Konferenzbeiträge 2023
- Ziegler, U.; Bartsch, H.; Müller, J.:
Technological Study of Lithographical Structuring of Metals on LTCC
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023), April 18-20, 2023, Albuquerque Marriott Pyramid North - Bartsch, H.; Jaziri, N.; Jaekel, K.; Nessimian, N.; Müller, J.:
Shadow Masks as an Alternative Method to Lithography for the Structuring of Thin-film Layers on LTCC Substrates
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023), April 18-20, 2023, Albuquerque Marriott Pyramid North - Jaziri, N.; Schulz, A.; Bartsch, H.; Müller, J.:
Management and Recovery of Lost Thermal Energy for Environmentally Friendly High-Performance Electronics
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023), April 18-20, 2023, Albuquerque Marriott Pyramid North - Kleinholz, C.; Fischer, M.; Müller, J.:
Assembly and packaging technology on Silicon-Ceramic-based composite substrates
International Conference on Electronics Packaging (ICEP), 19 - 22 April 2023, Kumamoto, Japan
DOI: 10.23919/ICEP58572.2023.10129654 - Kaltwasser, M.; Schulz, A.; Müller, J.:
Glass-LTCC-Interposer, a New Plattform for HF-Applications
IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ; Oslo, 12 - 14 Juni 2023
https://doi.org/10.23919/NordPac58023.2023.10186223 - Kleinholz, C.; Fischer, M.; Gutzeit, N.; Cyriax, A.; Hintz, M.; Ortlepp, Th.; Müller, J.:
Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods
24th European Microelectronics and Packaging Conference & Exhibition (EMPC) / International Microelectronics and Packaging, Cambridge (UK), 11.-14.09.2023, DOI: 10.23919/EMPC55870.2023.10418331
