Conference contributions 2019

  • Töpfer, J.; Schulz, Th.; Capraro, B.; Bartsch, H.:
    Relaxor Dielectrics for Multilayer Capacitors with Temperature-stable Permittivity Up to 250°C
    MS&T19 (Material Science and Technology), September 29 to October 3, Portland, Oregon, USA,  
  • Schur, J.; Müller, J.:
    Zirkulatoren für Ka- und Q-Band-Anwendungen mit eingebetteten Sc-substituierten Bariumhexaferriten in LTCC
    Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 534-536
  • Fischer, M; Werthes, T.; Kleinholz, C.; Müller, J.:
    Aktive Kühlung unter Verwendung von Fluidkanälen in einem Silizium-Keramik-Verbundsubstrat
    Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin: VDE Verlag (2019), ISBN: 978-3-8007-5090-0
  • Bartsch, H.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
    Keramische Multilagenspulen zur Anwendung in der Hochtemperaturelektronik
    Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 565-568
  • Gutzeit, N.; Schulz, A.; Fischer, M.; Thelemann, T.; Müller, J.:
    Picosecond laser structuring technology for LTCC - the improvement of fine line structuring
    22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy;  DOI: 10.23919/EMPC44848.2019.8951813
  • Schulz, A.; Gutzeit, N.; Müller, J.:
    Laser sturctured passive components and RF filter in LTCC technology with operating frequencies up to 40 GHz focusing on 5G mobile applications
    22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy;  doi: 10.23919/EMPC44848.2019.8951846
  • Fischer, M.; Werthes, T.; Kleinholz, C.; Müller, J.:
    Active cooling using fluid channels in a silicon-ceramic composite substrate
    22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy; DOI: 10.23919/EMPC44848.2019.8951844
  • Petrich, R.; Bartsch, H.; Tonisch, K.; Jaekel, K.; Barth, S.; Bartzsch, H.; Glöß, D.; Delan, A.; Krischok, St.; Strehle, S.; Hoffmann M.; Müller, J.:
    Investigation of ScAlN for piezoelectric and ferroelectric applications
    22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy,  DOI: 10.23919/EMPC44848.2019.8951824
  • Bartsch, H.; Pezoldt, J.;  Morales Sanchez, F. M.; Jimenez Rios, J.J.; Mánuel Delgado, J.M.; Breiling, J.; Müller, J.:
    LTCC as substrate - enabling semiconductor and packaging integration
    22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy,  DOI: 10.23919/EMPC44848.2019.8951794
  • Bartsch, H.; Thiele, S.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
    Multilayer coils for the Use at High Temperatures
    43rd IMAPS Poland Conference 2019, September 4-6, 2019, Wroclaw, Poland
  • Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M. A.:
    Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
    International Microwave Symposium (IMS), Boston, MA, USA, Jun. 2-7, 2019
  • Müller, J.; Kloska, M.; Schulz, A.; Gutzeit, N.; Haas, T-; Zeilmann, C.:
    HDI-Technology for Harsh Environment Electronics based on LTCC Substrates
    Electronics in Harsh Environments Conference, 2-4 April 2019, Park Plaza Amsterdam Airport, Netherlands
  • Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
    Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
    Joint Conference of the IEEE International Frequency Control Symposium & European Frequency and Time Forum, Orlando, FL, USA, Apr. 14-18, 2019
  • Müller, J.; Pezoldt; J. Morales Sanchez, F.M.; Mánuel Delgado, J.M.; Jimenez Rios, J.J:; Bartsch, H.:
    Enabling Semiconductor and Packaging Integration
    IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2019), Shanghai, China, April 16-19, 2019