Publication

Tounsi, F.; Jaziri, N.; Kaltwasser, M.; Fischer, M.; Flandre, D.; Müller, J.:
Hybrid LTCC–Polyimide Approach for High-Sensitivity Mechanical Sensing Applications
published in Sensors 2026, 26(5), 1419; 24.02.2026, https://doi.org/10.3390/s26051419

Wiss, E.; Jaziri, N.; Müller, J.; Wiese, St.:
Impact of Bonding Pressure on the Reactive Bonding of LTCC Substrates
In: Micromachines 2025, 16(3), 321; https://doi.org/10.3390/mi16030321

Beckert, E.; Hein, M.; Müller, J.; Jetter, M.; Babin, M.; Chowdhury, S.; Stehr, U.; Kleinholz, C.; Zimmer, M.; Engel, L.; Kripfgans, J.; Spiess, C.:
Ultracompact, VCSEL-based photon source for prepare-and-measure QKD
SPIE Proceedings, Proceedings Volume 13391, Quantum Computing, Communication, and Simulation V; 133910E (2025) https://doi.org/10.1117/12.304427

Ziegler, U.; Bartsch, H.; Müller, J.:
A Technological Study of Lithographical Structuring of Aluminum on Select Low-Temperature-Cofired-Ceramic Surfaces
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume: 15 Issue: 3, March 2025;  DOI: 10.1109/TCPMT.2025.3539000

Kleinholz, C.; Müller, B.; Fischer, M.; Schulz, A.; Motzkus, C.; Capraro, B.; Müller, J.:
Impact of sintering conditions on solderability and wire bondability of thick-film metallizations for Silicon-Ceramic composite substrates
Engineering Research Express, Volume 7, Number 3, http://dx.doi.org/10.1088/2631-8695/adf948

Piekarz, I.; Sorocki, J.; Gruszczynski, S.; Wincza, K.; Gorska, S.; Bartsch, H.; Wang, H.; Shamim, A.:
Highly sensitive space-filling planar microwave biosensors for label-free E. coli bacteria sensing with enhanced detection capability
Elsevier, ScienceDirect, Measurement, Volume 257, Part E, 119028
https://doi.org/10.1016/j.measurement.2025.119028

Yuile, A.; Schulz, A.; Wiss, E.; Müller, J.; Wiese, St.:
2D computational fluid dynamics simulation analysis of the assembly of low-temperature cofired ceramics/low-temperature cofired ceramics and Si/Si sandwiches by reactive bonding
In: Advanced engineering materials, Jg. 27 (2025), Heft 3, S. 1 - 6, Artikel 2302283
DOI: 10.1002/adem.202302283

Vardo, E.; Sauni C.; Yesenia H.; Matthes, S.; Glaser, M.; Bartsch, H.; Hildebrand, J.; Bergmann, J. P.; Schaaf, P.:
Impact of substrate thickness and surface roughness on Al/Ni multilayer reaction kinetics
In: Advanced engineering materials, Jg. 27 (2025), Heft 3, S. 1 - 10, Artikel 2302269
DOI: 10.1002/adem.202302269

Soloviova, K.; Kurtash, V.; Nessimian, N.; Slimi, Y.; Pezoldt, J.; Müller, J.:
Preparation and functionalization of LTCC substrate surfaces for advanced integration applications using thin film process
In: Journal of materials research and technology : jmr & t ; official publication of the Brazilian Metallurgical, Materials and Mining Association, Band 38 (2025), S. 5691 - 5699
DOI: 10.1016/j.jmrt.2025.09.034

Wiss, E.; Jaziri, N.; Müller, J.;  Wiese, St.:
Usage of Reactive Joining Methods on LTCC Substrates: Experiments and Simulation
26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);  06-09 April 2025; Utrecht, Netherlands; DOI: 10.1109/EuroSimE65125.2025.11006566

Jaziri, N.; Wiss, E.; Ziegler, U.; Wiese, S.; Müller, J.:
Investigation of the Solder Thickness Effect on the Propagation Properties of Reactive Multilayer Systems
 International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary, 14-18 May 2025, pp. 1-6, doi: 10.1109/ISSE65583.2025.11120926

Wiss, E.; Jaziri, N.; Müller, J.; Wiese, S.:
Reactive Bonding by the use of Nanolayer Stacks on LTCC Substrates
International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary, 14-18 May 2025, pp. 1-4, doi: 10.1109/ISSE65583.2025.11121003

Jaziri, N.; Ziegler, U.; Müller, J.:
Advancements in Miniaturization of High-Aspect Ratio Through Ceramic Microvias (TCμV) for High-Density Interconnect LTCC Interposer
International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary, 14-18 May 2025, pp. 1-6, doi: 10.1109/ISSE65583.2025.11121060

Ziegler, U.; Jaziri, N.; Ratajczak, L.; Reinhardt, K.; Körner, S.; Müller, J.:
A Technological Study Examining the Implementation of Sub-15 μm Finelines using Photoimageable Thick-Film Pastes on Low-Temperature Cofired Ceramics
International Spring Seminar on Electronics Technology (ISSE), Budapest, Hungary, 14-18 May 2025, pp. 1-5, doi: 10.1109/ISSE65583.2025.11121061

Abedin, S.; Reich, P.; Bartsch, H.; Müller, J.; Heinrich, D.; Pezoldt, J.:
Fabrication and Characterization of TiN Nanogap Electrodes for DNA-based Nanoelectronic Devices
35th Anniversary World Congress on Biosensors, 19-22 May 2025, Lisbon Portugal

Jaekel, K.; Glaser, M.; Sauni Camposano, J.H.; Matthes, S.; Schaaf, P.; Bergmann, J.P.:
Investigation  on how nanostructured silicon surfaces impact reactive bonding between  silicon-silicon and silicon-low-temperature cofired ceramics
IMAPS Nordic Conference on Microelectronics Packaging (NordPac),  10-12 June 2025, Copenhagen, Denmark,
DOI: 10.23919/NordPac65171.2025.11084261

Nessimian, N.; Polster, P.; Müller, J.; Bartsch, H.: 
Reduction of surface defects by sol-gel coating of LTCC multilayer
XIXth Conference of the European Ceramic Society, August 31 – September 4, 2025, Dresden

Sadeddine, A.; Nessimian, N.; Karnfelt, C.; Bartsch, H.; Müller, J.; Gallée, F.:
Approach for Extracting the Relative Permittivity Using a Ring Resonator Fabricated on an LTCC Substrate
25th European Microelectronics & Packaging Conference (EMPC 2025), 16 - 18 September 2025, Grenoble, France

Nessimian, N.; Sadeddine, A.; Müller, J.; Bartsch, H.:
Thin film ring resonators on polished LTCC multilayer for improved RF performance
25th European Microelectronics & Packaging Conference (EMPC 2025), 16 - 18 September 2025, Grenoble, France

Abedin, S.; Reich, P.; Bartsch, H.; Müller, J.;  Heinrich, D.; Pezoldt, J.:
TiN Nanogap Electrodes for DNA Nanoelectronics and Computing: Fabrication and Characterization
MikroSystemTechnik Kongress 2025 · 27. – 29. Oktober 2025 · Duisburg, Germany, Seite 143

Bartsch, H.; Kaltwasser, M.; Nessimian, N.; Müller, J.:
Review on ceramic multilayer circuit carriers for monolithic sensor integration
MikroSystemTechnik Kongress 2025 · 27. – 29. Oktober 2025 · Duisburg, Germany, Seite 123-127

Jaziri, N.; Schulz, A.; Bartsch, H.; Müller, J.; Tounsi, F.:
A novel 2-in-1 heat management and recovery system for sustainable electronics
In: Energy Conversion and Management, vol. 303, p. 118171  DOI: 10.1016/j.enconman.2024.118171

Jaekel, K.; Riegler, S.S.; Sauni, Y.H.; Matthes, S.; Glaser, M.; Bergmann, J.P.; Schaaf, P.; Gallino, I.; Müller, J., Bartsch, H.:
Influence of increasing density of microstructures on the self-propagating reaction of Al/Ni reactive nanoscale multilayers
Open Access, Advanced Engineering Materials, published: 11 April 2024, https://doi.org/10.1002/adem.202302225

Jimenez, J.J.; Jaekel, K.; Pauly, Chr.; Schäfer, Chr.; Bartsch, H.; Mücklich, F.; Morales, F.M.:
Impact of Sample Preparation Approach on TEM Investigation of Sputtered AlNi Multilayers Used for Reactive Soldering
Open Access, Advanced Engineering Materials, published: 11 April 2024, https://doi.org/10.1002/adem.202302215

Matthes, S.; Glaser, M.; Vardo, E.; Sauni, Y.H.; Jaekel, K.; Bergmann, J.P.; Schaaf, P.:
Tailoring the reaction path: External crack initiation in reactive Al/Ni Multilayers
Open Access, Advanced Engineering Materials, published: 11 April 2024, https://doi.org/10.1002/adem.202302271

Heidenreich, M.; Schur, J.; Müller, J.; Gitzel, W.;  Jacob, A.F.; Töpfer, J.: 
Hexagonal ferrites for self-biasing circulators integrated in LTCC microwave modules
Elsevier, Materials Research Bulletin Vol. 178 (2024), https://authors.elsevier.com/c/1j3ei5pgllUul

Bartsch, H.; Kaltwasser, M.; Karimi, K.; Müller,J.:
Low insertion loss interposer approach for RF applications based on commercial LTCC tape, alkaline-free glass and printed metallization
Elsevier, Materials Research Bulletin Vol. 178 (2024), https://www.sciencedirect.com/science/article/pii/S0025540824002332

