Control Symposium & European Frequency and Time Forum, Orlando, FL, USA, 14th - 18th April 2019 - Müller, J.; Pezoldt; J. Morales Sanchez, F.M.; Mánuel Delgado, J.M.; Jimenez Rios, J.J:; Bartsch, H.:
Enabling Semiconductor and Packaging Integration
IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2019), Shanghai, China, 16th - 19th April 2019