Conference contributions 2015
- A. Ebert, S. Kaleem, J. Müller, R. Stephan, D. Stöpel, T. Kässer, W. Konrath, M.A. Hein:
An industry-level implementation of a compact microwave diode switch matrix for flexible input multiplexing if a geo-stationary satellite payload
Microwaves Communications Antennas and Electronic Systems (COMCAS) 2015 IEEE International Conference on, pp. 1-4, 2015 - R. Zeiser, S. Ayub S, P. Wagner, J. Müller, S. Henneck, J. Wilde:
Low Stress Flip-Chip Package for Pressure Sensors Operating at 500 °C
18th Conference on Solid-State Sensors, Actuators and Microsystems - Transducers, ISBN 978-1-4799-8955-3, Seiten: 1271 - 1274 - S. Gropp, M. Fischer, J. Müller, M. Hoffmann:
A hybrid SiCer substrate based on direct glass-based bonding of LTCC and silicon
WaferBond´15, Braunschweig, Germany, 7.-12. Dezember 2015 - H. Bartsch, K. Welker, H. Witte, J. Müller:
Integrierte NTC-Dickschichtsensoren in LTCC Fluidmodule zur Temperaturregelung in bio-zentrierten Zellhandlingsystemen
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7 - H. Bartsch, K. Welker, H. Witte, J. Müller:
Integrierte NTC-Dickschichtsensoren in LTCCFluidmodule zur Temperaturregelung in bio-zentrierten Zellhandlingsystemen
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7 - J. Müller:
Status and Trends of Microelectronics and Packaging in Europe
Invited presentation, 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC 2015), Kyoto, Japan, 14-17 April 2015 - M. Fischer, S. Gropp, J. Nowak, R. Sommer, M. Hoffmann, and J. Müller:
RF-MEMS Platform based on Silicon-Ceramic-Composite-Substrates
9th German Microwave Conference, (GeMiC), Nürnberg, Germany, 16.-18. March 2015 - S. Gropp, M. Fischer, M. Hoffmann, J. Müller, A. Frank, C. Schäffel:
Electrostatic parallel-plate MEMS Switch on Silicon-Ceramic-Composite-Substrates
9th German Microwave Conference, (GeMiC), Nürnberg, Germany, 16.-18. March 2015 - D. Podoskin, K. Brückner, M. Fischer, S. Gropp, D. Krauße, J. Nowak, M. Hoffmann, J. Müller, R. Sommer, and M. A. Hein:
Multi-Technology Design of an Integrated MEMS-based RF Oscillator Using a Novel Silicon-Ceramic Compound Substrate
9th German Microwave, Conference (GeMiC), Nürnberg, Germany, 16.-18. March 2015 - Tilo Welker, Sabine Günschmann, Nam Gutzeit, Jens Müller:
Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process1th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Dresden, Germany, April 20-23, pp. 62–66, 2015 - Tilo Welker, Sumy Mathew, Steffen Spira, Stephan Ralf, Nam Gutzeit, Jens Müller, Matthias A. Hein:
An analog optical transmitter module with a passive aligned fiber based on a flip chip mounted VCSEL
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015 - Tilo Welker, Jens Müller, Frank Krämer, Steffen Wiese:
Electrical, Thermal and Mechanical Characterization of Low Temperature, Pressure-less Sintered Silver Bond Interfaces
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015 - Sumy Mathew, Steffen Spira, Ralf Stephan, Tilo Welker, Nam Gutzeit, Jens Müller, Matthias A. Hein:
Geometrical tolerance of optical fiber and laser diode for the passive alignment using LTCC technology
9th German Microwave Conference, GeMiC, Nürnberg, Germany, March 16-18, pp. 363–366, 2015 - Jens Müller, Tilo Welker, Alexander Schulz:
Advanced LTCC Processes for Microwave Structures and Components in LTCC
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015 - Nam Gutzeit, Tilo Welker, Michael Fischer, Jens Müller:
Thin film strain gauges on LTCC membranes for surface monitoring of high power lasers mirrors
11th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Dresden, Germany, April 20-23, 2015 - Heike Bartsch, Dirk Stöpel, Marcel Himmerlich, Martin Baca, Philipp Stadie, Jari Hyttinen, Jens Müller and Andreas Schober:
LTCC Based Multi-Electrode Arrays for In-Vitro Cell Culture
In: Proceedings of International Conference on Ceramic Interconnect & Ceramic Microsystems Technologies CICMT
April 20–23, 2015, Dresden, Germany - Heike Bartsch, Ulrike Brokmann, Boris Goj, Robert Weiss, Edda Rädlein, Jens Müller:
Sol gel thin films on LTCC ceramic multilayers enable their use as thin film substrates
In: Proceedings of 20th European Microelectronics and Packaging Conference (EMPC), September 14-16, Friedrichshafen, Germany - Nam Gutzeit, Michael Fischer, Heike Bartsch, Jens Müller:
Lapping and Polishing of Different LTCC Substrates for Thin Film Applications
In: Proceedings of 20th European Microelectronics and Packaging Conference (EMPC), September 14-16, Friedrichshafen, Germany - Heike Bartsch, Tilo Welker, Hartmut Witte, Jens Müller:
LTCC based bioreactors for cell cultivation
Invited lecture of the 39th International Microelectronic and Packaging Conference, September 20-23, Gdańsk, Poland - M. Fischer, D. Karolewski, T. Welker, K. Schelestow, S. Gropp, M. Hoffmann, J. Müller:
Thermisches Verhalten von SiCer – ein innovatives Verbundsubstrat für MEMS
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7 - S. Gropp, M. Fischer, M. Hoffmann:
Aufbau eines HF-MEMS-Schalters in einem Silicium-Keramik-Verbundsubstrat
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7