Riegler, S.S.; Camposano, Y.H.S.; Jaekel, K.; Frey, M.; Neemann, Chr.; Matthes, S.; Vardo, E.; Chegeni, M.R.; Bartsch, H.; Busch, R.; Müller, J.; Schaaf, P.; Gallino, I.:
Nanocalorimetry of Nanoscaled Ni/Al Multilayer Films: On the Methodology to Determine Reaction Kinetics for Highly Reactive Films
Open Access, Advanced Engineering Materials, published: 23 April 2024, DOI: https://doi.org/10.1002/adem.202302279

Wiss, E.; Schulz, A.; Ruh, R.; Jaekel, K.; Müller, J.; Wiese, St.:
Morphologies of Reactive Nanolayer Stacks Sputtered on Ceramic Low-Temperature Cofired Ceramic Substrates Having a Micrometer-Scale Surface Roughness
Open Access, Advanced Engineering Materials, published: 10 May 2024, DOI: https://doi.org/10.1002/adem.202302284

Camposano, Y.H.S.; Jaekel, K.; Riegler, S.S.; Matthes, S.; Glaser, M.; Peter, N.J.; Vardo, E.; Bartsch, H.; Schwaiger, R.; Bergmann, J.P.; Gallino, I.; Schaaf, P:
Controlling Propagation Velocity in Al/Ni Reactive Multilayer Systems by Periodic 2D Surface Structuring
Open Access, Advanced Engineering Materials, published: 30 May 2024, DOI: https://doi.org/10.1002/adem.202302272

Jaekel, K.; Jiménez, J.J.; Riegler, S.S.; Matthes, S.; Glaser, M.; Bergmann, J.P.; Schaaf, P.; Gallino, I.; Morales, F.M.; Müller, J.; Bartsch, H.:
Influence of additional intermediate thick Al layers on the reaction propagation and heat flow of Al/Ni reactive multilayers
Open Access, Advanced Engineering Materials, published: 30 Juni 2024, DOI: https://doi.org/10.1002/adem.202400522

Kleinholz, C.; Müller, B.; Fischer, M.; Dreissigacker, M.; Nallaweg, O.; Tschoban, C.; Becker, K.-F.; Schneider-Ramelow, M.; Müller, J.:
Investigation of Cavity Fabrication Methods for Integrated Horn Antenna Structures in Low Temperature Cofired Ceramic (LTCC) Substrates
Journal of Microelectronics and Electronic Packaging 21 (4): 80–85, 2024, DOI. https:/​/​doi.org/​10.4071/​001c.127403.

Müller, J.; Kaltwasser, M.; Bartsch, H.; Behrens, A.; Handte, T.; Wüster, J.; Sinzinger, St.:
Glass and Glass/LTCC Interposers as Heterogenous Integration Platform
Pan Pacific Strategic Electronics Symposium (Pan Pacific), Kona, Big Island, HI, USA, 2024, pp. 1-7,
doi: 10.23919/PanPacific60013.2024.10436523.

Beckert, E.;  Jetter, M.; Müller, J.; Hein, M.; Spiess, Chr.; Chowdhury, S.; Schreiber, P.; Zeng, F.; Engel, L.; Zimmer, M.; Cutuk, A.;  Supreeti, S.; Stehr, U.; Bartsch, H.; Kaltwasser, M.; Babin, M.:
Compact, high performant prepare-and-measure photon source based on indistinguishable VCSELs
Proceedings Volume 12911, Quantum Computing, Communication, and Simulation IV; 129110W (2024) https://doi.org/10.1117/12.2691176, Event: SPIE Quantum West, 2024, San Francisco, California, United States

Kleinholz, C.; Müller, B.; Fischer, M.; Dreissigacker, M.; Nallaweg, O.; Tschoban, C.; Becker, K.-F.; Schneider-Ramelow, M.; Müller. J.:
Investigation of cavity fabrication methods for integrated horn antenna structures in Low Temperature Cofired Ceramic (LTCC) substrates
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2024), April 10-12, 2024, Osaka, Japan
(DOI: folgt)

Kleinholz; C.; Müller, B.; Fischer, M.; Tschoban, C.; Köszegi, J.-M.; Pötter, H.; Ndip, I.; Schneider-Ramelow, M.; Müller, J.:
Surface Manipulation of Ag Metallization to Improve the Adhesion Strength for Soldering Applications on LTCC
International Conference on Electronics Packaging (ICEP 2024), April 17-20, 2024, Toyama, Japan
(DOI: 10.23919/ICEP61562.2024.10535677)

Kleinholz, C.; Fischer, M.; Müller, J.:
Reliability Study of Ag through via Interconnects for Integrated Horn Antennas in LTCC Substrates
International Conference on Electronics Packaging (ICEP 2024), April 17-20, 2024, Toyama, Japan
(DOI: 10.23919/ICEP61562.2024.10535536)

Wiss, E.; Jaziri, N.; Yuile, A.; Müller, J.; Wiese, St.: 
Experimental Study on Reactive Joining Processes on LTCC Substrates
10th Electronics System-Integration Technology Conference (ESTC),  11-13 September 2024, Berlin, 
DOI: 10.1109/ESTC60143.2024.10712029

Yuile, A.; Jaziri, N.; Wiss, E.; Müller, J.; Wiese, St.:
Simulations of Thermocouple Measurements During Reactive Bonding Processes on LTCC Substrates
10th Electronics System-Integration Technology Conference (ESTC),  11-13 September 2024, Berlin, 
DOI: 10.1109/ESTC60143.2024.10712001

Piekarz, I.; Sorocki, J.; Gorska, S.; Bartsch, H.; Rydosz, A.; Smolarz, R.; Wincza, K.; Gruszczynski, S.:
High sensitivity and selectivity microwave biosensor using biofunktionalized differential resonant array implemented in LTCC for Escherichia coli detection
In: Measurement, Volume 208, 28 February 2023, https://doi.org/10.1016/j.measurement.2023.112473

Heidenreich, M.; Schur, J.; Müller, J.; Capraro, B.; Gitzel, W.; Jacob, A.F.; Töpfer, J:
Fabrication of Self-Biased Circulators with Integrated Hexagonal Microwave Ferrites Using LTCC Technology
In: Process Engineering, cfi/Ber. DKG 100 (2023) No. 2

Camposano, Y.H.S.;  Bartsch, H.; Matthes, S.; Oliva-Ramirez, M.; Jaekel, K.; Schaaf, P.:
Microstructural Characterization and Self-Propagation Properties of Reactive Al/Ni Multilayers Deposited onto Wavelike Surface Morphologies: Influence on the Propagation Front Velocity
Wiley Online Library, applications and materials science, 28. January 2023, https://doi.org/10.1002/pssa.202200765

Fink, S.; Fischer, M.; Spange, S.; Beier, O.; Horn, K.; Tittelbach, J.; Wiegand, C.:
Cold Atmospheric Plasma Exerts Antimicrobial Effects in a 3D Skin Model of Cutaneous Candidiasis
In Antibiotics 2023, 12, 933.
https://doi.org/10.3390/antibiotics12050933

Kleinholz, C.; Fischer, M.; Müller, J.:
Assembly and packaging technology on Silicon-Ceramic-based composite substrates
IEEE Xplore: 23 May 2023, DOI: 10.23919/ICEP58572.2023.10129654

Fink, S.; Warncke, P.; Fischer, M.; Stubenrauch, M.; Horn, K.; Spange, S.; Pfuch, A.; Müller, J.; Fischer, D.; Wiegand, C.:
Determination of biocompatibility and antimicrobial efficacy of a new ceramic micro-plasma source
Enthalten in: Experimental dermatology. - Oxford : Wiley-Blackwell, 1992- , ISSN: 1600-0625 , ZDB-ID: 2026228-0
- Bd. 32 (2023), 4, S. e16, DOI: 10.1111/exd.14067

Matthes, S.; Glaser, M.; Vardo, E.; Sauni Camposano, Y.H.; Jaekel, K.; Bergmann, J.P.; Schaaf, P.:
Influence of extrinsic induced tensile stress on the self-propagating high-temperature synthesis of nanosized Al/Ni multilayers
Enthalten in: Journal of materials science. - Norwell, Mass : Springer Science + Business Media B.V., 1966- , ISSN: 0022-2461 , ZDB-ID: 218324-9, - Bd. 58 (2023), 24, S. 10085-10095, DOI 10.1007/s10853-023-08618-w

Jaekel, K.; Sauni Camposano, Y.H.; Matthes, S.; Glaser, M.; Schaaf, P.; Bergmann, J.-P.; Müller, J.; Bartsch, H.:
Ni/Al multilayer reactions on nanostructured silicon substrates
Springer, Journal of Materials Science, Published: 07 August 2023, DOI 10.1007/s10853-023-08794-9

Supreeti, S.; Fischer, M.; Fritz, M.; Müller, J.:
High-resolution patterning on LTCC by transfer of photolithography-based metallic microstructures
Enthalten in: International journal of applied ceramic technology. - Westerville, Ohio : Wiley-Blackwell, 2004- , ISSN: 1744-7402, https://doi.org/10.1111/ijac.14569

Kaltwasser, M.; Schulz, A.; Müller, J.:
Glass-LTCC-Interposer, a New Plattform for HF-Applications
Enthalten in: IEEE Xplore digital library / Institute of Electrical and Electronics Engineers. - New York, NY : IEEE, 2000- , ISSN: 2473-2001 , ZDB-ID: 2098813-8, https://doi.org/10.23919/NordPac58023.2023.10186223

