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Will, Florentina; Tonisch, Katja; Cimalla, Volker; Förster, Christian; Brückner, Klemens; Stephan, Ralf; Hein, Matthias; Ambacher, Oliver
Nanoelectromechanical resonators and their application for viscosity measurements in smallest amounts of liquids. - In: Abstracts, (2006), insges. 1 S.

Brückner, Klemens; Förster, Christian; Tonisch, Katja; Cimalla, Volker; Ambacher, Oliver; Stephan, Ralf; Blau, Kurt; Hein, Matthias A.
Electromechanical resonances of SiC and AIN beams under ambient conditions. - In: Maschinenbau von Makro bis Nano, 2005, [04.P.01], insges. 2 S.

http://www.db-thueringen.de/servlets/DocumentServlet?id=17356
Förster, Christian; Cimalla, Volker; Will, Florentina; Ambacher, Oliver; Brückner, Klemens; Stephan, Ralf; Hein, Matthias; Aperathitis, Elias
Group III-nitrides and 3C-SiC for micro- and nanoelectromechanical resonators. - In: Maschinenbau von Makro bis Nano, 2005, [04.11], insges. 2 S.

http://www.db-thueringen.de/servlets/DocumentServlet?id=17311
Förster, Christian; Cimalla, Volker; Aperathitis, Elias; Brückner, Klemens; Stephan, Ralf; Hein, Matthias; Pezoldt, Jörg; Ambacher, Oliver
Fabrication of 3C-SiC/Si MEMS and NEMS for sensor applications. - In: HeT-SiC-05, (2005), S. 44-49

Förster, Christian; Cimalla, Volker; Brueckner, Klemens; Lebedev, Vadim; Stephan, Ralf; Hein, Matthias; Ambacher, Oliver
Processing of novel SiC and group III-nitride based micro- and nanomechanical devices. - In: Physica status solidi. Applications and materials science. - Weinheim : Wiley-VCH, 2005- , ISSN: 1862-6319 , ZDB-ID: 1481091-8, ISSN 1862-6319, Bd. 202 (2005), 4, S. 671-676

http://dx.doi.org/10.1002/pssa.200460471
Tonisch, Katja; Will, Florentina; Förster, Christian; Cimalla, Volker; Brückner, Klemens; Hein, Matthias; Ambacher, Oliver
SiC and AlN-based micro- and nanomechanical resonators for sensing applications. - In: 7. Dresdner Sensor-Symposium - neue Herausforderungen und Anwendungen in der Sensortechnik, (2005), S. 239-242

Trabert, Johannes F.; Hein, Matthias; Müller, Jens; Perrone, Rubén A.; Stephan, Ralf; Thust, Heiko
High functional density low-temperature co-fired ceramic modules for satellite communications. - In: Conference proceedings, (2005), S. 481-484

Brückner, Klemens; Förster, Christian; Tonisch, Katja; Cimalla, Volker; Ambacher, Oliver; Stephan, Ralf; Blau, Kurt; Hein, Matthias
Electromechanical resonances of SiC and AlN beams under ambient conditions. - In: Conference proceedings, (2005), S. 1531-1534

Weber, Jörn; Volmer , Christian; Blau, Kurt; Stephan, Ralf; Hein, Matthias
Miniaturisation of antenna arrays for mobile communications. - In: Conference proceedings, (2005), S. 1173-1176

Perrone, Rubén; Thust, Heiko; Rentsch, Sven; Trabert, Johannes F.; Hein, Matthias; Müller, Jens
Development and evaluation of photodefined elements for microwave modules in LTCC for space applications. - In: Conference programme & proceedings, (2005), S. 146-151

Within the project KERAMIS (Ceramic Microwave Circuits for Satellite Communications), which is funded by the German Ministry of Education and Technology, a consortium of six companies, research institutes and universities are developing ceramic based microwave circuits and modules for satellite applications. Examples of them are a Reconfigurable Switch Matrix and Hermetic Microwave Packages. - Our investigations are focused on developing, manufacturing and optimizing several types of broadband line transitions, different types of microwave interconnections to other modules or to the motherboard and matching networks and Filters. - Fodel® inks from DuPont were used to realize these multi-layer LTCC elements. Some of these elements include laser-structured micro-vias. - All line transitions and microwave interconnections are required to have a wide bandwidth and a very good impedance matching over the desired frequency range. The bandwidth limitations of the used arrangements depending on their geometrical properties was analyzed, evaluated and optimized and was applied to : - &hahog; design a LGA connection and a coplanar-embedded coplanar-coplanar line transition - &hahog; demonstrate the need for fine line structuring techniques, such us the well known Fodel® Technology, and micro vias when the modules are supposed to work at frequencies over 20 GHz (depending on the application) - 3D S-Parameter Simulations as well as S-Parameter measurements of all manufactured structures are going to be presented and explained.