Konferenzbeiträge 2022
- Jaekel, K.; Bartsch, H.; Müller, J.; Camposano, Y.H.S.; Matthes, S.; Schaaf, P.:
Effect of line structures on the self-propagating reaction of Al/Ni multilayer
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 13.-16.09.2022,
DOI: 10.1109/ESTC55720.2022.9939472 - Kleinholz, C.; Cyriax, A.; Hintz, M.; Müller, J.; Ortlepp, Th.:
Manufacture of high-strength differential pressure sensor using SiCer technology
Internationale Conference on Electronics Packaging (ICEP), Sapporo, 11.-14.05.2022,
DOI: 10.23919/ICEP55381.2022.9795558 - Schulz, A.; Blau, K.; Müller, J.:
LTCC patch antenna array for 5G mobile applications featuring embedded air cavities
Internationale Conference on Electronics Packaging (ICEP), Sapporo, 11.-14.05.2022,
DOI: 10.23919/ICEP55381.2022.9795485 - Weil, C.; Hauck, T.; Schur, J.; Müller, J.:
Broadband Ku- and Ka-Band Circulators in LTCC Using Sintered Bulk Ferrites
European Microwave Conference (EuMC), London, 04.-06.04.2022,
DOI: 10.23919/EuMC50147.2022.9784350 - Kleinholz, C.; Schulz, A.; Müller, J.:
Laser ablation of metallization pastes for SMD assembly technologies onto LTCC substrates
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2022), Juli 13-15, 2022, Wien - Schulz, A.; Ruh, A.; Wiese, St.; Müller, J.:
Characterization of Reactive Multilayer Systems deposited on LTCC screen printing pastes featuring different surface morphologies suitable for reactive joining applications
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2022), Juli 13-15, 2022, Wien