Jaekel, K. Sauni Camposano, Y.H.; Matthes, S.; Glaser, M.; Schaaf, P.; Bergmann, J.P.; Müller, J.; Bartsch, H.:
Ni/Al multilayer reactions on nanostructured silicon substrates
Springer Verlag, Journal of Materials Science, 07. August 2023, 58, pages 12811–12826,
https://link.springer.com/article/10.1007/s10853-023-08794-9

Maamer, B.; Jaziri, N.; Said, M.H.; Tounsi, F.:
High-displacement electret-based energy harvesting system for powering leadless pacemakers from heartbeats
ARCHIVES OF ELECTRICAL ENGINEERING VOL. 72(1), pp. 229 –238 (2023) DOI 10.24425/aee.2023.143699

Ziegler, U.; Bartsch, H.; Müller, J.:
Technological Study of Lithographical Structuring of Metals on LTCC
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023), April 18-20, 2023, Albuquerque Marriott Pyramid North

Bartsch, H.; Jaziri, N.; Jaekel, K.; Nessimian, N.; Müller, J.:
Shadow Masks as an Alternative Method to Lithography for the Structuring of Thin-film Layers on LTCC Substrates
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023), April 18-20, 2023, Albuquerque Marriott Pyramid North

Jaziri, N.; Schulz, A.; Bartsch, H.; Müller, J.:
Management and Recovery of Lost Thermal Energy for Environmentally Friendly High-Performance Electronics
IMAPS/ACerS 18th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2023), April 18-20, 2023, Albuquerque Marriott Pyramid North

Kleinholz, C.; Fischer, M.; Müller, J.:
Assembly and packaging technology on Silicon-Ceramic-based composite substrates
International Conference on Electronics Packaging (ICEP), 19 - 22 April 2023, Kumamoto, Japan
DOI: 10.23919/ICEP58572.2023.10129654

Kaltwasser, M.; Schulz, A.; Müller, J.:
Glass-LTCC-Interposer, a New Plattform for HF-Applications
IMAPS Nordic Conference on Microelectronics Packaging (NordPac) ; Oslo, 12 - 14 Juni 2023
https://doi.org/10.23919/NordPac58023.2023.10186223

Kleinholz, C.; Fischer, M.; Gutzeit, N.; Cyriax, A.; Hintz, M.; Ortlepp, Th.; Müller, J.:
Innovative Silicon-Ceramic (SiCer) Technology for High-Strength Pressure Sensor Applications Using Different Manufacturing Methods
24th European Microelectronics and Packaging Conference & Exhibition (EMPC) / International Microelectronics and Packaging, Cambridge (UK), 11.-14.09.2023, DOI: 10.23919/EMPC55870.2023.10418331

Bartsch, H.; Lubov, M.; Kharlamov, V.; Jiménez, J.J.; Morales, F.M.; Pezoldt, J.:
Characterization of pores in polished low temperature co-fired glass-ceramic composites for optimization of their micromachining
Published 2 December 2022, Surface Topography: Metrology and Properties, Volume 10, Number 4
DOI 10.1088/2051-672X/aca2c7

Jaziri, N.; Gutzeit,N.; Bartsch, H.; Boughamoura, A.; Müller, J.; Tounsi, F.:
LTCC-based Y-type thermoelectric generator with an improved heat flow guide for automotive waste heat recover
Enthalten: Sustainable energy & fuels/Royal Society of Chemistry, ISSN:2398-4902, ZDB-ID: 2882651-6, Bd. 6 (2022), 9, S. 2330-2342
https://doi.org/10.1039/D2SE00048B

Yuile, A.; Schulz, A.; Wiss, E.; Müller, J.; Wiese, St.:
The simulated effect of adding solder layers on reactive mulitlayer films used for joining processes
Enthalten in: Applied Sciences. - Basel : MDPI, 2011- , ISSN: 2076-3417 , ZDB-ID: 2704225-X, Bd. 12 (2022), 5, Artikel 2397, 17 S.,
https://doi.org/10.3390/app12052397

Yuile, A.; Schulz, A.; Müller, J.; Wiese, St.:
Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs
Enthalten in: Microsystem technologies. - Berlin : Springer, 1994- , ISSN: 0946-7076 , ZDB-ID: 1223008-X, Bd. 28 (2022), 9, S. 1995-2009
DOI:10.1007/s00542-022-05328-2

Mohr-Weidenfeller, L.; Kleinholz, C.; Müller, B.; Gropp, S.; Günther-Müller, S.; Fischer, M.; Müller, J.; Strehle, St.:
Thermal analysis of the ceramic material and evaluation of the bonding behavior of silicon-ceramic composite substrates
Journal of Micromechanics and Microengineering, Volume 32, Number 10, https://doi.org/10.1088/1361-6439/ac8686

Kursun, E. C., Supreeti, S.; Janssens, G.K.F.; Schift, H.; Spätig, P.:
High optical contrast nanoimprinted speckle patterns for digital image correlation analysis
Micro and Nano Engineering (2022): Volume 17, November 2022, 100164, https://doi.org/10.1016/j.mne.2022.100164

Maamer, B.; Tounsi, F.; Kaziz, S.; Jaziri, N.; Boughamoura, A.:
A Halbach cylinder-based system for energy harvesting from rotational motion with high power density
Elsevier, Sensors and Actuators A: Physical, Volume 337, 16 April 2022, https://doi.org/10.1016/j.sna.2022.113428

Jaekel, K.; Bartsch, H.; Müller, J.; Camposano, Y.H.S.; Matthes, S.; Schaaf, P.:
Effect of line structures on the self-propagating reaction of Al/Ni multilayer
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 13.-16.09.2022,
DOI: 10.1109/ESTC55720.2022.9939472

Kleinholz, C.; Cyriax, A.; Hintz, M.; Müller, J.; Ortlepp, Th.:
Manufacture of high-strength differential pressure sensor using SiCer technology
Internationale Conference on Electronics Packaging (ICEP), Sapporo, 11.-14.05.2022,
DOI: 10.23919/ICEP55381.2022.9795558

Schulz, A.; Blau, K.; Müller, J.:
LTCC patch antenna array for 5G mobile applications featuring embedded air cavities
Internationale Conference on Electronics Packaging (ICEP), Sapporo, 11.-14.05.2022,
DOI: 10.23919/ICEP55381.2022.9795485

Weil, C.; Hauck, T.; Schur, J.; Müller, J.:
Broadband Ku- and Ka-Band Circulators in LTCC Using Sintered Bulk Ferrites
European Microwave Conference (EuMC), London, 04.-06.04.2022,
DOI: 10.23919/EuMC50147.2022.9784350

Kleinholz, C.; Schulz, A.; Müller, J.:
Laser ablation of metallization pastes for SMD assembly technologies onto LTCC substrates
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2022), Juli 13-15, 2022, Wien

Schulz, A.; Ruh, A.; Wiese, St.; Müller, J.:
Characterization of Reactive Multilayer Systems deposited on LTCC screen printing pastes featuring different surface morphologies suitable for reactive joining applications
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2022), Juli 13-15, 2022, Wien

Maamer, B.; Kaziz, S.; Jaziri, N.; Masmoudi, M.; Tounsi, F.:
Design of a MEMS Piezoelectric Frequency-up Converter for Powering Pacemaker from Heartbeats
21st International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS), 12-15 December 2022, Salt Lake City, UT, USA, DOI: 10.1109/PowerMEMS56853.2022.10007602

Kloska, M.; Bartsch, H.; Müller, J.; Haas, T.; Zeilmann, C.:
Functionalized Three-Dimensional Multilayer Ceramic Modules
Electronics 2021, 10, 248, https://doi.org/10.3390/electronics10030248

Reimann, T.; Barth, St.; Capraro, B.; Bartsch, H.; Töpfer, J.:
Cofiring of LTCC multilayer assemblies with integrated NTC thermistor temperature sensor layers
Elsevier, Ceramics International, 25. Juni 2021, https://doi.org/10.1016/j.ceramint.2021.06.213

Bartsch, H.; Weise, F.; Gomez, H.C.; Rubio, M.G.:
Cost-effective sensor for flow monitoring in biologic microreactors
in IEEE Sensors Journal, doi: 10.1109/JSEN.2021.3102262, https://ieeexplore.ieee.org/document/9505638/authors#authors

Sauni Camposano, Y.H.; Riegler, S.S.; Jaekel, K.; Schmauch, J.; Pauly, C.; Schäfer, C.; Bartsch, H.; Mücklich, F.; Gallino, I.; Schaaf,P.:
Phase Transformation and Characterization of 3D Reactive Microstructures in Nanoscale Al/Ni Multilayers
Appl. Sci. 2021, 11, 9304. https://doi.org/10.3390/app11199304

Supreeti, S.; Schienbein, R.; Feßer, P.; Fern, F.; Hoffmann, M.; Sinzinger, S.:
Development and Implementation of a Rotating Nanoimprint Lithography Tool for Orthogonal Imprinting on Edges of Curved Surfaces
Nanomanufacturing and Metrology. 2021 Sep;4(3):175-80 https://doi.org/10.1007/s41871-021-00114-6 

Schienbein, R.; Fern, F.; Theska, R.; Supreeti, S.; Füßl, R.; Manske, E.:
Fundamental Investigations in the Design of Five-Axis Nanopositioning Machines for Measurement and Fabrication Purposes
Nanomanufacturing and Metrology. 2021 Apr 20:1-9. https://doi.org/10.1007/s41871-021-00102-w

Ortlepp, I.; Fröhlich, T.; Füßl, R.; Reger, J.; Schäffel, C.; Sinzinger, S.; Strehle, S.; Theska, R.; Zentner, L.; Zöllner, J.P.; Rangelow, I.W. et.al.:
Tip-and Laser-based 3D Nanofabrication in Extended Macroscopic Working Areas
Nanomanufacturing and Metrology 2021 Sep;4(3):132-48 https://doi.org/10.1007/s41871-021-00110-w

