Journal articles 2017

  • Stöpel, D.:
    Integration metallorganischer Resinatpasten in niedrigsinternde Mehrlagenkeramiksysteme
    Dissertation, TU Ilmenau, Signatur  ELT ZN 4152 S872
  • Alexandrov, D.; Tot, J.; Dubreuil, R.; Morales, F.; Manuel, J.; Jimenez, J.; Lacroix, B; Garcia, R.; Videkov, V.; Andreev, S.; Tzaneva, B.; Bartsch, H.; Pezoldt, J.; Fischer, M.; Müller, J.:
    Low temperature epitaxial deposition of GaN on LTCC substrates
    2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), pages 48 - 54
  • Bartsch, H.; Mánuel, J.M.; Grieseler, R.:
    Influence of Nanoscaled Surface Modification on the Reaction of Al/Ni Multilayers
    Technologies 2017, 5, 79.,  http://www.mdpi.com/2227-7080/5/4/79
  • Girasek, T.; Pietrikova, A.; Welker, T.; Müller, J.:
    Simulation of Heat Transfer by Cooling Channels in LTCC Substrate
    Acta Electrotechnica et Informationca, Vol. 17, No.2, pp. 11-15, 2017
  • Pietrikova, A.; Girasek, T.; Lukacs, P.; Welker, T.; Müller, J.:
    Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
    Journal of electrical engineering, Band 68, Heft 2, S. 132–137,  https://doi.org/10.1515/jee-2017-0018
  • Jahnke, H.G.; Krinke, D.; Seidel, D.; Lilienthal, K.; Schmidt, S.; Azendorf, R.; Fischer, M.; Mack, T.; Striggow, F.; Althaus, H.; Schober, A.; Robitzki,  A.A:
    A novel 384-multiwell microelectrode array for the impedimetric monitoring of Tau protein induced neurodegenerative processes  
    Biosens Bioelectron 88:78-84, DOI: 10.1016/j.bios.2016.07.074
  • Bartsch, H.; Schulz, A.; Müller, J.; Ebert, A.; Spira, St.; Wollenschläger, F.; Hein, M.:
    Applications of microwave dielectrics
    Microwave materials and applications; Volume 2; Hoboken, NJ: Wiley, 2017, Seite 653-682,
    ISBN 978-1-119-20852-5