The Electronics Technology Group is engaged in research and education. The main research topics are the construction and technological realization of advanced packaging of modules and devices.
The program of education consists of the fundamentals of advanced packaging and the development of semiconductors with complex electronic systems. Applications with high requirements on reliability and efficiency can be realized, through the combination of materials, design and different technologies of manufacturing and processing.
Packaging technologies for high-frequency applications
Development of sensor systems for extreme environments
Development of miniaturized fluidic systems for bio or chemic applications
Thin-film-capable LTCC ceramics
High-current LTCC multilayer circuits
- Bartsch, H., Thiele, S., Müller, J., Schabbel, D., Capraro, B., Reimann, T., Grund, S.; Töpfer, J.: Multilayer ferrite inductors for the use at high temperatures
- Bartsch, H.; Müller, J.; Schober, A.; Witte, H: Thick film technology for impedance characterization
- Brauer, D.; Xu, Y.; Klett, M.; Hampl, J.; Bartsch, H.; Schober, A.; Zhang, Y.: Stem cell differentiation through electrically stimulated cryogels
Kirchhoffbau, Room 1057
Phone: +49 3677 692605
Monday to Thursday: 06:45 h - 11:00 h
Friday: 06:45 h - 10:00 h