Jaziri, N.; Müller, J.; Müller, B.; Boughamoura, A.; Gutzeit, N.; Mezghani, B.; Kouki, A.B.; Tounsi, F.:
Low-temperature co-fired ceramic-based thermoelectric generator with cylindrical grooves for harvesting waste heat from power circuits
In: Applied thermal engineering - Oxford [u.a.] : Pergamon, 1996- , ISSN: 1359-4311 , ZDB-ID: 1289156-3. - Bd. 184 (2021)
https://doi 10.1016/j.applthermaleng.2020.116367

Fink, S.; Warncke, P.; Fischer, M.; Stubenrauch, M.; Horn, K.; Spange, S.; Pfuch, A.; Müller, J., Fischer, D.; Hipler, U.-Chr.; Wiegand, C.:
Bestimmung der Biokompatibilität und der antimikrobiellen Wirksamkeit einer neuen keramischen Mikroplasmaquelle
Journal der Deutschen Dermatologischen Gesellschaft, Berlin, Wiley-Blackwell, ISSN: 1610-0387, ZDB-ID: 2099463-1, Bd. 19 (2021), S2, S. 87-88
DOI: 10.1111/ddg.14459

Ortlepp, I.; Fern, F.; Schienbein, R.; Supreeti, S.; Füßl, R.; Theska, R.; Sinzinger, S.; Manske, E.:
Traceable 5D-nanofabrication with nano positioning and nano measuring machines
In Proceedings of the 21st International Conference of the European Society for Precision Engineering and Nanotechnology / European Society for Precision Engineering and Nanotechnology International Conference & Exhibition 21. June 2021 Online. - Bedford, UK : euspen, 2021.

Mohr-Weidenfeller, L.; Gropp, S.; Azizy, R.; Müller, B.; Bucklitsch, P.; Müller, J.; Strehle, St.:
Evaluation of a low-temperature fabrication technology for silicon-ceramic-composite-substrates
In MikroSystemTechnik Kongress 2021, S. 392-395

Schulz, A.; Bartsch, H. Gutzeit, N.; Matthes, S.; Glaser, M.; Ruh, A.; Müller, J.; Schaaf, P.; Bergmann, J.-P.; Wiese, St.: Characterization of reactive multilayer systems deposited on LTCC featuring different surface morphologies
In MikroSystemTechnik Kongress 2021, S. 506-510

Sauni Camposano, Y.-H.; Riegler, S.; Jaekel, K.; Schmauch, J.; Pauly, Chr.; Schäfer, Chr.; Bartsch, H., Mücklich, F.; Gallino, I.; Schaaf, P.:
Phase transformation and characterization of 3D reactive microstructures in nanoscale Al/Ni multilayers
In Applied Sciences - Basel : MDPI, 2011- , ISSN: 2076-3417 , ZDB-ID: 2704225-X,  Bd. 11 (2021), 19, Artikel 9304 = 13 S.
https://doi.org/10.3390/app11199304

Kleinholz, C.; Fischer, M.; Cyriax, A.; Hintz, M.; Müller, J.; Ortlepp, T.:
Implementation of SiCer technology for pressure sensor applications
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2021), April 26-29, 2021, Global Virtual Event/online

Schulz, A.; Blau, K.; Müller, J.:
LTCC patch antenna array with embedded air cavities for 5G mobile applications
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2021), April 26-29, 2021, Global Virtual Event/online
Abstract

Maamer, B.; Jaziri, N.; Kaziz, S.; Tounsi, F.:
Towards Autonomous Node Sensors: Green Versus RF Energy Harvesting
Konferenz Sfax Tunesien, 06.-10.06.2021, IEEE International Conference on Design & Test of Integrated Micro & Nano-Systems (DTS), DOI: 10.1109/DTS52014.2021.9498247

Bartsch, H.;  Müller, J.; Schober, A.; Witte, H:
Thick film technology for impedance characterization
10th Workshop of Chemical and Biological Micro Laboratory Technology February 26th - 28th, 2020, Ilmenau, Elgersburg

Brauer, D.;  Xu, Y.; Klett, M.; Hampl, J.; Bartsch, H.; Schober, A.;  Zhang, Y.:
Stem cell differentiation through electrically stimulated cryogels
10th Workshop of Chemical and Biological Micro Laboratory Technology February 26th - 28th, 2020, Ilmenau, Elgersburg

Jaekel, K.; Sauni, Y.; Bartsch, H.; Riegler, S.S.; Gallino, I.; Schaaf, P.:
Reactive Ni/Al multilayers with 3D Morphologies
Materials Science and Engineering Congress (MSE) 2020, Online-Konferenz, 22. - 25.09.2020

Riegler, S.S.; Gallino, I.;  Stüber, M.;  Ivanisenko, K.; Bartsch, H.; Schaaf, P.; Busch, R.:
Thermodynamics and kinetics of phase formation in magnetron-sputtered Ni/Al multilayer thin films with nanoscale morphology
Materials Science and Engineering Congress (MSE) 2020, Online-Konferenz, 22. - 25.09.20203. 

Sauni, Y.; Wang, A.;  Ramirez, M.O.; Matthes, S.; Bartsch, H.; Schaaf, P.:
Self-propagating reaction of structured reactive Al/Ni multilayers
Materials Science and Engineering Congress (MSE) 2020, Online-Konferenz, 22. - 25.09.2020

Maamer, B.;  Kaziz, S.; Boughamoura, A.; Jaziri, N.; Tounsi, F.:
Numerical Modeling of a Novel Mesoscale EM Energy Harvesting System Based on Halbach Array
17th International Multi-Conference on Systems, Signals & Devices (SSD'20), https://ieeexplore.ieee.org/document/9364082/authors#authors

Bartsch, H., Thiele, S., Müller, J., Schabbel, D., Capraro, B., Reimann, T., Grund, S.; Töpfer, J.:
Multilayer ferrite inductors for the use at high temperatures
Microelectronics International, Vol. 37 No. 2, pp. 73-78, DOI:10.1108/MI-11-2019-0072

Reimann, T.; Capraro, B.; Bartsch, H.; Töpfer, J.:
Ni‐Cu‐Zn ferrites with high Curie temperature for multilayer inductors with increased operating temperatures
International Journal of Applied Ceramic Technology, doi: 10.1111/ijac.13623

Jaziri, N.; Müller, J.; Müller, B.; Boughamoura, A.; Gutzeit, N.; Mezghani, B.; Kouki, A.B.; Tounsi, F.:
Low Temperature Co-fired Ceramic-Based Thermoelectric Generator with Cylindrical Grooves for Harvesting Waste Heat from Power Circuits
ELSEVIER, Applied Thermal Engineering, 6 December 2020, https://doi.org/10.1016/j.applthermaleng.2020.116367

Töpfer, J.; Schulz, Th.; Capraro, B.; Bartsch, H.:
Relaxor Dielectrics for Multilayer Capacitors with Temperature-stable Permittivity Up to 250°C
MS&T19 (Material Science and Technology), September 29 to October 3, Portland, Oregon, USA,  

Schur, J.; Müller, J.:
Zirkulatoren für Ka- und Q-Band-Anwendungen mit eingebetteten Sc-substituierten Bariumhexaferriten in LTCC
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 534-536

Kaltwasser, M.; Karmaleevah, K.; Müller, J.:
Dünnschichtstrukturierung metallorganischer Resinatpasten auf Glaswafern
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin. S. 607-609

Fischer, M; Werthes, T.; Kleinholz, C.; Müller, J.:
Aktive Kühlung unter Verwendung von Fluidkanälen in einem Silizium-Keramik-Verbundsubstrat
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin: VDE Verlag (2019), ISBN: 978-3-8007-5090-0

Bartsch, H.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
Keramische Multilagenspulen zur Anwendung in der Hochtemperaturelektronik
Proceedings MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, S. 565-568

Gutzeit, N.; Schulz, A.; Fischer, M.; Thelemann, T.; Müller, J.:
Picosecond laser structuring technology for LTCC - the improvement of fine line structuring
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy;  DOI: 10.23919/EMPC44848.2019.8951813

Schulz, A.; Gutzeit, N.; Müller, J.:
Laser sturctured passive components and RF filter in LTCC technology with operating frequencies up to 40 GHz focusing on 5G mobile applications
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy;  doi: 10.23919/EMPC44848.2019.8951846

Fischer, M.; Werthes, T.; Kleinholz, C.; Müller, J.:
Active cooling using fluid channels in a silicon-ceramic composite substrate
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy; DOI: 10.23919/EMPC44848.2019.8951844

Petrich, R.; Bartsch, H.; Tonisch, K.; Jaekel, K.; Barth, S.; Bartzsch, H.; Glöß, D.; Delan, A.; Krischok, St.; Strehle, S.; Hoffmann M.; Müller, J.:
Investigation of ScAlN for piezoelectric and ferroelectric applications
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy,  DOI: 10.23919/EMPC44848.2019.8951824

Bartsch, H.; Pezoldt, J.;  Morales Sanchez, F. M.; Jimenez Rios, J.J.; Mánuel Delgado, J.M.; Breiling, J.; Müller, J.:
LTCC as substrate - enabling semiconductor and packaging integration
22nd European Microelectronics and Packaging Conference (EMPC), 16th - 19th September 2019, Pisa, Italy,  DOI: 10.23919/EMPC44848.2019.8951794

Bartsch, H.; Thiele, S.; Müller, J.; Capraro, B.; Schabbel, D.; Reimann, T.; Grund, St.; Töpfer, J.:
Multilayer coils for the Use at High Temperatures
43rd IMAPS Poland Conference 2019, 4th - 6th September 2019, Wroclaw, Poland

Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M. A.:
Highly Integrated RF-MEMS Multi-Frequency Oscillator on a Silicon-Ceramic Composite Substrate
International Microwave Symposium (IMS), Boston, MA, USA, 2th - 7th June 2019

Müller, J.; Kloska, M.; Schulz, A.; Gutzeit, N.; Haas, T-; Zeilmann, C.:
HDI-Technology for Harsh Environment Electronics based on LTCC Substrates
Electronics in Harsh Environments Conference, 2. - 4. April 2019, Park Plaza Amsterdam Airport, Netherlands

Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
Cross-Hierarchical Design of Compact RF-MEMS Oscillator Circuits on a Silicon-Ceramic Composite Substrate
Joint Conference of the IEEE International Frequency Control Symposium & European Frequency and Time Forum, Orlando, FL, USA, 14th - 18th April 2019

Müller, J.; Pezoldt; J. Morales Sanchez, F.M.; Mánuel Delgado, J.M.; Jimenez Rios, J.J:; Bartsch, H.:
Enabling Semiconductor and Packaging Integration
IMAPS/ACerS 15th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2019), Shanghai, China, 16th - 19th April 2019

Jaziri, N.; Boughamoura, A.; Müller, J.; Mezghani, B.; Tounsi, F.;  Ismail, M:
A compreshensive review of Thermoelectric Generators: Technologies and common applications
in Elsevier Energy Reports; 24. Dezember 2019,  https://doi.org/10.1016/j.egyr.2019.12.011

Jaziri, N.; Boughamoura, A.; Müller, J.; Tounsi, F.; Mezghani, B.; Kouki, A.:
TCs Connectivities Effect Investigation in the LTCC-based Thermoelectric Generator for Automotive Waste Heat Recovery
IEEE Xplore digital library, 28. November 2019,  doi: 10.1109/DTSS.2019.8914830

Bartsch, H.; Peipmann, R.; Himmerlich, M.; Müller, J.; Bund, A.; Witte, H.:
PEDOT coating applied on thick film gold electrodes for increased miniaturization capability
Progress in Organic Coatings,  10.1016/j.porgcoat.2019.06.023

Bartsch, H.; Peipmann, R.; Himmerlich, M.; Frant, M.; Rothe, H.; Liefeith, K.; Witte, H.:
Surface properties and biocompatibility of thick film materials used in ceramic bioreactors
in Elsevier Materialia, 16. Januar 2019,  https://doi.org/10.1016/j.mtla.2019.100213

Jimenez, J.J.; Manuel, J.M.; Bartsch, H.; Breiling, J.; Garcia, R.; Jacobs, H.O.; Müller, J.; Pezoldt, J.; Morales F.M.:
Comprehensive (S)TEM characterization of polycrystalline GaN/AlN layers grown on LTCC substrates
in Elsevier Ceramics International, 2. Februar 2019,  https://doi.org/10.1016/j.ceramint.2019.01.250

Fischer, M.; Gropp, S.; Stegner, J.; Frank, A.; Hoffmann, H.; Mueller, J.:
Silicon-Ceramic Composite Substrate: A Promising RF Platform for Heterogeneous Integration
In: IEEE Microwave Magazine 20 (2019), S. 28-43,  ISSN: 1527-3342,  DOI: 0.1109/MMM.2019.2928675

Stegner, J.; Fischer, M.; Gropp,  S.; Stehr, U.; Hein, M.A.:
MEMS-Based RF Oscillators Using SiCer Technology: New Integration, Packaging, and Assembly Concepts
In: IEEE Microwave Magazine 20 (2019), S. 71-85, ISSN: 1527-3342,  DOI:10.1109/MMM.2019.2928678

Chauhan, V.; Wandji, L. W.; Peng, X.; Silva Cortes, V.; Stehr, U.; Frank, A.; Fischer, M.; Weigel, R.; Hagelauer, A.:
Design and Performance of Power Amplifier Integration with BAW Filter on a Silicon-Ceramic Composite and Standard Epoxy/Glass Substrate
IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes, Ann Arbor, MI, USA, Jul. 16-18, 2018

Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
A Multi-Frequency MEMS-Based RF Oscillator Covering the Range from 11.7MHz to 1.9GHz
International Microwave Symposium (IMS), Philadelphia, Pennsylvania, USA, Jun. 10-15, 2018

Stehr, U.; Stegner, J.; Fischer, M.; Gropp, S.; Müller, J.; Hoffmann, M.; Hein, M.A.:
Multiphysical Design of Compact RF Modules on a Silicon-Ceramics Substrate
German Microwave Conference (GeMiC), Freiburg, Germany, 12.-14. März 2018,  https://doi.org/10.23919/GEMIC.2018.833503

Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.A.:
Design and Implementation of a MEMS-Based RF Oscillator on a Unique Silicon-Ceramic Composite Substrate
German Microwave Conference (GeMiC), Freiburg, Germany, 12.-14. März 2018,  https://doi.org/10.23919/GEMIC.2018.8335031

Jiménez, J.J.; Mánuel, J.M.; Lacroix, B.; Santos, A.J.; Bartsch, H.; Pezoldt, J.; Breiling, J.; Müller, J.; Blanco, E.; Domínguez, M.; Alexandrov, D.; Tot, J.; Dubreuil, R.; Videkov, V.; Andreev, S.; Tzaneva, B.; García, R.; Morales, F.M.:
Progress in the optimization of low-temperature growth of III-N/LTCC heterostructures: towards multilayered ceramic-based nitrides power electronics
In: XIV Congreso Nacional de Materiales and I Iberian Meeting on Materials Science (CNMAT 2018), July 4-6 2018, Salamanca, Spain

Müller, J.; Hülsmann, M.; Gutzeit, N.; Fischer, M.:
Wafer-level re-packaging of commercial components for miniaturization and embedding
IMAPS Nordic Conference 2018, Seite 81–85,  https://doi.org/10.23919/NORDPAC.2018.8423859

Uhlig, P.; Serwa, A.; Müller, J.; Gutzeit, N.; Schwanke, D.; Pohlner, J.:
LTCC resistors - the influence of production conditions on the absolute value and its reproducibility
IMAPS Nordic Conference 2018, Seite 61–66,  https://doi.org/10.23919/NORDPAC.2018.8423847

Rothe, H.; Straube, A.; Fischer, R.; Stubenrauch, M.; Bartsch, H.; Witte, H.; Liefeith, K:
SACCA – Systemlösungen zur teilautomatisierten 3D-Zellkultur
19. Heiligenstädter Kolloquium, 24.9.-26.9. 2018, Heiligenstadt

Müller, J.; Welker, T.; Schmitt, K.:
LTCC-like Multilayer LCP-Technology for flexible RF-Circuits
7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 2018, pp. 1-3,
http://doi: 10.1109/ESTC.2018.8546470

Welker, T.:
Methoden und Technologien zur Optimierung der Entwärmung aktiver und passiver Komponenten auf keramischen Mehrlagensubstraten
Dissertation, Technische Universität Ilmenau, 2018,  ISBN 9-78-3-86360-182-9

Bartsch, H.; Peipmann, R.; Klett, M; Brauer, D.; Schober, A.; Müller, J.:
PEDOT Coated Thick Film Electrodes for In Situ Detection of Cell Adhesion in Cell Cultures
Biosensors 2018, 8(4), 105;  doi: 10.3390/bios8040105

Stegner, J.; Fischer, M.; Gropp, S.; Stehr, U.; Müller, J.; Hoffmann, M.; Hein, M.:
A multi-frequency MEMS-based RF oscillator covering the range from 11.7 MHz to 1.9 GHz
Proceedings of the 2018 IEEE 2018, Seite 575–578,  https://doi.org/10.1109/MWSYM.2018.8439449

Yuan, Q.; Döll, J.; Romanus, H.; Wang, H.; Bartsch, H.; Albrecht, A.; Hoffmann, M.; Schaaf, P.; Wang, D.:
Surface-nanostructured Al-AlN composite thin films with excellent broad-band antireflection properties fabricated by limited reactive sputtering
in ACS applied nano materials, Jg. 1, 2018, Heft 3, Seite 1124–1130,  https://doi.org/10.1021/acsanm.7b00302

Bartsch, H.; Baca, M.; Fernekorn, U.; Müller, J.; Schober, A.; Witte, H.:
Functionalized Thick Film Impedance Sensors for Use in In Vitro Cell Culture
Biosensors 2018, 8(2), 37;  doi: 10.3390/bios8020037

Manuel, J.M.; Jimenez, J.J.; Morales, F.M.; Lacroix, B.; Santos, A.J.; Garcia, R., Blanco, E.; Dominquez, M.; Ramirez, M.; Beltran, A.M.; Alexandov, D.; Tot, J.; Dubreuil, R.; Videkov, V.; Andreev, S.; Tzaneva, B.; Bartsch, H., Breiling, J.; Pezoldt, J.; Fischer, M.; Müller, J.:
Engineering of III-Nitride Semiconductors on Low Temperature Co-fired Ceramics
Nature Scientific Reports, volume 8, Article number: 6879(2018),  doi:10.1038/s41598-018-25416-6

Bartsch, H.; Baca, M.; Fernekorn, U.; Himmerlich, M.; Müller, J.; Schober, A.; Witte H.:
Multilayer ceramics as integration platform for sensors in in-vitro cell culture reactors
Advanced Materials Letters 2018, 9(11), 748-752,  doi:10.5185/amlett.2018.2090

