PaSiC

SiCer composite substrates for photoacoustic sensors

Contact person

Prof. Jens Müller
Electronics Technology Group

Phone: +49 3677 69-2606
e-mail: jens.mueller@tu-ilmenau.de

Funding information

Project leader: Projektträger Jülich GmbH

Project number: 03XP0276D

Participating groups: Electronics Technology Group

Period of funding: 01.07.2020 - 31.12.2022

Project information

 

The aim of the project is to further develop the silicon-ceramic sintered composite technology into a broadly applicable industrial technology platform for the realisation of robust and miniaturised IR components (IR radiation sources and detectors) and new types of cost-efficient sensors based on photoacoustic and optical principles. To this end, the Technology Readiness Level (TRL) achieved in previous projects is to be gradually raised from 4 to 5-6.

The research project addresses the combination of the inorganic non-metal LTCC ceramic with the semi-metal silicon for a gas-tight composite without permanent organic auxiliary materials. The joint sintering of silicon and glass ceramic is a key unique selling point. It has been possible to combine both materials largely without pressure and stress by sintering. This does not require polishing of the two partners, but the pre-processed green tape stack of the ceramic is laminated onto a pre-processed silicon wafer and then sintered. The resulting SiCer hybrid substrate can be further processed - with adapted thin-film processes. The silicon is thus available for MEMS processes, while the LTCC ceramic can be used as a carrier for further functions (e.g. fluidics), as a rewiring layer and housing. Thus, on the one hand, the hybrid substrate offers ideal conditions for the realisation of optical sensor elements directly in the silicon wafer. On the other hand, the use of LTCC ceramics as a wiring level also allows the classic hybrid integration of further sensor and electronic components.