Zeitschriftenaufsätze, Buchbeiträge

Focus-tunable lenses, e.g., liquid filled membrane lenses (MLs), have found increasingly widespread application in optical systems. If a large refractive power range is to be used, the correction of chromatic aberrations is particularly challenging: a group containing a single ML cannot be corrected over the whole refractive power range. In analogy to hybrid achromats for lenses with constant focal lengths, we present the combination of an ML and a diffractive Alvarez-Lohmann-lens (ALL) for the compensation of axial color over a large refractive power range. In contrast to the combination of multiple MLs, this does not increase the axial length of the system significantly. At the same time, the flexible adaption of the phase function of the diffractive ALL can reduce spherical aberration over the whole focal range. Design examples with ray-tracing and wave-optical simulations demonstrate the performance of the resulting hybrid tunable element. Experimental data from fabricated sample lenses provide a proof of principle.

It is well known that tunable lenses, with refractive power that can be varied, e.g., by changing the curvature of a membrane, can replace the motion of lens groups in zoom systems. Similar to classical zoom systems, the performance of these systems is heavily influenced by the fundamental first-order layout. Moreover, the first-order layout sets the most important requirements for the employed tunable lenses. In this contribution, we present a method for the analysis of a large number of possible first-order solutions for typical requirements and for the selection of the most promising layouts. The first-order solution space is mapped, allowing the layouts to be automatically filtered and plotted depending on pre-defined characteristics. Ray tracing of the marginal and chief rays combined with the traditional thin lens aberration theory provide efficient estimations of the expected installation space requirements and performance for each first-order layout. Using an example, we demonstrate good agreement between these estimations and the corresponding real lens layout, optimized by commercial raytracing software. The presented design method for zoom systems based on tunable lenses is compared with similar approaches for classical zoom lenses.

In this contribution we introduce new multilayer (bilayer and trilayer) resist systems for the generation of nanostructures with high aspect ratios of up to 14:1 on 4-in. full wafer scale. The bilayer stack consists of a bottom resist layer (lift off polymer LOR1A) and an UV-curable top resist layer (UV-NIL resist mr-NIL210 200 nm). The top resist is structured by UV-nanoimprint lithography with a soft polydimethysiloxane (PDMS) stamp (soft UV-NIL). After removal of the residual layer a wet chemical development is performed to achieve an isotropic undercut underneath the nanostructures in the top layer. This undercut is mandatory in order to perform a reliable and precise lift-off. The bilayer system is applicable on both silicon and fused silica. For a higher variety and combination of different resists, a trilayer system is investigated. A layer stack with new materials for bottom and top layer is presented. An intermediate layer made of silicon oxide by low temperature ICP-PECVD is added between a tailor-made top resist (mr-NIL213FC 200 nm) and an organic transfer layer (UL1). The intermediate layer serves as hard mask in order to etch the bottom layer isotropically utilizing a plasma etch process and thus replacing the wet-chemical development step. Subsequently, a thin metal layer is deposited onto the structured resist stack by electron beam evaporation. After lift-off, a nanostructured metal mask remains on the substrate providing a high selectivity during the following plasma etch step. A cryogenic ICPRIE etch process creates high aspect ratio nanostructures within the substrate. An aspect ratio of 14:1 was achieved.

Searching for the relationship between the nanostructure and optical properties has always been exciting the researchers in the field of optics (linear optics as well as non-linear optics), energy harvesting (anti-reflective Si solar cells, perovskite solar cells, ..., etc.), and industry (anti-reflection coating on car windows, sunglasses, etc.). In this work, we present an approach for nanostructuring the silicon substrate to silicon photonic crystals. By precisely controlling the etching time and etching path after using nanoimprint lithography, ordered arrays of inverted Si nanopyramids and Si nanopillars with good homogeneity, uniform surface roughness, high reproducibility of pattern transfer, and a controllable aspect ratio are prepared. Experimental investigation of the optical properties indicates that the reflections of these Si nanostructures are mainly determined by the aspect ratio as well as the period of nanostructures. Furthermore, we have experimentally observed visible-light scattering (V-LS) patterns on inverted Si nanopyramids and Si nanopillars, and their corresponding patterns can be precisely controlled by the patterned nanostructures. The V-LS pattern, background, and "ghost peaks" on the angle-resolved scattering results are caused by constructive interference, destructive interference, and the interference situation between both. This controllable nanopatterning on crystalline Si substrates with precisely tunable optical properties shows great potential for applications in many fields, for example, optics, electronics, and energy.

The field of optical lithography is subject to intense research and has gained enormous improvement. However, the effort necessary for creating structures at the size of 20 nm and below is considerable using conventional technologies. This effort and the resulting financial requirements can only be tackled by few global companies and thus a paradigm change for the semiconductor industry is conceivable: custom design and solutions for specific applications will dominate future development (Fritze in: Panning EM, Liddle JA (eds) Novel patterning technologies. International society for optics and photonics. SPIE, Bellingham, 2021. https://doi.org/10.1117/12.2593229). For this reason, new aspects arise for future lithography, which is why enormous effort has been directed to the development of alternative fabrication technologies. Yet, the technologies emerging from this process, which are promising for coping with the current resolution and accuracy challenges, are only demonstrated as a proof-of-concept on a lab scale of several square micrometers. Such scale is not adequate for the requirements of modern lithography; therefore, there is the need for new and alternative cross-scale solutions to further advance the possibilities of unconventional nanotechnologies. Similar challenges arise because of the technical progress in various other fields, realizing new and unique functionalities based on nanoscale effects, e.g., in nanophotonics, quantum computing, energy harvesting, and life sciences. Experimental platforms for basic research in the field of scale-spanning nanomeasuring and nanofabrication are necessary for these tasks, which are available at the Technische Universität Ilmenau in the form of nanopositioning and nanomeasuring (NPM) machines. With this equipment, the limits of technical structurability are explored for high-performance tip-based and laser-based processes for enabling real 3D nanofabrication with the highest precision in an adequate working range of several thousand cubic millimeters.