Bartsch, H.; Grieseler, R.; Mánuel, J.; Pezoldt, J.; Müller; J.:
Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates
Coatings 2018, 8(8), 289;  https://doi.org/10.3390/coatings8080289
http://www.mdpi.com/2079-6412/8/8/289

Jaziri, N.; Boughamaoura-Ben Messaoud, A.; Tounsi, F.; Bezghani, B.; Müller, J.:
Analytical and numerical analysis and validation of an LTCC-based fabricated TEG
Proceedings of 2018, 30th International Conference on Microelectronic, IEEE, S. 128-131,
https://doi.org/10.1109/ICM.2018.8704103

Fischer, M; Naber, A.; Stubenrauch, M.; Gutzeit, N.; Klett, M.; Schober, A.; Witte, H.; Müller, J.:
Keramische Mikro-Plasmaquelle für die selektive Behandlung von Zellkulturen
Proceedings MikroSystemTechnik Kongress 2017, 23.-25. Oktober 2017, München: VDE Verlag (2017), ISBN: 978-3-8007-4491-6

Fischer, R.; Stubenrauch, M.; Straube, A.; Wedrich, K.; Goj, B.; Bartsch, H.; Bichra, M.; Rothe, H.; Witte, H.:
System for automated cell cultivation and analysis
In: Engineering for a changing world/Ilmenau Scientific Colloquium, Technische Universität Ilmenau, 9.-15.11.2017,  http://nbn-resolving.de/urn:nbn:de:gbv:ilm1-2017iwk-109:7

Kloska, M.; Bartsch, H.; Müller, J.; Haas, T.; Zeilmann, C.:
3-dimensionale Mehrlagenkeramik-Module
7. MikroSystemTechnik Kongress "MEMS, Mikroelektronik, Systeme", München, 24.- 25. Oktober 2017,

Bartsch, H.; Baca, M.; Fernekorn, U.; Himmerlich, M.; Müller, J.; Schober, A.; Witte, H.:
Multilayer ceramics as integration platform for sensors in vitro cell culture reactors
Biosensors and Bioelectronics Symposium, Stockholm, Schweden, 9.-12. Oktober 2017

Bartsch, H.; Stöpel, D.; Rydozs, A.; Müller, J.:
Printed heater elements for smart sensor packages in LTCC
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017,  https://ieeexplore.ieee.org/document/8346841/

Stubenrauch, M.; Fischer, M.; Naber, A.; Wiegand, C.; Hipler, U.-C.; Witte, H.; Müller, J.:
Micro plasma source for the selective treatment of cell cultures
Jahrestagung der Biomedizinischen Technik und Dreiländertagung der Medizinischen Physik, Dresden, 10.-13. September 2017,  doi.org/10.1515/bmt-2017-5082

Fischer, M.; Stubenrauch, M.; Naber, A.; Gutzeit, N.; Klett, M.; Singh, S.; Schober, A.; Witte, H.; Müller, J.:
LTCC-Based Micro Plasma Source for the Selective Treatment of Cell Cultures
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017

Fischer, M.; Wiegand, C.; Stubenrauch, M.; Naber, A.; Fink, S.; Hipler, U.-C.; Witte, H.; Müller, J.:
Keramische Mikro-Plasmaquelle für die antimikrobielle Behandlung von Oberflächen und Geweben in der Dermatologie
5. Workshop Plasmamedizin, Rostock, September 13 - 14, 2017

Schulz, A.; Goudouri, Q.M.; Kollenberg, W.; Welker, T.; Gutzeit, N.; Nikolay, D.; Kemmling, N.; Müller, J.:
3D printed ceramic structures based on LTCC: Materials, Processes and Characterizations
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017

Welker, T.; Gutzeit, N.; Müller, J.:
Enhanced Heat Spreading in LTCC Packages utilizing Thick Silver Tape in the Co-fire Process
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017

Gierasek, T.; Pietrikova, A.; Welker, T.; Müller, J.:
Influence of various micro channels integrated in LTCC multilayer module on the thermal restistance
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017

Gutzeit, N.; Schulz, A.; Welker, T.; Wagner, C.; Schäfer, E.; Müller, J.:
High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density
European Microelectronics and Packaging Conference, EMPC, Warschau, Polen, 10.-13. September 2017

Uhlig, P.; Serwa, A.; Altmann, U.; Welker, T.; Müller, J.; Schwanke, D.; Pohlner, J.; Rittweg, T.:
Liquid Cooling in an LTCC-Module for a Switched Mode Amplifier
2017, IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 18.-20.06.2017, Göteborg, Schweden,  doi.org/10.1109/NORDPAC.2017.7993171

Gropp, S.; Stegner, J.; Stehr, U.; Fischer, M.; Müller, J.; Hein, M.; Hoffmann, M.:
Silicium-Keramik-Verbundsubstrat für einen HF-MEMS Oszillator
MikroSystemTechnik Kongress, Munich, Germany, Oct. 23-25, 2017

Stöpel, D.:
Integration metallorganischer Resinatpasten in niedrigsinternde Mehrlagenkeramiksysteme
Dissertation, TU Ilmenau, Signatur  ELT ZN 4152 S872

Alexandrov, D.; Tot, J.; Dubreuil, R.; Morales, F.; Manuel, J.; Jimenez, J.; Lacroix, B; Garcia, R.; Videkov, V.; Andreev, S.; Tzaneva, B.; Bartsch, H.; Pezoldt, J.; Fischer, M.; Müller, J.:
Low temperature epitaxial deposition of GaN on LTCC substrates
2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), pages 48 - 54

Bartsch, H.; Mánuel, J.M.; Grieseler, R.:
Influence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers
Technologies 2017, 5, 79.,  http://www.mdpi.com/2227-7080/5/4/79

Girasek, T.; Pietrikova, A.; Welker, T.; Müller, J.:
Simulation of Heat Transfer by Cooling Channels in LTCC Substrate
Acta Electrotechnica et Informationca, Vol. 17, No.2, pp. 11-15, 2017

Pietrikova, A.; Girasek, T.; Lukacs, P.; Welker, T.; Müller, J.:
Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
Journal of electrical engineering, Band 68, Heft 2, S. 132–137,  https://doi.org/10.1515/jee-2017-0018

Jahnke, H.G.; Krinke, D.; Seidel, D.; Lilienthal, K.; Schmidt, S.; Azendorf, R.; Fischer, M.; Mack, T.; Striggow, F.; Althaus, H.; Schober, A.; Robitzki,  A.A:
A novel 384-multiwell microelectrode array for the impedimetric monitoring of Tau protein induced neurodegenerative processes  
Biosens Bioelectron 88:78-84, DOI: 10.1016/j.bios.2016.07.074

Bartsch, H.; Schulz, A.; Müller, J.; Ebert, A.; Spira, St.; Wollenschläger, F.; Hein, M.:
Applications of microwave dielectrics
Microwave materials and applications; Volume 2; Hoboken, NJ: Wiley, 2017, Seite 653-682,
ISBN 978-1-119-20852-5

J. Müller, N. Gutzeit, T. Welker:
Laser-Processing an grünen und gesinterten Folien
DKG-Herbstsymposium 2016 Keramische Mehrlagentechnik – Herstellverfahren und Anwendungen, 30.11.-01.12.2016, Heinrich-Lades-Halle, Erlangen

A. Pietrikova, T. Girasek, P. Lukacs, T. Welker, J.Müller:
Simulation of Cooling Methods Via Channels in LTCC Substrates for Power Electronic Devices
2nd IMAPS flash Conference, IMAPS CZ & SK (Ed.),  Brno,Czech Republic, 3. - 4. Nov., pp. 1–8, 2016

J. Müller, D. Stöpel, S. Spira, N. Gutzeit, T. Welker, S. Mathew, A. Ebert, M. Hein:
Technologies to implement complex microwave functions in LTCC for the use in communication satellites
IMAPS Poland Conference 2016, Walbzych, 25.-28.09.2016

J. Müller, T. Hannappel, M. Hoffmann, H. O. Jacobs, Y. Lei, I. W. Rangelow, P. Schaaf:
Application of nanostructuring nanomaterials and micro-nano-integration for improved components and system's performance
Pan Pacific Microelectronics Symposium (Pan Pacific) 2016, pp. 1-10, 2016. DOI:  10.1109/PanPacific.2016.7428387

Ph. Stadie, H. Bartsch, R. Peipmann, A. Ispas, M. Baca, J. Müller, A. Bund, A. Schober, H. Witte:
Surface refinement of thick film gold electrodes for 3D MEAs using electro polymerization of PEDOT
10th International Meeting on Substrate-Integrated Microelectrode Arrays, June 28-July1, 2016, Reutlingen, Germany,
Link:  Abstract

J. Stegner, M. Fischer, S. Gropp, D. Podoskin, U. Stehr, J. Müller, M. Hoffmann, M. A. Hein:
Compact Low Phase-Noise MEMS-based RF Oscillator on a dedicated Silicon-Ceramic Composite Substrate
European Microwave Conference 2016 (EuMC), London, England, Oct. 3-6, 2016

M. Fischer, S. Gropp, B. Capraro, M. Hoffmann,  J. Müller:
Silicon Ceramic Composite Substrate - an Advanced Substrate for Integrated Nano and Micro Systems
3rd International Conference & 5th International MacroNano-Colloquium on the Challenges and Perspectives of Functional Nanostructures (CPFN), Ilmenau, Deutschland, 20.-22. Juni 2016

S. Gropp, M. Fischer, L. Dittrich, B. Capraro, J. Müller, M. Hoffmann:
Wetting behaviour of LTCC and glasses on nanostructured silicon surfaces during sintering
3rd International Conference & 5th International MacroNano-Colloquium on the Challenges and Perspectives of Functional Nanostructures (CPFN), Ilmenau, Deutschland, 20.-22. Juni 2016

T. Welker, J. Müller:
Design, Simulation and Fabrication of Liquid Cooled LTCC Devices Utilizing Integrated Channels
15th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm, Las Vegas, NV, USA, May 31 – Jun 3, pp. 830–835, 2016   DOI:10.1109/ITHERM.2016.7517632

S. Spira, M. Schneider, T. Welker, J. Müller, M.A. Hein:
Compact Three-Dimensional Four-Way Vectorial Steering Module for Ka-Band Multiple Feeds-per-Beam Satellite Payload Applications
IEEE MTT International Microwave Symposium 2016, IMS, San Fransisco, CA, USA, May 22-27, 2016 
DOI:10.1109/MWSYM.2016.7540005

B. Müller, J. Müller:
Technological Study to Obtain Thick Conductors for Power Electronics by Screen and Stencil Printing
39th International Spring Seminar on Electronics Technology, Pilsen, Czech Republic, May 18-22, 2016 
DOI:10.1109/ISSE.2016.7563182

V. Silva Cortes, D. Podoskin, J. Stegner, M. Fischer, S. Gropp, M. Hein, J. Mueller, M. Hoffmann, R. Weigel, G. Fischer, A. Hagelauer:
Evaluation of a Multiphysical RF MEMS Oscillator Based on LTE Receiver Performance Requirements
International Conference on Microwave, Radar and Wireless Communications (MIKON), Krakow, Poland, May 9-11, 2016 
http://dx.doi.org/10.1109/MIKON.2016.7492025

J. Stegner, U. Stehr, D. Podoskin, S.Gropp, M. Fischer, M. Hoffmann, J. Müller, M. A. Hein:
Hybrid-Integrated RF MEMS-based Reference Oscillator Using a Silicon-Ceramic Composite Substrate
German Microwave Conference 2016 (GeMiC), Bochum, Germany, Mar. 14-16, 2016 
http://dx.doi.org/10.1109/GEMIC.2016.7461629

M. Fischer, T. Welker, B. Leistritz. S. Gropp, Chr. Schäffel, M. Hoffmann, J. Müller: Investigations of Metal Systems in a Silicon Ceramic Composite Substrate for Electrical and Thermal Contacts as well as Associated Mounting Aspects
In: Proceedings IMAPS/ACerS 12th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2016), Denver, USA, April 19 - 21, 2016

S. Gropp, M. Fischer, A. Frank, Chr. Schäffel, J. Müller, M. Hoffmann:
Fabrication of an RF-MEMS-Switch on a hybrid Si-Ceramic substrate
In: Proceedings IMAPS/ACerS 12th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2016), Denver, USA, April 19 - 21, 2016

N. Gutzeit, T. Welker, K.-H. Drüe, J. Müller:
High resolution LTCC laser processing in the green and fired state for future technologies
12th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Denver, CO, USA, Apr 19-21, 2016,  http://dx.doi.org/10.1109/GEMIC.2016.7461545

T. Welker, J. Müller:
Evaluierung von drucklos gesinterten Silberschichten für die Chipmontage
IMAPS Frühjahrsseminar 2016, Nürnberg, Germany, April 14, 2016

S. Spira, M. Schneider, T. Welker, J. Müller, M. A. Hein:
Compact Three-Dimensional Four-Way Vectorial Steering Module for Satellite-Based Ka-Band Array Antenna Applications in LTCC Technology
3rd ESA Workshop on Advanced Flexible Telecom Payloads, Noordwijk, Netherlands, March 22-25, 2016 
http://dx.doi.org/10.1109/MWSYM.2016.7540005

A. Schulz, N. Gutzeit, D. Stöpel, T. Welker, M. Hein, J. Müller:
High resolution patterning of LTCC based microwave structures for Q/V-band satellite applications
2016 German Microwave Conference (GeMiC ), Bochum, Germany, March 14 - 16, pp. 19–22, 2016 
http://dx.doi.org/10.1109/GEMIC.2016.7461545

S. Mathew, T. Welker, N. Gutzeit, S. Spira, R. Stephan, J. Müller, M. A. Hein:
Passive alignment of an optical fiber on a multi-layer ceramic module for radio-over-fiber applications
10th German Microwave Conference 2016, GEMIC, Bochum, Germany, March 14 - 16, pp. 1–4, 2016 
http://dx.doi.org/10.1109/GEMIC.2016.7461554

Silva Cortes, V.; Podoskin, D.; Stegner, J.; Fischer, M.; Gropp, S.; Hein, M. et al.:
Evaluation of a multiphysical RF MEMS oscillator based on LTE receiver performance requirements
MIKON2016, IEEE Xplore digital library,  http://dx.doi.org/10.1109/MIKON.2016.7492025

Rydosz, A.; Maziarz, W.; Pisarkiewicz, T.; Bartsch, H.; Müller, J.:
Thermal and Electrical Investigation on LTCC Gas Sensor Substrates
International Journal of Information and Electronics Engineering, Vol. 6, No. 3, May 2016, pp. 143-146
DOI: 10.18178/ijiee.2016.6.3.612

Bartsch, H.; Welker, T.; Welker, K.; Witte, H.; Müller, J.:
LTCC based bioreactors for cell cultivation
IOP Conf. Ser.: Mater. Sci. Eng. 104 012001, Open access: http://iopscience.iop.org/article/10.1088/1757-899X/104/1/012001/pdf

Bierlich, S.; Reimann, T.; Barth, St.; Capraro, B.; Bartsch, H.; Müller, J.; Töpfer, J.:
Integration of High-Frequency M-Type Hexagonal Ferrite Inductors in LTCC Multilayer Modules
Int. J. Appl. Ceram. Technol. 13 [3] 540-548 (2016), DOI:10.1111/ijac.12512

A. Ebert, S. Kaleem, J. Müller, R. Stephan, D. Stöpel, T. Kässer, W. Konrath, M.A. Hein:
An industry-level implementation of a compact microwave diode switch matrix for flexible input multiplexing if a geo-stationary satellite payload
Microwaves Communications Antennas and Electronic Systems (COMCAS) 2015 IEEE International Conference on, pp. 1-4, 2015

R. Zeiser, S. Ayub S, P. Wagner, J. Müller, S. Henneck, J. Wilde:
Low Stress Flip-Chip Package for Pressure Sensors Operating at 500 °C
18th Conference on Solid-State Sensors, Actuators and Microsystems - Transducers, ISBN 978-1-4799-8955-3, Seiten: 1271 - 1274

S. Gropp, M. Fischer, J. Müller, M. Hoffmann:
A hybrid SiCer substrate based on direct glass-based bonding of LTCC and silicon
WaferBond´15, Braunschweig, Germany, 7.-12. Dezember 2015

H. Bartsch, K. Welker, H. Witte, J. Müller:
Integrierte NTC-Dickschichtsensoren in LTCC Fluidmodule zur Temperaturregelung in bio-zentrierten Zellhandlingsystemen
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7

H. Bartsch, K. Welker, H. Witte, J. Müller:
Integrierte NTC-Dickschichtsensoren in LTCCFluidmodule zur Temperaturregelung in bio-zentrierten Zellhandlingsystemen
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7

J. Müller:
Status and Trends of Microelectronics and Packaging in Europe
Invited presentation, 2015 International Conference on Electronics Packaging and iMAPS  All Asia Conference (ICEP-IACC 2015), Kyoto, Japan, 14-17 April 2015

M. Fischer, S. Gropp, J. Nowak, R. Sommer, M. Hoffmann, and J. Müller:
RF-MEMS Platform based on Silicon-Ceramic-Composite-Substrates
9th German Microwave Conference, (GeMiC), Nürnberg, Germany, 16.-18. March 2015

S. Gropp, M. Fischer, M. Hoffmann, J. Müller, A. Frank, C. Schäffel:
Electrostatic parallel-plate MEMS Switch on Silicon-Ceramic-Composite-Substrates
9th German Microwave Conference, (GeMiC), Nürnberg, Germany, 16.-18. March 2015

D. Podoskin, K. Brückner, M. Fischer, S. Gropp, D. Krauße, J. Nowak, M. Hoffmann, J. Müller, R. Sommer, and M. A. Hein:
Multi-Technology Design of an Integrated MEMS-based RF Oscillator Using a Novel Silicon-Ceramic Compound Substrate
9th German Microwave, Conference (GeMiC), Nürnberg, Germany, 16.-18. March 2015

Tilo Welker, Sabine Günschmann, Nam Gutzeit, Jens Müller:
Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process1th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Dresden, Germany, April 20-23, pp. 62–66, 2015

Tilo Welker, Sumy Mathew, Steffen Spira, Stephan Ralf, Nam Gutzeit, Jens Müller, Matthias A. Hein:
An analog optical transmitter module with a passive aligned fiber based on a flip chip mounted VCSEL
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015

Tilo Welker, Jens Müller, Frank Krämer, Steffen Wiese:
Electrical, Thermal and Mechanical Characterization of Low Temperature, Pressure-less Sintered Silver Bond Interfaces
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015

Sumy Mathew, Steffen Spira, Ralf Stephan, Tilo Welker, Nam Gutzeit, Jens Müller, Matthias A. Hein:
Geometrical tolerance of optical fiber and laser diode for the passive alignment using LTCC technology
9th German Microwave Conference, GeMiC, Nürnberg, Germany, March 16-18, pp. 363–366, 2015

Jens Müller, Tilo Welker, Alexander Schulz:
Advanced LTCC Processes for Microwave Structures and Components in LTCC
20th European Microelectronics and Packaging Conference & Exhibition, EMPC, Friedrichshafen, Germany, September 14-16, 2015

Nam Gutzeit, Tilo Welker, Michael Fischer, Jens Müller:
Thin film strain gauges on LTCC membranes for surface monitoring of high power lasers mirrors
11th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT, Dresden, Germany, April 20-23, 2015

Heike Bartsch, Dirk Stöpel, Marcel Himmerlich, Martin Baca, Philipp Stadie, Jari Hyttinen, Jens Müller and Andreas Schober:
LTCC Based Multi-Electrode Arrays for In-Vitro Cell Culture
In: Proceedings of International Conference on Ceramic Interconnect & Ceramic Microsystems Technologies CICMT
April 20–23, 2015, Dresden, Germany

Heike Bartsch, Ulrike Brokmann, Boris Goj, Robert Weiss, Edda Rädlein, Jens Müller:
Sol gel thin films on LTCC ceramic multilayers enable their use as thin film substrates
In: Proceedings of 20th European Microelectronics and Packaging Conference (EMPC), September 14-16, Friedrichshafen, Germany

Nam Gutzeit, Michael Fischer, Heike Bartsch, Jens Müller:
Lapping and Polishing of Different LTCC Substrates for Thin Film Applications
In: Proceedings of 20th European Microelectronics and Packaging Conference (EMPC), September 14-16, Friedrichshafen, Germany

Heike Bartsch, Tilo Welker, Hartmut Witte, Jens Müller:
LTCC based bioreactors for cell cultivation
Invited lecture of the 39^th International Microelectronic and Packaging Conference, September 20-23, Gdańsk, Poland

M. Fischer, D. Karolewski, T. Welker, K. Schelestow, S. Gropp, M. Hoffmann, J. Müller:
Thermisches Verhalten von SiCer – ein innovatives Verbundsubstrat für MEMS
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7

S. Gropp, M. Fischer, M. Hoffmann:
Aufbau eines HF-MEMS-Schalters in einem Silicium-Keramik-Verbundsubstrat
In: Proceedings MikroSystemTechnik Kongress 2015, 26.-28. Oktober 2015, Karlsruhe: VDE Verlag (2015), ISBN: 978-3-8007-4100-7

Turgaliev, V.M; Kholodnyak, D.; Müller, J.; Hein, M.A.:
Small-Size Low-Loss Bandpass Filters on Substrate-Integrated Waveguide Capacitively Loaded Cavities Embedded in Low Temperature Co-Fired Ceramics
Journal of Ceramic Sciens and Technology, vol. 06, no.4, pp. 305-314, 2015, DOI:  10.4416/JCST2015-0053

Welker, Tilo; Günschmann, Sabine; Gutzeit, Nam; Müller, Jens:
Design, Fabrication and Characterization of Heat Spreaders in Low-Temperature Co-Fired Ceramic (LTCC) utilizing Thick Silver Tape in the Co-Fire Process
Journal of Ceramic Science and Technology, vol. 6, no. 4, pp. 301–304, 2015, DOI:  10.4416/JCST2015-00042

Bierlich, Silvia; Reimann, Timmy; Barth, Stefan; Capraro, Beate; Bartsch, Heike; Müller, Jens; Töpfer, Jörg:
Integration of High-Frequency M-Type Hexagonal Ferrite Inductors in LTCC Multilayer Modules
Int. J. Appl. Ceram. Technol. 1–9 (2015), DOI:10.1111/ijac.12512

Löhnert, Romy; Capraro, Beate; Barth, Stefan; Bartsch, Heike; Müller, Jens; Töpfer, Jörg:
Integration of CaCu₃Ti₄O₁₂ capacitors into LTCC multilayer modules
Journal of the European Ceramic Society 35 (2015) 3043–3049

Bartsch, Heike; Himmerlich, Marcel; Fischer, Michael; Demkó, Laszlo;  Hyttinen, Jari; Schober, Andreas:
LTCC-Based Multi-Electrode Arrays for 3D in Vitro Cell Cultures
J. Ceram. Sci. Tech., 06 [04] 315-324 (2015) DOI: 10.4416/JCST2015-00056
available online at:  http://www.ceramic-science.com/articles/all-articles.html?article_id=100416

Jurków, D.;  Maeder, Th.; Dąbrowski, A.; Zarnik, M.; Belavič, D.; Bartsch, H.; Müller, J.:
Overview on low temperature co-fired ceramic sensors
Sensors and Actuators A 233 (2015) 125–146,  http://doi.org/10.1016/j.sna.2015.05.023

Bierlich, Silvia; Reimann, Timmy; Bartsch, Heike; Töpfer, Jörg:
Co/Ti-substituted M-type hexagonal ferrites for high-frequency multilayer inductors
In: Journal of the Magnetism and Magnetic Materials 384 (Elsevier), issue 15, p. 1-5, 2015, DOI:  10.1016/j.jmmm.2015.02.009

Fischer, Michael; Gropp, Sebastian; Nowak, J.; Capraro, B.; Sommer, R.; Hoffmann, Martin; Müller, Jens:
Radio Frequency Microelectromechanical System-Platform Based on Silicon-Ceramic Composite Substrates
In: IMAPS - Journal of Microelectronics and Electronic Packaging, Vol.12, pp. 37-42, 2015, DOI:  10.4071/imaps.442

Günschmann, Sabine; Fischer, Michael; Mannebach,·H.; Steffensky, J.; Müller, Jens:
Silicon–ceramic–silicon‑wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficient
In: Microsystem Technologies, Springer-Verlag Berlin Heidelberg, 2015, DOI:  10.1007/s00542-015-2434-6

Löhnert, Romy; Bartsch, Heike; Schmidt, Rainer; Capraro, Beate; Töpfer, Jörg:
Microstructure and Electric Properties of CaCu3Ti4O12 Multilayer Capacitors
In: Journal of the American Ceramic Society 98, issue 1, p. 141–147, 2015 DOI:  10.1111/jace.13260

Gropp, Sebastian; Fischer, Michael; Dittrich, Lars; Capraro, Beate; Müller, Jens; Hoffmann, Martin:
Wetting behaviour of glasses on nanostructured silicon surfaces
In: Journal of Electrical Engineering Volume 3, Number 1, January 2015 (Serial Number 7)
DOI:10.17265/2328-2223/2015.01.002    http://www.davidpublisher.org/Home/Journal/JEE

Heike Bartsch, Kateryna Soloviova, Hannes Töpfer, Jörg Pezoldt, Jens Müller
Packaging-Architektur zur Realisierung supraleitender Elektronik-Systeme
Patentnummer: 10 2024 106 807
Erteilungsdatum: 20.10.2025

Nesrine Jaziri, Jens Müller
2-in-1-Prozess mit Maske-auf-Substrat-Einheit für die Herstellung eines mikroelektronischen keramischen Schaltungsträgers mit vertikalen und lateralen Feinstrukturen
Patentnummer: 10 2024 109 599
Erteilungsdatum: 11.09.2025

Jens Müller, Heike Bartsch, Michael Fischer, Mahsa Kaltwasser, Franz Bechtold, Thomas Herbst
Verfahren zur Herstellung eines Glas-Keramik-Verbundsubstrates
Patentnummer: 10 2020 103 487
Erteilungsdatum: 12.05.2022

Michael Fischer, Heike Bartsch, Martin Hoffmann, Jens Müller, Beate Pawlowski, Stefan Barth:
Silicon ceramic composite substrate and its manufacture
Patentummer: EP 2 218 101 B1
Erteilungsdatum: 14.02.2018

Andreas Schober, Jörg Hampl, Uta Fernekorn, Peter Husar, Michael Fischer, Daniel Laqua, Katharina Lilienthal:
Hybrid three-dimensional sensor array, in particular for measuring electrogenic cell assemblies, and the measuring assembly
Patentummer: EP 2 538 838 B1
Erteilungsdatum: 30.11.2016

Michael Fischer, Heike Bartsch de Torres, Martin Hoffmann, Jens Müller, Beate Pawlowski, Stefan Barth:
Silicon ceramic composite substrate
Patentummer: US 8391013 B2
Erteilungsdatum: 03/2013

Andreas Schober, Jörg Hampl, Uta Fernekorn, Peter Husar, Michael Fischer, Daniel Laqua, Katharina Lilienthal
Hybrid three-dimensional sensor array, in particular for measuring electrogenic cell assemblies, and the measuring assembly
Patentummer: US 20120319705 A1
Erteilungsdatum: 12/2012

Konrad Bach, Daniel Gaebler, Michael Fischer, Mike Stubenrauch
Self-organized pin-type nanostructures, and production thereof on silicon
Patentummer: US 8058086 B2
Erteilungsdatum: 11/2011

Michael Fischer, Jörg Hampl, Peter Husar, Daniel Laqua, Katharina Lilienthal, Uta Fernekorn, Andreas Schober
Hybrides dreidimensionales Sensorarray, insbesondere zur Vermessung elektrogener Zellanordnungen, sowie Messanordnung
Patentummer: DE 102010000565 A1
Erteilungsdatum: 02/2010

Dr. Hintz Michael, Arndt Steinke, Manuel Kermann, Michael Fischer, Mike Stubenrauch
Siliziumchip mit einem daran befestigten Kabel und Verfahen zur Befestigung des Kabels
Patentummer:DE102009059304 B4
Erteilungsdatum: 12/2009

Daniel Gäbler, Michael Fischer, Mike Stubenrauch, Konrad Bach
Verfahren zur Herstellung von defektarmen selbstorganisierten nadelartigen Strukturen mit Nano-Dimensionen im Bereich unterhalb der üblichen Lichtwellenlängen mit großem Aspektverhältnis
Patentummer: DE102005048366 A1
Erteilungsdatum: 10/2005